公开(公告)号：US12022638B2

公开(公告)日：2024-06-25

申请号：US15416854

申请日：2017-01-26

申请人： ICEOTOPE LIMITED

发明人： Daniel Chester ,  Peter Hopton ,  Jason Bent ,  Keith Deakin

IPC分类号： H05K7/20 ,  B65B7/00 ,  B65B63/08 ,  F25D23/12 ,  G06F1/20 ,  H01L23/473 ,  H05K13/00

CPC分类号： H05K7/20281 ,  B65B7/00 ,  B65B63/08 ,  F25D23/12 ,  G06F1/20 ,  H01L23/473 ,  H05K7/20 ,  H05K7/20218 ,  H05K7/20236 ,  H05K7/20263 ,  H05K7/2039 ,  H05K7/20509 ,  H05K7/20763 ,  H05K7/20772 ,  H05K7/20781 ,  H05K13/00 ,  G06F2200/201 ,  Y10T29/49002 ,  Y10T29/4935

摘要： A sealable module, cooled electronic system and method are described relating to cooling a heat generating electronic device. The sealable module is adapted to be filled with a first cooling liquid and a heat transfer device having a conduction surface defines a channel for receiving a second cooling liquid. In one embodiment, at least a portion of the conduction surface or housing is shaped in conformity with the shape of the electronic component. Control of the second cooling liquid is also described. Transferring heat between the second cooling liquid and a third cooling liquid features in embodiments. A method of filling a container with a cooling liquid is further detailed.

公开(公告)号：US10306804B2

公开(公告)日：2019-05-28

申请号：US15179257

申请日：2016-06-10

申请人： Iceotope Limited

发明人： Daniel Chester ,  Peter Hopton ,  Jason Bent ,  Keith Deakin

IPC分类号： H05K7/20 ,  G06F1/20 ,  F25D23/12 ,  H01L23/473 ,  H05K13/00 ,  B65B7/00 ,  B65B63/08

摘要： A sealable module, cooled electronic system and method are described relating to cooling a heat generating electronic device. The sealable module is adapted to be filled with a first cooling liquid and a heat transfer device having a conduction surface defines a channel for receiving a second cooling liquid. In one embodiment, at least a portion of the conduction surface or housing is shaped in conformity with the shape of the electronic component. Control of the second cooling liquid is also described. Transferring heat between the second cooling liquid and a third cooling liquid features in embodiments. A method of filling a container with a cooling liquid is further detailed.

公开(公告)号：US20180288906A1

公开(公告)日：2018-10-04

申请号：US15764605

申请日：2016-10-03

申请人： ICEOTOPE LIMITED

发明人： Peter Hopton ,  Keith Deakin ,  Jason Bent ,  Neil Edmunds ,  David Amos

IPC分类号： H05K7/20 ,  H05K7/14

摘要： A cooling system for cooling of a heat generating electrical component, in particular to reduce the likelihood of overheating of electrical components or chemical breakdown of coolant fluid. The cooling system has a coolant liquid to absorb excess energy from the heat generating electrical component, the coolant liquid having an energy input threshold above which chemical breakdown of the coolant liquid occurs. A cooling module defines a volume containing the coolant liquid, wherein the heat generating electrical component is mounted within the volume and immersed in the coolant liquid. A power input is arranged to supply power into the cooling module to the heat generating electrical component, and a power regulator is provided external to the volume of the cooling module and connected to the power input so as to regulate the power supplied into the cooling module. Cooling systems are also described having coolant liquid comprising dissolved oxygen, having at least one element arranged within the volume comprising aluminium and/or aluminium oxide, and/or having a sealed volume with at least one seal which opens at a predetermined pressure or temperature corresponding to a temperature below the temperature at which the coolant liquid breaks down.