公开(公告)号：US12238894B2

公开(公告)日：2025-02-25

申请号：US18633906

申请日：2024-04-12

Applicant: Dell Products L.P.

Inventor： Tyler Baxter Duncan ,  Anthony Middleton

IPC: G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  H05K7/20

Abstract: A method for cooling one or more Information Technology (IT) units, the method comprising adjusting a first valve controlling liquid flow in a primary loop, wherein the primary loop comprises: at least one dry cooler of a dry cooling section, and an air/liquid exchange section comprising at least one air/liquid exchange device that provides air cooling to the one or more IT units. The method further comprising adjusting a second valve controlling liquid flow into a liquid loop interface, the liquid loop interface being connected to a secondary loop, the secondary loop comprising the one or more IT units; and at least one liquid heat exchange device of the liquid loop interface that provides liquid cooling to the one or more IT units, and wherein adjusting the first and second valves controls the ratio of liquid cooling to air cooling to the one or more IT units.

公开(公告)号：US20240237299A9

公开(公告)日：2024-07-11

申请号：US17971348

申请日：2022-10-21

Applicant: Dell Products L.P.

Inventor： Tyler Baxter Duncan ,  Anthony Middleton

IPC: H05K7/20

CPC classification number: H05K7/20763 ,  H05K7/20272 ,  H05K7/20718

Abstract: Multiple systems for providing liquid and air cooling for IT components is disclosed. The modular system for cooling Information Technology (IT) includes a first module with at least one dry cooler that supplies liquid cooling to at least one liquid heat exchange device, and a second module with at least one liquid heat exchange device that provides liquid cooling to a facility with one or more IT units. The modular system may also provide cooling liquid to an air to liquid heat exchange device of the facility.

公开(公告)号：US20240237289A9

公开(公告)日：2024-07-11

申请号：US17971365

申请日：2022-10-21

Applicant: Dell Products L.P.

Inventor： Tyler Baxter Duncan ,  Anthony Middleton ,  Ty Robert Schmitt

IPC: H05K7/20

CPC classification number: H05K7/20327 ,  H05K7/20136 ,  H05K7/20309 ,  H05K7/208

Abstract: Multiple systems and devices for providing liquid and air cooling for IT components is disclosed. The system includes a module comprising at least one dry cooler and at least one liquid heat exchange device. The module includes a primary cooling loop with the at least one dry cooler and the at least one liquid heat exchange device. The system also includes a secondary loop that includes the at least one liquid heat exchange device and one or more IT units in a facility. The system includes a path for air cooling the one or more IT units in the facility that includes at least one air intake from outside the facility that supplies air for cooling the one or more IT units.

公开(公告)号：US20240237251A9

公开(公告)日：2024-07-11

申请号：US17970340

申请日：2022-10-20

Applicant: Dell Products L.P.

Inventor： Tyler Baxter Duncan ,  Anthony Middleton ,  Jeffery Todd Sayles ,  Ty Robert Schmitt

IPC: H05K7/14 ,  H05K7/20

CPC classification number: H05K7/1431 ,  H05K7/202 ,  H05K7/20745 ,  H05K7/20836

Abstract: A modular data center includes: a modular information technology component (MITC), in which the MITC includes an information handling system (IHS) and a utility control component (UCC), in which the IHS and the UCC are affixed to a bottom side of the MITC; and a front access component and a rear access component, in which the front access component is connected to a front side of the MITC, in which an area of the front access component is equal to an area of the front side of the MITC, in which the rear access component is connected to a rear side of the MITC, and in which an area of the rear access component is equal to an area of the rear side of the MITC.

公开(公告)号：US20240138105A1

公开(公告)日：2024-04-25

申请号：US17971160

申请日：2022-10-20

Applicant: Dell Products L.P.

Inventor： Tyler Baxter Duncan ,  Anthony Middleton

IPC: H05K7/20

CPC classification number: H05K7/20272 ,  H05K7/20781

Abstract: An information handling system includes a computing device, the information handling system includes a computing component of the computing device that is housed in a chassis; and a heating component that increases a temperature of a portion of an airflow when the heating component is in an active state, the portion of the airflow thermally manages the computing component by reducing a temperature of the computing component. The airflow is received by the chassis via an air receiving exchange, and exhausted by the chassis via an air expelling exchange.

公开(公告)号：US12238887B2

公开(公告)日：2025-02-25

申请号：US17970310

申请日：2022-10-20

Applicant: Dell Products L.P.

Inventor： Tyler Baxter Duncan ,  Anthony Middleton

IPC: H05K7/14 ,  H05K7/20

Abstract: A modular data center includes: a modular information technology component (MITC), in which the MITC comprises a cooling distribution unit (CDU), a floor, a bottom cooling distribution unit mounting component (CDUMC), a modular over-rack component (MORC), and a top CDUMC, in which the floor comprises a floor track apparatus (FTA), in which the bottom CDUMC affixes the CDU to the FTA, in which the top CDUMC affixes the CDU to the MORC, in which the top CDUMC provides air containment with an internal environment of the MITC; and a modular environmental control component (MECC), in which the MECC comprises a plurality of environmental control components (ECCs) and built-in airflow connection components, in which the built-in airflow connection components remove and supply air to the MITC.

公开(公告)号：US20240237304A9

公开(公告)日：2024-07-11

申请号：US17971358

申请日：2022-10-21

Applicant: Dell Products L.P.

Inventor： Tyler Baxter Duncan ,  Anthony Middleton ,  Ty Robert Schmitt

IPC: H05K7/20

CPC classification number: H05K7/2079 ,  H05K7/20145 ,  H05K7/20745 ,  H05K7/20836

Abstract: Systems, devices, and methods for providing liquid and air cooling for IT components in a facility is disclosed. The system includes a module comprising at least one dry cooler and at least one liquid heat exchange device. The module includes a primary cooling loop with the at least one dry cooler and the at least one liquid heat exchange device. The system also includes a secondary loop that includes the at least one liquid heat exchange device and one or more IT units in the facility. The system includes a path for air cooling the one or more IT units in the facility that includes an air intake from outside the facility that supplies air for cooling the one or more IT units. The method includes adjusting a first valve controlling liquid flow in a primary loop and adjusting a second valve controlling liquid flow in a secondary loop.

公开(公告)号：US20240237302A9

公开(公告)日：2024-07-11

申请号：US17971161

申请日：2022-10-21

Applicant: Dell Products L.P.

Inventor： Tyler Baxter Duncan ,  Anthony Middleton ,  Ty Robert Schmitt

IPC: H05K7/20

CPC classification number: H05K7/20781 ,  H05K7/20272

Abstract: An information handling system includes a chassis that includes a chassis inlet and a chassis outlet and a liquid cooling system that includes a first manifold. The first manifold includes a first chassis outlet configured to provide a first inlet coolant flow to the chassis inlet and a first chassis inlet configured to receive a first outlet coolant flow from the chassis outlet. The liquid cooling system also includes a second manifold that includes a second chassis outlet configured to provide the first inlet coolant flow to the chassis inlet, and a second chassis inlet configured to receive the first outlet coolant flow from the chassis outlet.

公开(公告)号：US20240237278A9

公开(公告)日：2024-07-11

申请号：US17971160

申请日：2022-10-21

Applicant: Dell Products L.P.

Inventor： Tyler Baxter Duncan ,  Anthony Middleton

IPC: H05K7/20

CPC classification number: H05K7/20272 ,  H05K7/20781

Abstract: An information handling system includes a computing device, the information handling system includes a computing component of the computing device that is housed in a chassis; and a heating component that increases a temperature of a portion of an airflow when the heating component is in an active state, the portion of the airflow thermally manages the computing component by reducing a temperature of the computing component. The airflow is received by the chassis via an air receiving exchange, and exhausted by the chassis via an air expelling exchange.

公开(公告)号：US20240231316A9

公开(公告)日：2024-07-11

申请号：US17970328

申请日：2022-10-20

Applicant: Dell Products L.P.

Inventor： Tyler Baxter Duncan ,  Anthony Middleton ,  Ty Robert Schmitt

IPC: G05B19/4155

CPC classification number: G05B19/4155 ,  G05B2219/49216

Abstract: A modular information technology component (MITC) includes: a floor, in which the floor comprises a first floor plate (FP) and a second FP, in which the first FP and the second FP are oriented in a first plane; and a first hydraulic pump (HP) and a second HP, in which the first HP is located underneath the first FP, in which the second HP is located underneath the second FP, in which the first HP and the second HP are deactivated, in which, when an information handling system (IHS) is loaded on the second FP, the second FP becomes oriented in a second plane, in which the second plane is lower than the first plane, and in which, when the second FP becomes oriented in the second plane, the second HP is activated to raise the second FP to the first plane.