HIGH PERFORMANCE COOLING MODULE
    1.
    发明公开

    公开(公告)号:US20240008218A1

    公开(公告)日:2024-01-04

    申请号:US17902029

    申请日:2022-09-02

    IPC分类号: H05K7/20

    摘要: A hybrid cooling system is disclosed that combines a liquid coolant cycle and a refrigerant cycle to efficiently and effectively transfer heat away from a heat-generating component of a computing device. The liquid coolant cycle pumps a liquid coolant through a cold plate to extract heat from the heat-generating component. The heated liquid coolant passes through a coolant-to-refrigerant heat exchanger, where refrigerant from the refrigerant cycle absorbs the heat from the liquid coolant. The heated refrigerant passes through a compressor to a condenser, where the high-pressure, heated refrigerant is cooled by air passing over the condenser. The hybrid cooling system enables cooling of a heat-generating component better than by non-hybrid cooling systems.

    Air duct with one or more fins
    2.
    发明授权

    公开(公告)号:US12120842B2

    公开(公告)日:2024-10-15

    申请号:US17829869

    申请日:2022-06-01

    IPC分类号: H05K7/20

    CPC分类号: H05K7/20145 H05K7/20209

    摘要: An air duct is disclosed. The air duct includes a housing for directing air over a plurality of slots within a computer system. The housing includes side housing walls and a top housing wall. The side housing walls are respectively connected to opposing ends of the top housing wall. The side housing walls extend in the same direction from the top housing wall. The air duct further includes a plurality of fins extending from the top housing wall in the same direction as the side housing walls. Each fin of the plurality of fins is arranged on the top housing wall so as to be positioned between adjacent slots of the plurality of slots when the housing is located within the computer system.

    Cold plate for cooling electronic component

    公开(公告)号:US11877424B2

    公开(公告)日:2024-01-16

    申请号:US17825433

    申请日:2022-05-26

    IPC分类号: H05K7/20

    CPC分类号: H05K7/20336 H05K7/20509

    摘要: A cold plate for cooling an electronic component is disclosed. The cold plate includes a base portion having a fluid channel with a fluid inlet and a fluid outlet, the fluid channel being configured to internally circulate a cooling fluid for carrying heat dissipated by the electrical component; and a cover coupled to the base portion such that the fluid channel is enclosed internally in the cold plate. The cover has a vapor outlet formed on a top side of the cover, the vapor outlet allowing generated vapor to exit from within the cold plate. Also disclosed is a method for cooling the electronic component via the cold plate. The method includes allowing some fluid of the circulating cooling fluid to seep from the fluid channel into an internal chamber, and allowing vapor to be expelled through the vapor outlet.

    Thermal wake suppressor
    4.
    发明授权

    公开(公告)号:US11874712B2

    公开(公告)日:2024-01-16

    申请号:US17647042

    申请日:2022-01-05

    IPC分类号: G06F1/20 H05K7/20

    CPC分类号: G06F1/20 H05K7/20727

    摘要: According to certain aspects of the present disclosure, a system includes a heat-generating component and a thermal wake suppressor positioned downstream from the heat-generating component. The heat-generating component produces a thermal wake in a downstream direction. The thermal wake suppressor includes a spacing grid and a plurality of twist plates extending from the spacing grid at an angle. The spacing grid is defined by a plurality of longitudinal ribs and a plurality of transverse ribs that form a plurality of intersections. The plurality of twist plates is periodically arranged on the plurality of longitudinal ribs and the plurality of transverse ribs, such that a subset of the plurality of twist plates is arranged to break apart the thermal wake into sub-vortexes in the downstream direction.