- 专利标题： Scanning acoustic microscope sensor array for chip-packaging interaction package reliability monitoring
-
申请号： US15615148申请日： 2017-06-06
-
公开(公告)号： US10008427B2公开(公告)日： 2018-06-26
- 发明人: Taryn J. Davis , Jonathan R. Fry , Tuhin Sinha
- 申请人： International Business Machines Corporation
- 申请人地址： US NY Armonk
- 专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址： US NY Armonk
- 代理机构： Cantor Colburn LLP
- 代理商 Steven Meyers
- 主分类号： H01L23/58
- IPC分类号： H01L23/58 ; H01L21/66 ; H01L21/56 ; H01L21/48 ; G01N29/06 ; H01L23/498
摘要：
A method includes forming a flip-chip module including a chip connected to a substrate with a layer of underfill material adhered to the chip and the substrate; sensing chip-packaging interaction failure in the underfilled flip-chip module in situ; reporting in-situ chip-packaging interaction failure to a device in real-time; and imaging the chip-packaging interaction failure with an indirect scanning acoustic microscope.
公开/授权文献
信息查询
IPC分类:
