- 专利标题： Method and structure for flip-chip package reliability monitoring using capacitive sensors groups
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申请号： US15722459申请日： 2017-10-02
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公开(公告)号： US10553503B2公开(公告)日： 2020-02-04
- 发明人: Taryn J. Davis , Jonathan R. Fry , Tuhin Sinha
- 申请人： International Business Machines Corporation
- 申请人地址： US NY Armonk
- 专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址： US NY Armonk
- 代理机构： Cantor Colburn LLP
- 代理商 Alvin Borromeo
- 主分类号： H01L21/66
- IPC分类号： H01L21/66 ; H01L23/522 ; H01L21/48 ; H01L21/54 ; G01R31/28 ; H01L21/56
摘要：
Flip-chip package reliability monitoring and systems of monitoring using capacitive sensors are disclosed. The monitoring is conducted in situ and in real-time without the need for destructive testing of the packages. The capacitive sensors can be used for flip-chip package reliability monitoring.
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