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公开(公告)号：US10368441B2
公开(公告)日：2019-07-30
申请号：US15928874
申请日：2018-03-22
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Michael A. Gaynes , Jeffrey D. Gelorme , Robert P. Kuder, II , Daniel J. Littrell , Thomas E. Lombardi , Marie-Claude Paquet , Frank L. Pompeo , David L. Questad , James Speidell , Sri M. Sri-Jayantha , Son K. Tran
IPC: H01R13/405 , H01R43/24 , H05K1/18 , H01R12/51 , H01R43/20 , H05K3/30 , H01R12/70 , H05K3/36 , H01R4/02 , H05K1/02
Abstract: An interconnect structure that includes a component circuit board containing a plurality of electrical components, and a wafer connector assembly. The wafer connector assembly includes a plurality of interconnect circuit boards that are in electrical connection with the components circuit board through a plurality of rows of solder joints, the plurality of interconnect circuit boards having a connection end including at least one contact. An adhesive is present structurally reinforcing at least a row of the solder joints that is proximate to the connection end of the plurality of interconnect circuit boards of the wafer assembly.
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公开(公告)号：US09627784B1
公开(公告)日：2017-04-18
申请号：US14955466
申请日：2015-12-01
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Michael A. Gaynes , Jeffrey D. Gelorme , Robert P. Kuder, II , Daniel J. Littrell , Thomas E. Lombardi , Marie-Claude Paquet , Frank L. Pompeo , David L. Questad , James Speidell , Sri M. Sri-Jayantha , Son K. Tran
CPC classification number: H05K1/18 , H01L23/12 , H01R4/02 , H01R12/51 , H01R12/7041 , H01R43/205 , H05K1/0271 , H05K1/181 , H05K3/30 , H05K3/305 , H05K3/366 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10106 , H05K2201/10159 , H05K2201/10166 , H05K2201/10977
Abstract: An interconnect structure that includes a component circuit board containing a plurality of electrical components, and a wafer connector assembly. The wafer connector assembly includes a plurality of interconnect circuit boards that are in electrical connection with the components circuit board through a plurality of rows of solder joints, the plurality of interconnect circuit boards having a connection end including at least one contact. An adhesive is present structurally reinforcing at least a row of the solder joints that is proximate to the connection end of the plurality of interconnect circuit boards of the wafer assembly.
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公开(公告)号：US20170196089A1
公开(公告)日：2017-07-06
申请号：US15466442
申请日：2017-03-22
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Michael A. Gaynes , Jeffrey D. Gelorme , Robert P. Kuder, II , Daniel J. Littrell , Thomas E. Lombardi , Marie-Claude Paquet , Frank L. Pompeo , David L. Questad , James Speidell , Sri M. Sri-Jayantha , Son K. Tran
CPC classification number: H05K1/18 , H01L23/12 , H01R4/02 , H01R12/51 , H01R12/7041 , H01R43/205 , H05K1/0271 , H05K1/181 , H05K3/30 , H05K3/305 , H05K3/366 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10106 , H05K2201/10159 , H05K2201/10166 , H05K2201/10977
Abstract: An interconnect structure that includes a component circuit board containing a plurality of electrical components, and a wafer connector assembly. The wafer connector assembly includes a plurality of interconnect circuit boards that are in electrical connection with the components circuit board through a plurality of rows of solder joints, the plurality of interconnect circuit boards having a connection end including at least one contact. An adhesive is present structurally reinforcing at least a row of the solder joints that is proximate to the connection end of the plurality of interconnect circuit boards of the wafer assembly.
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公开(公告)号：US12005148B2
公开(公告)日：2024-06-11
申请号：US17245356
申请日：2021-04-30
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Hongqing Zhang , David J. Lewison , Frank L. Pompeo , James Busby , Jay A. Bunt , Joyce E. Molinelli Acocella , Madhana Sunder , Michael J. Ellsworth, Jr.
CPC classification number: A61L2/10 , F21V29/59 , A61L2202/11 , A61L2202/14 , H05K7/20763
Abstract: Apparatuses and methods of fabrication are provided which include a coolant-cooled heat sink through which coolant passes to facilitate cooling the coolant-cooled heat sink, and an ultra-violet (UV) light assembly associated with the coolant-cooled heat sink for directing UV light towards an interior surface of the coolant-cooled heat sink across which the coolant passes. The UV light inhibits bacterial growth at the interior surface of the coolant-cooled heat sink.
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公开(公告)号：US20220155049A1
公开(公告)日：2022-05-19
申请号：US16950855
申请日：2020-11-17
Applicant: International Business Machines Corporation
Inventor： David J. Lewison , Jay A. Bunt , Frank L. Pompeo , Richard Walter Oldrey , John D. Sylvestri , Phong T. Tran
Abstract: A method of preparing a computer processor die includes determining a warpage shape of the computer processor die at a testing temperature. The method also includes selectively contouring a thickness of the computer processor die at a contouring temperature by physically removing material from a surface of the computer processor die such that the surface will be substantially flat at the testing temperature.
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Patent Agency Ranking
公开(公告)号：US10978313B2
公开(公告)日：2021-04-13
申请号：US15899661
申请日：2018-02-20
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Phillip D. Isaacs , Christopher M. Marroquin , Daren Simmons , Frank L. Pompeo , Jason R. Eagle , Mark K. Hoffmeyer , Michael J. Ellsworth, Jr. , Prabjit Singh , Steve Ostrander
IPC: H01L21/48 , H01L23/367 , H01L23/40 , H05K7/20 , B21D53/02 , H01L23/473
Abstract: A fixture to facilitate fabrication of a heat sink includes a base plate to support a lower section of the heat sink, and multiple registration pins extending from the base plate. A platen is provided over a heat transfer element (HTE) of the heat sink, with the platen including slip fit regions to slip fit around respective registration pins, and with the lower section and HTE disposed between the base plate and the platen, and forming a fixture stack segment aligned with an active region of the cold plate. A load plate is provided which includes slip fit regions configured to slip fit around corresponding registration pins with the load plate disposed over the fixture stack segment. The load plate includes a single load pin centrally disposed to apply a load to the fixture stack segment and facilitate bonding the lower section and HTE together.
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公开(公告)号：US20180213645A1
公开(公告)日：2018-07-26
申请号：US15928874
申请日：2018-03-22
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Michael A. Gaynes , Jeffrey D. Gelorme , Robert P. Kuder, II , Daniel J. Littrell , Thomas E. Lombardi , Marie-Claude Paquet , Frank L. Pompeo , David L. Questad , James Speidell , Sri M. Sri-Jayantha , Son K. Tran
CPC classification number: H05K1/18 , H01R4/02 , H01R12/51 , H01R12/7041 , H01R43/205 , H05K1/0271 , H05K1/181 , H05K3/30 , H05K3/305 , H05K3/366 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10106 , H05K2201/10159 , H05K2201/10166 , H05K2201/10977
Abstract: An interconnect structure that includes a component circuit board containing a plurality of electrical components, and a wafer connector assembly. The wafer connector assembly includes a plurality of interconnect circuit boards that are in electrical connection with the components circuit board through a plurality of rows of solder joints, the plurality of interconnect circuit boards having a connection end including at least one contact. An adhesive is present structurally reinforcing at least a row of the solder joints that is proximate to the connection end of the plurality of interconnect circuit boards of the wafer assembly.
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公开(公告)号：US11940271B2
公开(公告)日：2024-03-26
申请号：US16950855
申请日：2020-11-17
Applicant: International Business Machines Corporation
Inventor： David J. Lewison , Jay A. Bunt , Frank L. Pompeo , Richard Walter Oldrey , John D. Sylvestri , Phong T. Tran
CPC classification number: G01B5/20 , G01B5/06 , G01B5/30 , H01L21/67253
Abstract: A method of preparing a computer processor die includes determining a warpage shape of the computer processor die at a testing temperature. The method also includes selectively contouring a thickness of the computer processor die at a contouring temperature by physically removing material from a surface of the computer processor die such that the surface will be substantially flat at the testing temperature.
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公开(公告)号：US11156409B2
公开(公告)日：2021-10-26
申请号：US16747059
申请日：2020-01-20
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Hongqing Zhang , Jay A. Bunt , David J. Lewison , Joyce E. Molinelli Acocella , Frank L. Pompeo , Jeffrey Allen Zitz
Abstract: Coolant-cooled heat sinks and methods of fabrication are provided with a coolant-carrying compartment between a cover and a heat transfer base. The heat transfer base includes a heat transfer surface to couple to a component to be cooled, and a plurality of thermally-conductive fins extending into the coolant-carrying compartment from a surface of the heat transfer base opposite to the heat transfer surface. One or more grooves are provided in an interface surface of the cover and fins, and wicking element(s) are positioned within, at least in part, the groove(s). A joining material is provided between the cover and fins to join the plurality of thermally-conductive fins to the cover. The wicking element(s) within, at least in part, the groove(s) facilitate retaining the joining material over the plurality of thermally-conductive fins during joining of the cover and fins.
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公开(公告)号：US10750615B2
公开(公告)日：2020-08-18
申请号：US16423565
申请日：2019-05-28
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Michael A. Gaynes , Jeffrey D. Gelorme , Robert P. Kuder, II , Daniel J. Littrell , Thomas E. Lombardi , Marie-Claude Paquet , Frank L. Pompeo , David L. Questad , James Speidell , Sri M. Sri-Jayantha , Son K. Tran
Abstract: An interconnect structure that includes a component circuit board containing a plurality of electrical components, and a wafer connector assembly. The wafer connector assembly includes a plurality of interconnect circuit boards that are in electrical connection with the components circuit board through a plurality of rows of solder joints, the plurality of interconnect circuit boards having a connection end including at least one contact. An adhesive is present structurally reinforcing at least a row of the solder joints that is proximate to the connection end of the plurality of interconnect circuit boards of the wafer assembly.
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