公开(公告)号：US20210242139A1

公开(公告)日：2021-08-05

申请号：US16779529

申请日：2020-01-31

申请人： International Business Machines Corporation

发明人： Tuhin Sinha ,  Krishna R. Tunga ,  Brian W. Quinlan ,  Charles Leon Arvin ,  Steven Paul Ostrander ,  Thomas Weiss

IPC分类号： H01L23/00 ,  H01L23/367 ,  H01L23/16 ,  H01L23/14 ,  H01L21/48 ,  H01L23/66 ,  H01L23/538

摘要： A multi-chip module (MCM) package includes an organic laminate substrate; first and second semiconductor device chips that are mounted to a top side of the substrate and that define a chip gap region between opposing edges of the chips; and a stiffener that is embedded in the bottom side of the substrate. The stiffener extends across a stiffening region, which underlies the chip gap region, and does not protrude beyond a bottom side metallization of the substrate.

公开(公告)号：US10901030B2

公开(公告)日：2021-01-26

申请号：US16278905

申请日：2019-02-19

申请人： International Business Machines Corporation

发明人： Max S. Cioban ,  Jonathan Fry ,  Michael Rizzolo ,  Tuhin Sinha

IPC分类号： G01R31/28 ,  G01R3/00 ,  G01R1/073

摘要： An integrated circuit (IC) device, such as a wafer, die, or the like, includes a viscoelastic pad upon a contact. The viscoelastic pad includes a viscoelastic material and an electrically conductive material within the viscoelastic material. The viscoelastic pad provides for a probe needle of an IC device tester to be electrically connected to the IC device contact without the probe needle directly contacting the IC device contact. The viscoelastic pad may be probed multiple instances by the probe needle and may be washed or otherwise removed from the IC device after testing is completed. The viscoelastic pad may be formed upon the IC device by forming the viscoelastic material within a mask, aligning the viscoelastic pad to the IC device contact, and ejecting the viscoelastic material from the mask upon the IC device contact.

公开(公告)号：US20200066669A1

公开(公告)日：2020-02-27

申请号：US16109182

申请日：2018-08-22

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Jonathan Fry ,  Tuhin Sinha ,  Michael Rizzolo ,  Bassem M. Hamieh

IPC分类号： H01L23/00 ,  H01L43/02 ,  H01L23/367 ,  H01L43/12

摘要： A thermal interface material and systems and methods for forming a thermal interface material include depositing a layer of a composite material, including at least a first material and a second material, the first material including a carrier fluid and the second material including a filler particle suspended within the first material. A particle manipulator is positioned over the layer of the composite material, the particle manipulator including at least one emitter to apply a particle manipulating field to bias a movement of the filler particles. The second material is redistributed by applying the particle manipulating field to interact with the second material causing the second material to migrate from a surrounding region in the composite material into a high concentration region in the composite material to form a customized thermal interface such that the high concentration region is configured and positioned corresponding to a hotspot.

公开(公告)号：US20170178982A1

公开(公告)日：2017-06-22

申请号：US14973165

申请日：2015-12-17

申请人： International Business Machines Corporation

发明人： Sushumna Iruvanti ,  Shidong Li ,  Marek A. Orlowski ,  David L. Questad ,  Tuhin Sinha ,  Krishna R. Tunga ,  Thomas A. Wassick ,  Randall J. Werner ,  Jeffrey A. Zitz

IPC分类号： H01L21/66 ,  H01L23/498 ,  H01L21/48 ,  G06F17/50

CPC分类号： H01L22/32 ,  G06F17/5068 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49866 ,  H01L2224/16225 ,  H01L2924/15311

摘要： A laminate includes a plurality of buildup layers disposed on a core and a plurality of unit cells defined in the buildup layers. Each unit cell includes: at least one test via that passes through at least two of the buildup layers and that is electrically connected to testing locations on a probe accessible location of the laminate; and two or more dummy vias disposed in the unit cell. The dummy vias are arranged in the unit cell at one of a plurality of distances from the test via.

公开(公告)号：US10903184B2

公开(公告)日：2021-01-26

申请号：US16109182

申请日：2018-08-22

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Jonathan Fry ,  Tuhin Sinha ,  Michael Rizzolo ,  Bassem M. Hamieh

IPC分类号： H01L23/00 ,  H01L43/02 ,  H01L23/367 ,  H01L43/12

摘要： A thermal interface material and systems and methods for forming a thermal interface material include depositing a layer of a composite material, including at least a first material and a second material, the first material including a carrier fluid and the second material including a filler particle suspended within the first material. A particle manipulator is positioned over the layer of the composite material, the particle manipulator including at least one emitter to apply a particle manipulating field to bias a movement of the filler particles. The second material is redistributed by applying the particle manipulating field to interact with the second material causing the second material to migrate from a surrounding region in the composite material into a high concentration region in the composite material to form a customized thermal interface such that the high concentration region is configured and positioned corresponding to a hotspot.

公开(公告)号：US20200303282A1

公开(公告)日：2020-09-24

申请号：US16358648

申请日：2019-03-19

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Jonathan R. Fry ,  Michael Rizzolo ,  Tuhin Sinha

IPC分类号： H01L23/373

摘要： A semiconductor device that includes a semiconductor substrate having a surface, the surface having several regions having different thermal and/or mechanical requirements; and a composite thermal interface material including several spatially localized thermal interface materials placed on the surface, each of the several thermal interface materials tailored to the different thermal and/or mechanical requirements of each of the regions. Also disclosed is a method of forming the composite thermal interface material.

公开(公告)号：US20200303279A1

公开(公告)日：2020-09-24

申请号：US16357053

申请日：2019-03-18

申请人： International Business Machines Corporation

发明人： Kamal K. Sikka ,  Kenneth Marston ,  Tuhin Sinha ,  Shidong Li

IPC分类号： H01L23/367 ,  H01L23/373

摘要： A heat spreader is disclosed with regions where material is absent to reduce the mass/weight of the heat spreader without substantially reducing the temperature of the semiconductor chip and without substantially affecting the warpage and mechanical stress/strain in the electronic package.

公开(公告)号：US10553503B2

公开(公告)日：2020-02-04

申请号：US15722459

申请日：2017-10-02

申请人： International Business Machines Corporation

发明人： Taryn J. Davis ,  Jonathan R. Fry ,  Tuhin Sinha

IPC分类号： H01L21/66 ,  H01L23/522 ,  H01L21/48 ,  H01L21/54 ,  G01R31/28 ,  H01L21/56

摘要： Flip-chip package reliability monitoring and systems of monitoring using capacitive sensors are disclosed. The monitoring is conducted in situ and in real-time without the need for destructive testing of the packages. The capacitive sensors can be used for flip-chip package reliability monitoring.

公开(公告)号：US10008427B2

公开(公告)日：2018-06-26

申请号：US15615148

申请日：2017-06-06

申请人： International Business Machines Corporation

发明人： Taryn J. Davis ,  Jonathan R. Fry ,  Tuhin Sinha

IPC分类号： H01L23/58 ,  H01L21/66 ,  H01L21/56 ,  H01L21/48 ,  G01N29/06 ,  H01L23/498

CPC分类号： H01L22/34 ,  G01N29/043 ,  G01N29/06 ,  G01N29/0681 ,  G01N2291/101 ,  G01N2291/2697 ,  H01L21/4853 ,  H01L21/563 ,  H01L22/12 ,  H01L22/20 ,  H01L22/26 ,  H01L22/30 ,  H01L23/10 ,  H01L23/13 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/50 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/92125 ,  H01L2225/06596 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/16251 ,  H01L2924/19041 ,  H01L2924/19106 ,  H01L2924/35121

摘要： A method includes forming a flip-chip module including a chip connected to a substrate with a layer of underfill material adhered to the chip and the substrate; sensing chip-packaging interaction failure in the underfilled flip-chip module in situ; reporting in-situ chip-packaging interaction failure to a device in real-time; and imaging the chip-packaging interaction failure with an indirect scanning acoustic microscope.

公开(公告)号：US20170162455A1

公开(公告)日：2017-06-08

申请号：US14962614

申请日：2015-12-08

申请人： International Business Machines Corporation

发明人： Taryn J. Davis ,  Jonathan R. Fry ,  Tuhin Sinha

IPC分类号： H01L21/66 ,  G01R31/28 ,  H01L21/54 ,  H01L23/522 ,  H01L21/48

CPC分类号： H01L22/14 ,  G01R31/2853 ,  H01L21/4853 ,  H01L21/54 ,  H01L21/563 ,  H01L22/34 ,  H01L23/5222 ,  H01L23/5223 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00

摘要： Flip-chip package reliability monitoring and systems of monitoring using capacitive sensors are disclosed. The monitoring is conducted in situ and in real-time without the need for destructive testing of the packages. The capacitive sensors can be used for flip-chip package reliability monitoring.