公开(公告)号：US10368441B2

公开(公告)日：2019-07-30

申请号：US15928874

申请日：2018-03-22

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Michael A. Gaynes ,  Jeffrey D. Gelorme ,  Robert P. Kuder, II ,  Daniel J. Littrell ,  Thomas E. Lombardi ,  Marie-Claude Paquet ,  Frank L. Pompeo ,  David L. Questad ,  James Speidell ,  Sri M. Sri-Jayantha ,  Son K. Tran

IPC: H01R13/405 ,  H01R43/24 ,  H05K1/18 ,  H01R12/51 ,  H01R43/20 ,  H05K3/30 ,  H01R12/70 ,  H05K3/36 ,  H01R4/02 ,  H05K1/02

Abstract: An interconnect structure that includes a component circuit board containing a plurality of electrical components, and a wafer connector assembly. The wafer connector assembly includes a plurality of interconnect circuit boards that are in electrical connection with the components circuit board through a plurality of rows of solder joints, the plurality of interconnect circuit boards having a connection end including at least one contact. An adhesive is present structurally reinforcing at least a row of the solder joints that is proximate to the connection end of the plurality of interconnect circuit boards of the wafer assembly.

公开(公告)号：US09627784B1

公开(公告)日：2017-04-18

申请号：US14955466

申请日：2015-12-01

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Michael A. Gaynes ,  Jeffrey D. Gelorme ,  Robert P. Kuder, II ,  Daniel J. Littrell ,  Thomas E. Lombardi ,  Marie-Claude Paquet ,  Frank L. Pompeo ,  David L. Questad ,  James Speidell ,  Sri M. Sri-Jayantha ,  Son K. Tran

IPC: H01R12/51 ,  H01R43/24 ,  H05K1/18 ,  H01R43/20 ,  H05K3/30 ,  H01R13/405

CPC classification number: H05K1/18 ,  H01L23/12 ,  H01R4/02 ,  H01R12/51 ,  H01R12/7041 ,  H01R43/205 ,  H05K1/0271 ,  H05K1/181 ,  H05K3/30 ,  H05K3/305 ,  H05K3/366 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10106 ,  H05K2201/10159 ,  H05K2201/10166 ,  H05K2201/10977

Abstract: An interconnect structure that includes a component circuit board containing a plurality of electrical components, and a wafer connector assembly. The wafer connector assembly includes a plurality of interconnect circuit boards that are in electrical connection with the components circuit board through a plurality of rows of solder joints, the plurality of interconnect circuit boards having a connection end including at least one contact. An adhesive is present structurally reinforcing at least a row of the solder joints that is proximate to the connection end of the plurality of interconnect circuit boards of the wafer assembly.

公开(公告)号：US20180213645A1

公开(公告)日：2018-07-26

申请号：US15928874

申请日：2018-03-22

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Michael A. Gaynes ,  Jeffrey D. Gelorme ,  Robert P. Kuder, II ,  Daniel J. Littrell ,  Thomas E. Lombardi ,  Marie-Claude Paquet ,  Frank L. Pompeo ,  David L. Questad ,  James Speidell ,  Sri M. Sri-Jayantha ,  Son K. Tran

IPC: H05K1/18 ,  H05K3/30 ,  H01R4/02

CPC classification number: H05K1/18 ,  H01R4/02 ,  H01R12/51 ,  H01R12/7041 ,  H01R43/205 ,  H05K1/0271 ,  H05K1/181 ,  H05K3/30 ,  H05K3/305 ,  H05K3/366 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10106 ,  H05K2201/10159 ,  H05K2201/10166 ,  H05K2201/10977

Abstract: An interconnect structure that includes a component circuit board containing a plurality of electrical components, and a wafer connector assembly. The wafer connector assembly includes a plurality of interconnect circuit boards that are in electrical connection with the components circuit board through a plurality of rows of solder joints, the plurality of interconnect circuit boards having a connection end including at least one contact. An adhesive is present structurally reinforcing at least a row of the solder joints that is proximate to the connection end of the plurality of interconnect circuit boards of the wafer assembly.

公开(公告)号：US20170196089A1

公开(公告)日：2017-07-06

申请号：US15466442

申请日：2017-03-22

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Michael A. Gaynes ,  Jeffrey D. Gelorme ,  Robert P. Kuder, II ,  Daniel J. Littrell ,  Thomas E. Lombardi ,  Marie-Claude Paquet ,  Frank L. Pompeo ,  David L. Questad ,  James Speidell ,  Sri M. Sri-Jayantha ,  Son K. Tran

IPC: H05K1/18 ,  H05K3/30 ,  H01R4/02

CPC classification number: H05K1/18 ,  H01L23/12 ,  H01R4/02 ,  H01R12/51 ,  H01R12/7041 ,  H01R43/205 ,  H05K1/0271 ,  H05K1/181 ,  H05K3/30 ,  H05K3/305 ,  H05K3/366 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10106 ,  H05K2201/10159 ,  H05K2201/10166 ,  H05K2201/10977

Abstract: An interconnect structure that includes a component circuit board containing a plurality of electrical components, and a wafer connector assembly. The wafer connector assembly includes a plurality of interconnect circuit boards that are in electrical connection with the components circuit board through a plurality of rows of solder joints, the plurality of interconnect circuit boards having a connection end including at least one contact. An adhesive is present structurally reinforcing at least a row of the solder joints that is proximate to the connection end of the plurality of interconnect circuit boards of the wafer assembly.

公开(公告)号：US10750615B2

公开(公告)日：2020-08-18

申请号：US16423565

申请日：2019-05-28

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Michael A. Gaynes ,  Jeffrey D. Gelorme ,  Robert P. Kuder, II ,  Daniel J. Littrell ,  Thomas E. Lombardi ,  Marie-Claude Paquet ,  Frank L. Pompeo ,  David L. Questad ,  James Speidell ,  Sri M. Sri-Jayantha ,  Son K. Tran

IPC: H05K1/18 ,  H01R12/51 ,  H01R43/20 ,  H05K3/30 ,  H01R12/70 ,  H05K3/36 ,  H01R4/02 ,  H05K1/02

Abstract: An interconnect structure that includes a component circuit board containing a plurality of electrical components, and a wafer connector assembly. The wafer connector assembly includes a plurality of interconnect circuit boards that are in electrical connection with the components circuit board through a plurality of rows of solder joints, the plurality of interconnect circuit boards having a connection end including at least one contact. An adhesive is present structurally reinforcing at least a row of the solder joints that is proximate to the connection end of the plurality of interconnect circuit boards of the wafer assembly.

公开(公告)号：US20190281702A1

公开(公告)日：2019-09-12

申请号：US16423565

申请日：2019-05-28

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Michael A. Gaynes ,  Jeffrey D. Gelorme ,  Robert P. Kuder, II ,  Daniel J. Littrell ,  Thomas E. Lombardi ,  Marie-Claude Paquet ,  Frank L. Pompeo ,  David L. Questad ,  James Speidell ,  Sri M. Sri-Jayantha ,  Son K. Tran

IPC: H05K1/18 ,  H05K3/30 ,  H05K3/36 ,  H01R12/70 ,  H01R4/02 ,  H01R12/51 ,  H01R43/20

Abstract: An interconnect structure that includes a component circuit board containing a plurality of electrical components, and a wafer connector assembly. The wafer connector assembly includes a plurality of interconnect circuit boards that are in electrical connection with the components circuit board through a plurality of rows of solder joints, the plurality of interconnect circuit boards having a connection end including at least one contact. An adhesive is present structurally reinforcing at least a row of the solder joints that is proximate to the connection end of the plurality of interconnect circuit boards of the wafer assembly.

公开(公告)号：US09974179B2

公开(公告)日：2018-05-15

申请号：US15466442

申请日：2017-03-22

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Michael A. Gaynes ,  Jeffrey D. Gelorme ,  Robert P. Kuder, II ,  Daniel J. Littrell ,  Thomas E. Lombardi ,  Marie-Claude Paquet ,  Frank L. Pompeo ,  David L. Questad ,  James Speidell ,  Sri M. Sri-Jayantha ,  Son K. Tran

IPC: H01R13/405 ,  H01R43/24 ,  H05K1/18 ,  H01R4/02 ,  H05K3/30

CPC classification number: H05K1/18 ,  H01L23/12 ,  H01R4/02 ,  H01R12/51 ,  H01R12/7041 ,  H01R43/205 ,  H05K1/0271 ,  H05K1/181 ,  H05K3/30 ,  H05K3/305 ,  H05K3/366 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10106 ,  H05K2201/10159 ,  H05K2201/10166 ,  H05K2201/10977

Abstract: An interconnect structure that includes a component circuit board containing a plurality of electrical components, and a wafer connector assembly. The wafer connector assembly includes a plurality of interconnect circuit boards that are in electrical connection with the components circuit board through a plurality of rows of solder joints, the plurality of interconnect circuit boards having a connection end including at least one contact. An adhesive is present structurally reinforcing at least a row of the solder joints that is proximate to the connection end of the plurality of interconnect circuit boards of the wafer assembly.