Abstract:
A processor placement tool that prevents removal of the processor module unless the protective cover is in place. In order to prevent engagement of the gripping devices against the processor module, piston interlocks are provided that block rotation of the gripping devices unless the protective cover is in place. The piston interlocks release their blocking when they contact the protective cover.
Abstract:
An apparatus, multi-layer semiconductor substrate and system for testing a high-speed signal through a printed circuit board is provided. Embodiment of the present invention provides an apparatus comprises a multi-layer substrate, one or more transmission lines disposed within the multi-layer substrate, one or more connectors attached to the multi-layer substrate for connecting one or more test cards, a lid, comprising one or more cutouts for the one or more connectors, a clamp for compressing the multi-layer substrate against the lid, and one or more high-speed connectors attached to the one or more test cards, respectively.
Abstract:
A method for assembling an integrated circuit device includes positioning a thermal interface material (TIM) on top of an electronic component, positioning a load frame onto a printed circuit board, the load frame having an open region for the electronic component to extend through, and positioning a heat sink onto the TIM. The method further comprises fastening a first screw fastener, resulting in a TIM bond line between the heat sink and the electronic component, and actuating a second screw fastener disposed within a bore of the heat sink and threaded into the load frame. The second screw fastener, upon being tightened expands radially to lock the heat sink into the load frame. The first screw fastener, upon the tightening of the second screw fastener, connects the heat sink and the load frame to the printed circuit board.
Abstract:
An imaging device is provided that may be used for visually inspecting structures. In one embodiment, the imaging device includes an image capture device; and a rail system having a stationary component connected to the image capture device and a sliding component for movement along a horizontal axis. The system can further include a jig structure engaged to the sliding component of the rail system. The jig structure may include a first mount location for engagement to a first type connector and a second mount location for engagement to a second type connector. The jig structure is engaged to the sliding component to position the housing so that the first and second mount locations are in line and parallel to a direction of travel along the horizontal axis including a point at which the first and second mount locations pass through the imaging location.
Abstract:
An externally threaded fastener is captivated by a component that includes an opening. The externally threaded fastener includes a thread and a non-threaded shaft. The opening includes a major diameter and a minor diameter. The minor diameter includes a first diameter portion, a second diameter portion, and orthogonal portions that connect the first diameter portion and the second diameter portion. To captivate the externally threaded fastener with the component, the externally threaded fastener is positioned within the component opening and the externally threaded fastener is angled relative to an axis of symmetry of the opening in order to engage the threads of the externally threaded fastener with the component opening until the non-threaded shaft is fixed against at least two planes of the component by the first diameter portion of the minor diameter.
Abstract:
A fluid cooling system and associated fitting assembly for an electronic component such as a multi-processor computer offer easy and reliable connect and disconnect operations while doing so in a minimum amount of available space without damaging associated components of an electronic device, computer or cooling system. One exemplary fitting assembly includes a manifold mount with a port that is in fluid communication with a manifold tube. A fitting is sized and configured to mate with the port and is in fluid communication with associated cooling tubes of a cold plate. A latch is pivotally mounted to the manifold mount for movement to and between a first position in which the latch secures the fitting to the manifold mount and a second position in which the fitting is capable of being disconnected from the manifold mount.
Abstract:
A fluid cooling system and associated fitting assembly for an electronic component such as a multi-processor computer offer easy and reliable connect and disconnect operations while doing so in a minimum amount of available space without damaging associated components of an electronic device, computer or cooling system. One exemplary fitting assembly includes a manifold mount with a port that is in fluid communication with a manifold tube. A fitting is sized and configured to mate with the port and is in fluid communication with associated cooling tubes of a cold plate. A latch is pivotally mounted to the manifold mount for movement to and between a first position in which the latch secures the fitting to the manifold mount and a second position in which the fitting is capable of being disconnected from the manifold mount.
Abstract:
A heatsink for distributing heatsink load across a processor module with separable input/output (I/O) connectors, comprising: a thermal conductor; and one or more pistons aligned with one or more separable interconnects of the processor module.
Abstract:
An apparatus includes a motherboard with a processor socket, a load frame connected to the motherboard adjacent to at least two sides of the processor socket, and a processor retainer rotatably connected to the load frame, the processor retainer being positionable in a closed position, an opened position, and an installation position. The processor retainer extends over the processor socket when the processor retainer is in the closed position.
Abstract:
Methods and structures are provided for implementing selective airflow modification. An airflow control member holder receives and retains an airflow control member having compliance characteristics allowing easy removal and changing of the airflow control member. The airflow control member holder includes retention features to facilitate mounting and removal from the system, such as mounting and removal from a printed circuit board (PCB). The airflow control member holder provides a protective function for a component, such as a depopulated component, a central processing unit (CPU) or other device.