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公开(公告)号：US11228124B1
公开(公告)日：2022-01-18
申请号：US17140534
申请日：2021-01-04
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Mark K. Hoffmeyer , Steven P. Ostrander , Thomas Weiss , Thomas E. Lombardi
Abstract: In some embodiments, connecting a component to a substrate by adhesion to an oxidized solder surface includes: forming one or more conductive solder connections between the component and one or more conductive portions of the substrate; adhering the component to an oxidized surface of a solder portion applied to the substrate.
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公开(公告)号：US10014273B2
公开(公告)日：2018-07-03
申请号：US15215640
申请日：2016-07-21
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Thomas E. Lombardi , Donald Merte , Gregg B. Monjeau , David L. Questad , Son K. Tran
IPC: B23K3/08 , H01L23/00 , H01L21/56 , B23K1/00 , H01L21/48 , H01L23/498 , B23K101/40
CPC classification number: H01L24/81 , B23K1/0016 , B23K3/087 , B23K2101/40 , H01L21/4846 , H01L21/565 , H01L21/566 , H01L21/568 , H01L23/49894 , H01L24/01 , H01L24/13 , H01L24/16 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/81001 , H01L2224/81191 , H01L2224/8121 , H01L2224/81815 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01076 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/19041 , H01L2924/19105 , H01L2924/3511 , H01L2924/3512 , H01L2924/35121 , Y10T29/49117 , H01L2924/00
Abstract: A fixture assembly and method of forming a chip assembly is provided. The fixture assembly includes a first plate having an opening sized to accommodate a chip mounted on a laminate. The fixture assembly further includes a second plate mated to the first plate by at least one mechanical fastening mechanism. The fixture assembly further includes a space defined by facing surfaces of the first plate and the second plate and confined by a raised stepped portion of at least one of the first plate and the second plate. The space is coincident with the opening. The space is sized and shaped such that the laminate is confined within the space and directly abuts the stepped portion and the facing surfaces of the first plate and the second plate to be confined in X, Y and Z directions.
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公开(公告)号：US20170196089A1
公开(公告)日：2017-07-06
申请号：US15466442
申请日：2017-03-22
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Michael A. Gaynes , Jeffrey D. Gelorme , Robert P. Kuder, II , Daniel J. Littrell , Thomas E. Lombardi , Marie-Claude Paquet , Frank L. Pompeo , David L. Questad , James Speidell , Sri M. Sri-Jayantha , Son K. Tran
CPC classification number: H05K1/18 , H01L23/12 , H01R4/02 , H01R12/51 , H01R12/7041 , H01R43/205 , H05K1/0271 , H05K1/181 , H05K3/30 , H05K3/305 , H05K3/366 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10106 , H05K2201/10159 , H05K2201/10166 , H05K2201/10977
Abstract: An interconnect structure that includes a component circuit board containing a plurality of electrical components, and a wafer connector assembly. The wafer connector assembly includes a plurality of interconnect circuit boards that are in electrical connection with the components circuit board through a plurality of rows of solder joints, the plurality of interconnect circuit boards having a connection end including at least one contact. An adhesive is present structurally reinforcing at least a row of the solder joints that is proximate to the connection end of the plurality of interconnect circuit boards of the wafer assembly.
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公开(公告)号：US09673177B1
公开(公告)日：2017-06-06
申请号：US14969905
申请日：2015-12-15
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Benjamin V. Fasano , Mark W. Kapfhammer , David J. Lewison , Thomas E. Lombardi , Thomas Weiss
IPC: H01L23/31 , H01L25/065 , H01L25/00
CPC classification number: H01L25/0657 , H01L25/50 , H01L2225/06513
Abstract: A technique relates to forming a chip assembly. Top and bottom chip stack elements containing solder pads and a solder material are provided. Soluble standoffs are applied to the bottom chip stack element. The chip stack elements are aligned to bring the top solder pad in proximity to the bottom solder pad and the temperature is raised to a temperature above the melting temperature of the solder material to form a connected chip assembly. The connected chip assembly is cooled to re-solidify the solder material and soluble standoffs are removed from the connected chip assembly.
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公开(公告)号：US09455234B2
公开(公告)日：2016-09-27
申请号：US14217537
申请日：2014-03-18
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Thomas E. Lombardi , Donald Merte , Gregg B. Monjeau , David L. Questad , Son K. Tran
CPC classification number: H01L24/81 , B23K1/0016 , B23K3/087 , B23K2101/40 , H01L21/4846 , H01L21/565 , H01L21/566 , H01L21/568 , H01L23/49894 , H01L24/01 , H01L24/13 , H01L24/16 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/81001 , H01L2224/81191 , H01L2224/8121 , H01L2224/81815 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01076 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/19041 , H01L2924/19105 , H01L2924/3511 , H01L2924/3512 , H01L2924/35121 , Y10T29/41 , Y10T29/49117 , H01L2924/00
Abstract: A fixture assembly and method of forming a chip assembly is provided. The fixture assembly includes a first plate having an opening sized to accommodate a chip mounted on a laminate. The fixture assembly further includes a second plate mated to the first plate by at least one mechanical fastening mechanism. The fixture assembly further includes a space defined by facing surfaces of the first plate and the second plate and confined by a raised stepped portion of at least one of the first plate and the second plate. The space is coincident with the opening. The space is sized and shaped such that the laminate is confined within the space and directly abuts the stepped portion and the facing surfaces of the first plate and the second plate to be confined in X, Y and Z directions.
Abstract translation: 提供了一种形成芯片组件的固定装置和方法。 夹具组件包括具有开口尺寸以容纳安装在层压板上的芯片的第一板。 固定装置还包括通过至少一个机械紧固机构配合到第一板的第二板。 夹具组件还包括由第一板和第二板的相对表面限定的并由第一板和第二板中的至少一个的凸起台阶部限定的空间。 这个空间与开幕式一致。 该空间的尺寸和形状使得层压体被限制在空间内并且直接邻接第一板和第二板的阶梯部分和相对表面以被限制在X，Y和Z方向上。
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Patent Agency Ranking
公开(公告)号：US20190295921A1
公开(公告)日：2019-09-26
申请号：US15934972
申请日：2018-03-24
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Charles L. Arvin , Marcus E. Interrante , Thomas E. Lombardi , Hilton T. Toy , Krishna R. Tunga , Thomas Weiss
IPC: H01L23/373 , H05K1/02 , H01L23/42 , H01L23/538 , H01L23/00
Abstract: A method of managing thermal warpage of a laminate which includes: assembling a stiffener and an adhesive on the laminate, the stiffener being a material that has a higher modulus of elasticity than the laminate; applying a force to deform the laminate a predetermined amount; heating the laminate, stiffener and adhesive to a predetermined temperature at which the adhesive cures to bond the stiffener to the laminate; cooling the laminate, stiffener and adhesive to a temperature below the predetermined temperature, the laminate maintaining its deformed shape.
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公开(公告)号：US20180213645A1
公开(公告)日：2018-07-26
申请号：US15928874
申请日：2018-03-22
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Michael A. Gaynes , Jeffrey D. Gelorme , Robert P. Kuder, II , Daniel J. Littrell , Thomas E. Lombardi , Marie-Claude Paquet , Frank L. Pompeo , David L. Questad , James Speidell , Sri M. Sri-Jayantha , Son K. Tran
CPC classification number: H05K1/18 , H01R4/02 , H01R12/51 , H01R12/7041 , H01R43/205 , H05K1/0271 , H05K1/181 , H05K3/30 , H05K3/305 , H05K3/366 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10106 , H05K2201/10159 , H05K2201/10166 , H05K2201/10977
Abstract: An interconnect structure that includes a component circuit board containing a plurality of electrical components, and a wafer connector assembly. The wafer connector assembly includes a plurality of interconnect circuit boards that are in electrical connection with the components circuit board through a plurality of rows of solder joints, the plurality of interconnect circuit boards having a connection end including at least one contact. An adhesive is present structurally reinforcing at least a row of the solder joints that is proximate to the connection end of the plurality of interconnect circuit boards of the wafer assembly.
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公开(公告)号：US10985129B2
公开(公告)日：2021-04-20
申请号：US16384148
申请日：2019-04-15
Applicant: International Business Machines Corporation
Inventor： Thomas E. Lombardi , Steve Ostrander , Krishna R. Tunga , Thomas A. Wassick
Abstract: Multiple integrated circuit (IC) devices are connected to a top side metallization surface of a multi IC device carrier. The carrier includes resin based substrate layers and associated wiring line layers. To reduce stain of the resin layers, especially in region(s) within the carrier between the IC devices, a stiffener or stiffeners are applied to the back side metallization (BSM) surface of the IC device carrier. The stiffener(s) reduce the amount of curvature of the IC device carrier and reduce the strain seen by the resin layer(s), thereby mitigating the risk for cracks forming and expanding within the resin layers.
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公开(公告)号：US10832987B2
公开(公告)日：2020-11-10
申请号：US15934972
申请日：2018-03-24
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Charles L. Arvin , Marcus E. Interrante , Thomas E. Lombardi , Hilton T. Toy , Krishna R. Tunga , Thomas Weiss
IPC: H01L23/373 , H05K1/02 , H01L23/42 , H01L23/538 , H01L23/00
Abstract: A method of managing thermal warpage of a laminate which includes: assembling a stiffener and an adhesive on the laminate, the stiffener being a material that has a higher modulus of elasticity than the laminate; applying a force to deform the laminate a predetermined amount; heating the laminate, stiffener and adhesive to a predetermined temperature at which the adhesive cures to bond the stiffener to the laminate; cooling the laminate, stiffener and adhesive to a temperature below the predetermined temperature, the laminate maintaining its deformed shape.
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公开(公告)号：US20200328177A1
公开(公告)日：2020-10-15
申请号：US16384148
申请日：2019-04-15
Applicant: International Business Machines Corporation
Inventor： Thomas E. Lombardi , Steve Ostrander , Krishna R. Tunga , Thomas A. Wassick
Abstract: Multiple integrated circuit (IC) devices are connected to a top side metallization surface of a multi IC device carrier. The carrier includes resin based substrate layers and associated wiring line layers. To reduce stain of the resin layers, especially in region(s) within the carrier between the IC devices, a stiffener or stiffeners are applied to the back side metallization (BSM) surface of the IC device carrier. The stiffener(s) reduce the amount of curvature of the IC device carrier and reduce the strain seen by the resin layer(s), thereby mitigating the risk for cracks forming and expanding within the resin layers.
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