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公开(公告)号：US20240344787A1
公开(公告)日：2024-10-17
申请号：US18753045
申请日：2024-06-25
申请人： Dell Products L.P.
发明人： Yuan Chen , Weidong Zuo , Regan Zhu
CPC分类号： F28F27/02 , G05D7/0635 , H05K7/20254 , H05K7/20763
摘要： A device and systems for cooling hardware components is disclosed. The smart cold plate (CP) device includes a first inlet port for supplying a first coolant path, a second inlet port for supplying a second coolant path, and a valve for selectively controlling a flow of a coolant between the first and second inlet ports and an internal port, the internal port connecting the first and second inlet ports to a CP. The device also includes an external port connected to the CP for removing the coolant from the smart CP device and a connector through which power is supplied to the valve. Various cooling systems incorporating the smart CP device are disclosed.
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公开(公告)号：US20240251531A1
公开(公告)日：2024-07-25
申请号：US18101478
申请日：2023-01-25
发明人： John H. BEAN, JR.
IPC分类号： H05K7/20
CPC分类号： H05K7/20836 , H05K7/20236 , H05K7/20763
摘要： Various embodiments include first and second coolant level regulator components of first and second component cooling tanks and a processor. Each of the first and second coolant level regulator components may include a temperature sensor configured to measure a temperature of the coolant in a reservoir, a coolant release valve configured to regulate the release of coolant from the reservoir, and a coolant level detector configured to detect a level of the coolant in the reservoir. The processor may receive temperature measurements from the temperature sensors, signal a target coolant level update for adjusting a level of the coolant in the reservoir by the coolant release valve. The target coolant level update may be determined based on a temperature average of the received temperature measurements from the temperature sensors. The coolant release valve may adjust a release of the coolant from the reservoir based on the target coolant level update.
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公开(公告)号：US20240237299A9
公开(公告)日：2024-07-11
申请号：US17971348
申请日：2022-10-21
申请人： Dell Products L.P.
IPC分类号： H05K7/20
CPC分类号： H05K7/20763 , H05K7/20272 , H05K7/20718
摘要： Multiple systems for providing liquid and air cooling for IT components is disclosed. The modular system for cooling Information Technology (IT) includes a first module with at least one dry cooler that supplies liquid cooling to at least one liquid heat exchange device, and a second module with at least one liquid heat exchange device that provides liquid cooling to a facility with one or more IT units. The modular system may also provide cooling liquid to an air to liquid heat exchange device of the facility.
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4.发明公开公开(公告)号：US20240223099A1
公开(公告)日：2024-07-04
申请号：US18204813
申请日：2023-06-01
发明人： DUO QIU , LI-QUAN HE , JEN-HUNG CHIANG
CPC分类号： H02M7/003 , G06F1/28 , H05K1/141 , H05K7/20236 , H05K7/20763 , G06F13/4282
摘要： A power detecting circuit board and, a power detecting system, and an immersed liquid cooling tank are provided, the power detecting system includes a plurality of power detecting circuit boards and a BMC, each power detecting circuit board is connected to at least one PSU, one of the power detecting circuit boards serves as a leader detecting circuit board, the rest of the power detecting circuit boards serve as follower detecting circuit boards; the leader detecting circuit board obtains running data of the corresponding PSU; each follower detecting circuit board obtains running data of the corresponding PSU; the leader detecting circuit board obtains the running data of the PSU corresponding to the follower detecting circuit boards, and summarize the running data of the PSU corresponding to the leader detecting circuit board and the running data of the PSU corresponding to the follower detecting circuit boards.
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公开(公告)号：US12022638B2
公开(公告)日：2024-06-25
申请号：US15416854
申请日：2017-01-26
申请人： ICEOTOPE LIMITED
发明人： Daniel Chester , Peter Hopton , Jason Bent , Keith Deakin
CPC分类号： H05K7/20281 , B65B7/00 , B65B63/08 , F25D23/12 , G06F1/20 , H01L23/473 , H05K7/20 , H05K7/20218 , H05K7/20236 , H05K7/20263 , H05K7/2039 , H05K7/20509 , H05K7/20763 , H05K7/20772 , H05K7/20781 , H05K13/00 , G06F2200/201 , Y10T29/49002 , Y10T29/4935
摘要： A sealable module, cooled electronic system and method are described relating to cooling a heat generating electronic device. The sealable module is adapted to be filled with a first cooling liquid and a heat transfer device having a conduction surface defines a channel for receiving a second cooling liquid. In one embodiment, at least a portion of the conduction surface or housing is shaped in conformity with the shape of the electronic component. Control of the second cooling liquid is also described. Transferring heat between the second cooling liquid and a third cooling liquid features in embodiments. A method of filling a container with a cooling liquid is further detailed.
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公开(公告)号：US20240138121A1
公开(公告)日：2024-04-25
申请号：US18493680
申请日：2023-10-23
IPC分类号： H05K7/20
CPC分类号： H05K7/20763 , H05K7/20427
摘要： A cold plate assembly has a cold plate that is resistant to corrosion and particulate fouling, allowing direct use of facility-grade cooling liquid and omission of a secondary coolant loop that uses a purified liquid coolant. The cold plate has a surface configured with an array of extended fins coated with at least one of a hydrophobic, non-conductive, and/or anti-corrosive surface treatment. The coated extended fins provide heat transfer directly to the cooling liquid without requiring a secondary coolant loop and without causing corrosion or clogging due to facility liquid chemical contaminants or particulates. An encapsulating lid of the cold plate assembly attaches to a perimeter of the surface encompassing the array of extended fins to form a liquid cooling cavity. The encapsulating lid has input and output ports sealably connectable by an open-loop liquid distribution system, respectively, to a facility liquid supply and return.
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公开(公告)号：US20240023287A1
公开(公告)日：2024-01-18
申请号：US18373539
申请日：2023-09-27
申请人： OVH
IPC分类号： H05K7/20
CPC分类号： H05K7/20763 , H05K7/20236
摘要： An immersive cooling system is described. The system includes an immersive cooling container, including: a first reservoir; a second reservoir; numerous slots, each configured to hold a casing; a reservoir connector corresponding to each slot, and configured to provide fluid communication with the first reservoir; and a pump configured to convey a dielectric immersion cooling liquid from the second reservoir to the first reservoir. The immersive cooling system also includes a casing, configured to contain an electronic device and to fit within a slot of the container. The casing includes an inlet configured to be in fluid communication with the reservoir connector of the slot within which the casing is disposed to facilitate flow of the cooling liquid into an interior of the casing through the reservoir connector and an outlet configured to facilitate flow of the cooling liquid from the interior of the casing into the second reservoir.
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公开(公告)号：US20240008218A1
公开(公告)日：2024-01-04
申请号：US17902029
申请日：2022-09-02
申请人： QUANTA COMPUTER INC.
发明人： Chao-Jung CHEN , Yu-Nien Huang , Herman Tan , Tien-Juei Chuang
IPC分类号： H05K7/20
CPC分类号： H05K7/20254 , H05K7/20263 , H05K7/20272 , H05K7/20281 , H05K7/20136 , H05K7/20763 , H05K7/20354 , H05K7/20318
摘要： A hybrid cooling system is disclosed that combines a liquid coolant cycle and a refrigerant cycle to efficiently and effectively transfer heat away from a heat-generating component of a computing device. The liquid coolant cycle pumps a liquid coolant through a cold plate to extract heat from the heat-generating component. The heated liquid coolant passes through a coolant-to-refrigerant heat exchanger, where refrigerant from the refrigerant cycle absorbs the heat from the liquid coolant. The heated refrigerant passes through a compressor to a condenser, where the high-pressure, heated refrigerant is cooled by air passing over the condenser. The hybrid cooling system enables cooling of a heat-generating component better than by non-hybrid cooling systems.
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公开(公告)号：US11822400B2
公开(公告)日：2023-11-21
申请号：US17708691
申请日：2022-03-30
CPC分类号： G06F1/206 , H05K7/20763 , G06F2200/201
摘要： An apparatus for a hybrid single-phase/two-phase cooling loop to enhance cooling of components in a computing device is disclosed. The apparatus includes a single-phase cooling loop routed through a first part of a component. The component includes semiconductor devices. The single-phase cooling loop includes a fluid configured to remain in a liquid state after removing heat from the first part of the component. The apparatus includes a two-phase cooling loop routed through a second part of a component. The two-phase cooling loop includes a dielectric fluid configured to at least partially transition from a liquid state to a gas state at a selected temperature of a semiconductor device of the second part of the component while removing heat from the second part of the component.
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公开(公告)号：US20230354549A1
公开(公告)日：2023-11-02
申请号：US18072555
申请日：2022-11-30
发明人： LI-QUAN HE , DUO QIU , WEI-CHEN LIN
CPC分类号： H05K7/20236 , H05K7/20763 , H05K7/20136 , G06F1/206
摘要： A validation method relating to the validation of immersion-cooled servers in an air cooling environment obtains a requirement or purchase order, the order including types of immersion-cooled servers and number required. The method builds a validation environment accordingly, the validation environment includes first fans and air cooling power modules. The air cooling power modules includes a number of power supply units and a number of second fans. The method executes one or more tests in an assembled validation environment. The method further generates a result of test. A demo board and a non-transitory storage medium are also disclosed.
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