公开(公告)号：US12002697B2

公开(公告)日：2024-06-04

申请号：US17042755

申请日：2019-03-22

申请人： Soitec ,  Commissariat A L'Energie Atomique et aux Énergies Alternatives

发明人： François Rieutord ,  Frédéric Mazen ,  Didier Landru ,  Oleg Kononchuk ,  Nadia Ben Mohamed

IPC分类号： H01L21/67 ,  G01N29/14 ,  G01N29/46 ,  H01L21/66

CPC分类号： H01L21/67288 ,  G01N29/14 ,  G01N29/46 ,  H01L21/67109 ,  H01L22/12 ,  G01N2291/2697

摘要： A method for monitoring a heat treatment applied to a substrate comprising a weakened zone formed by implanting atomic species for splitting the substrate along the weakened zone, the substrate being arranged in a heating chamber, the method comprising recording sound in the interior or in the vicinity of the heating chamber and detecting, in the recording, a sound emitted by the substrate during the splitting thereof along the weakened zone. A device for the heat treatment of a batch of substrates comprises an annealing furnace comprising a heating chamber intended to receive the batch, at least one microphone configured to record sounds in the interior or in the vicinity of the heating chamber, and a processing system configured to detect, in an audio recording produced by the microphone, a sound emitted when a substrate splits.

公开(公告)号：US20230375507A1

公开(公告)日：2023-11-23

申请号：US18198221

申请日：2023-05-16

申请人： Hitachi Power Solutions Co., Ltd.

发明人： Shigeru OHNO ,  Kazuhiro NODA ,  Kotaro KIKUKAWA ,  Natsuki SUGAYA

IPC分类号： G01N29/06 ,  G01N29/265

CPC分类号： G01N29/0654 ,  G01N29/265 ,  G01N2291/2697

摘要： An ultrasound image apparatus irradiates a bonded wafer in which two or more wafers are bonded with an ultrasonic wave to generate an image of the bonded surface between the wafers. An ultrasonic probe irradiates the bonded wafer with the ultrasonic wave on a lower side of the bonded wafer. A liquid ejection unit moves together with the ultrasonic probe while continuously ejecting a liquid toward a bottom surface such that a liquid film in contact with the bottom surface is formed between the liquid ejection unit and the bottom surface of the bonded wafer. Also, a gas ejection device ejects gas for pushing down the liquid toward an outer peripheral end portion of the bonded wafer so that the liquid ejected from the liquid ejection unit does not infiltrate into the bonded surface from the outer peripheral end portion of the bonded wafer.

公开(公告)号：US11761929B2

公开(公告)日：2023-09-19

申请号：US17251533

申请日：2019-05-29

申请人： ASML Netherlands B.V.

发明人： Alessandro Polo

IPC分类号： G01N29/07 ,  G01N29/22 ,  G01N29/24 ,  G01N29/28 ,  G03F9/00

CPC分类号： G01N29/07 ,  G01N29/221 ,  G01N29/2418 ,  G01N29/28 ,  G03F9/7053 ,  G03F9/7084 ,  G03F9/7088 ,  G01N2291/044 ,  G01N2291/2697

摘要： A sensor apparatus comprising an acoustic assembly arranged to transmit an acoustic signal to a substrate and receive at least part of the acoustic signal after the acoustic signal has interacted with the substrate, a transducer arranged to convert the at least part of the acoustic signal to an electronic signal, and, a processor configured to receive the electronic signal and determine both a topography of at least part of the substrate and a position of a target of the substrate based on the electronic signal. The sensor apparatus may for part of a lithographic apparatus or a metrology apparatus.

公开(公告)号：US20180240708A1

公开(公告)日：2018-08-23

申请号：US15900247

申请日：2018-02-20

申请人： DISCO CORPORATION

发明人： Hiroshi Morikazu ,  Noboru Takeda

IPC分类号： H01L21/78 ,  H01L21/687 ,  H01L21/304 ,  G01N29/06

CPC分类号： H01L21/78 ,  G01N21/9505 ,  G01N29/0654 ,  G01N2291/2697 ,  H01L21/304 ,  H01L21/67092 ,  H01L21/67288 ,  H01L21/681 ,  H01L21/68714 ,  H01L22/12 ,  H01L22/20

摘要： A processing method for a wafer including a crack detection step for irradiating illumination of a wavelength transparent to wafer, picking up an image of the wafer, and detecting whether a crack is generated within the wafer, a crack direction verification step for verifying, when a crack is detected, to which one of the first and second directions a direction in which the crack extends is nearer, a first cutting step for positioning the cutting blade to a scheduled division line of a direction decided to be a direction farther from the direction in which the crack extends from between the first and second directions and cutting the scheduled division line, and next a second cutting step for positioning the cutting blade to a scheduled division line of a direction decided to be nearer to the direction in which the crack extends and cutting the scheduled division line.

公开(公告)号：US10008424B2

公开(公告)日：2018-06-26

申请号：US15053237

申请日：2016-02-25

申请人： EV Group E. Thallner GmbH

发明人： Markus Wimplinger

IPC分类号： G01N29/00 ,  H01L21/66 ,  G01B7/06 ,  G01B11/06 ,  G01B17/02 ,  G01N29/04 ,  G01N29/265 ,  G01N29/27 ,  G01N29/275 ,  H01L21/67 ,  G01N21/95

CPC分类号： H01L22/20 ,  G01B7/06 ,  G01B11/0625 ,  G01B11/2441 ,  G01B17/02 ,  G01B17/025 ,  G01N21/9501 ,  G01N21/9505 ,  G01N29/043 ,  G01N29/265 ,  G01N29/27 ,  G01N29/275 ,  G01N2291/0231 ,  G01N2291/02854 ,  G01N2291/0289 ,  G01N2291/044 ,  G01N2291/2697 ,  H01L21/67253 ,  H01L21/67288 ,  H01L22/12

摘要： A method for measuring and/or acquiring layer thicknesses and voids of one or more layers of a temporary bonded wafer stack on a plurality of measuring points is provided. A sequence of the method includes an arrangement of a measurement means for measuring and/or acquiring the layer thicknesses and voids of the layers of the wafer stack at the measuring points relative to a flat side of the wafer stack. The sequence further includes an emission of signals in the form of electromagnetic waves by a transmitter of the measurement means, and a receiving the signals which have been reflected by the wafer stack by a receiver of the measurement means. The sequence also includes an evaluation of the signals which have been received by the receiver by an evaluation unit.

公开(公告)号：US09970993B1

公开(公告)日：2018-05-15

申请号：US15434443

申请日：2017-02-16

申请人： Ford Global Technologies, LLC

发明人： Arnold Kweku Mensah-Brown ,  Xinfan Lin ,  Benjamin A. Tabatowski-Bush ,  Richard Dyche Anderson

IPC分类号： H01M4/00 ,  H01M4/14 ,  H02P27/00 ,  G01R31/36 ,  B60L11/18 ,  G01N29/22 ,  G01N29/24 ,  B60L11/14 ,  B60R16/02 ,  H01M10/48 ,  H01M2/10 ,  H01M10/42

CPC分类号： G01R31/3679 ,  B60L11/14 ,  B60L11/1861 ,  B60L11/1864 ,  B60L2210/10 ,  B60L2240/42 ,  B60L2240/545 ,  B60Y2400/112 ,  G01N29/2412 ,  G01N29/2481 ,  G01N2291/02863 ,  G01N2291/02881 ,  G01N2291/0423 ,  G01N2291/045 ,  G01N2291/2697 ,  G01R31/44 ,  H01M10/48 ,  H01M10/486 ,  H01M2220/20 ,  Y10S903/907

摘要： Systems and methods for sensing internal states of vehicle batteries are described. From this internal state information, various physical characteristics of the battery can be measured, calculated or inferred. A vehicle can include an electric motor, a battery to store electrical energy for the electric motor, and a sensor connected to the battery to sense a battery state, to receive an input signal, and to wirelessly transmit an output signal indicating the battery state. The sensor may be passive and built into the structure of the battery. The sensor can be a surface wave acoustic sensor with a magnetic field sensor, which can be a magnetoimpedance sensing device and a temperature sensor.

公开(公告)号：US20180120261A1

公开(公告)日：2018-05-03

申请号：US15799532

申请日：2017-10-31

申请人： Feasible, Inc.

发明人： Andrew Gaheem HSIEH ,  Barry James VAN TASSELL ,  Daniel Artemis STEINGART ,  Shaurjo BISWAS ,  Robert Charles MOHR

IPC分类号： G01N29/04 ,  G01N29/26

CPC分类号： G01N29/04 ,  B60L50/64 ,  B60L58/10 ,  G01N29/043 ,  G01N29/0672 ,  G01N29/07 ,  G01N29/11 ,  G01N29/262 ,  G01N29/4418 ,  G01N29/4472 ,  G01N29/52 ,  G01N2291/02818 ,  G01N2291/02854 ,  G01N2291/02863 ,  G01N2291/02881 ,  G01N2291/0289 ,  G01N2291/044 ,  G01N2291/048 ,  G01N2291/106 ,  G01N2291/2697 ,  G01R31/382

摘要： Systems and methods for analyzing physical characteristics of a battery include arrangements of two or more transducers coupled to the battery. A control module controls one or more of the two or more transducers to transmit acoustic signals through at least a portion of the battery, and one or more of the two or more transducers to receive response acoustic signals. Distribution of physical properties of the battery is determined based at least on the transmitted acoustic signals and the response acoustic signals.

公开(公告)号：US09170236B2

公开(公告)日：2015-10-27

申请号：US13304125

申请日：2011-11-23

申请人： Lawrence W. Kessler ,  Michael G. Oravecz ,  Thomas Kleinschmidt ,  John Billone ,  Bryan P. Schackmuth ,  Joachim Minkwitz ,  Igor Komsky

发明人： Lawrence W. Kessler ,  Michael G. Oravecz ,  Thomas Kleinschmidt ,  John Billone ,  Bryan P. Schackmuth ,  Joachim Minkwitz ,  Igor Komsky

IPC分类号： G01N29/265 ,  G01N29/06 ,  G01N29/28

CPC分类号： G01N29/0681 ,  G01N29/265 ,  G01N29/28 ,  G01N2291/101 ,  G01N2291/2697

摘要： A scanning acoustic microscope comprises a structure including a loading portion and a scanning portion, a transducer disposed in the scanning portion and operable to develop ultrasonic energy, and a controller. A driver is responsive to the controller and is capable of moving the transducer along a scan path with respect to a first plurality of parts disposed in the scanning portion as a second plurality of parts are being loaded into the loading portion.

摘要翻译： 扫描型声学显微镜包括：装载部和扫描部的结构，设置在扫描部中并可操作以发展超声能量的换能器以及控制器。 驱动器响应于控制器并且能够相对于设置在扫描部分中的第一多个部件沿着扫描路径移动换能器，随着第二多个部件被装载到装载部分中。

公开(公告)号：US09140669B2

公开(公告)日：2015-09-22

申请号：US14510309

申请日：2014-10-09

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Jerome L. Cann ,  David P. Vallett

IPC分类号： H01L29/84 ,  G01N29/04 ,  H01L21/66 ,  G01R31/28 ,  G01N33/00

CPC分类号： G01N29/04 ,  G01K11/265 ,  G01N29/07 ,  G01N29/2475 ,  G01N29/4427 ,  G01N33/00 ,  G01N2033/0095 ,  G01N2291/023 ,  G01N2291/02818 ,  G01N2291/02881 ,  G01N2291/0423 ,  G01N2291/101 ,  G01N2291/106 ,  G01N2291/2697 ,  G01R31/2831 ,  H01L22/34

摘要： A method and system to map density and temperature of a chip, in situ, is disclosed. The method includes measuring a propagation time that a mechanical propagation wave travels along at least one predefined path in a substrate. The method further includes calculating an average substrate density and temperature along the at least one predefined path as a function of the propagation time and distance. The method further includes determining a defect or unauthorized modification in the substrate based on the average substrate density being different than a baseline substrate density.

公开(公告)号：US20140273293A1

公开(公告)日：2014-09-18

申请号：US14216324

申请日：2014-03-17

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Hsu-Shui Liu ,  Yeh-Chieh Wang ,  Jiun-Rong Pai

IPC分类号： G05B19/418 ,  H01L21/66

CPC分类号： G05B19/418 ,  G01N29/14 ,  G01N29/226 ,  G01N29/2481 ,  G01N29/449 ,  G01N29/46 ,  G01N2291/2697 ,  H01L22/26 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present disclosure provides an apparatus for fabricating a semiconductor device. The apparatus includes a portable device. The portable device includes first and second sensors that respectively measure first and second fabrication process parameters. The first fabrication process parameter is different from the second fabrication process parameter. The portable device also includes a wireless transceiver that is coupled to the first and second sensors. The wireless transceiver receives the first and second fabrication process parameters and transmits wireless signals containing the first and second fabrication process parameters.

摘要翻译： 本公开提供了一种用于制造半导体器件的装置。 该装置包括便携式装置。 便携式设备包括分别测量第一和第二制造工艺参数的第一和第二传感器。 第一制造工艺参数与第二制造工艺参数不同。 便携式设备还包括耦合到第一和第二传感器的无线收发器。 无线收发器接收第一和第二制造工艺参数，并发送包含第一和第二制造工艺参数的无线信号。