公开(公告)号：US10705134B2

公开(公告)日：2020-07-07

申请号：US15830051

申请日：2017-12-04

Applicant: International Business Machines Corporation

Inventor： Lloyd A. Walls ,  Nam H. Pham ,  Jason R. Eagle ,  Nathan L. Dunfee ,  Pavel Roy Paladhi

IPC: G01R31/28 ,  H05K1/02 ,  H01L23/498 ,  H01L23/66 ,  G01R1/04 ,  G01R1/067

Abstract: An apparatus, multi-layer semiconductor substrate and system for testing a high-speed signal through a printed circuit board is provided. Embodiment of the present invention provides an apparatus comprises a multi-layer substrate, one or more transmission lines disposed within the multi-layer substrate, one or more connectors attached to the multi-layer substrate for connecting one or more test cards, a lid, comprising one or more cutouts for the one or more connectors, a clamp for compressing the multi-layer substrate against the lid, and one or more high-speed connectors attached to the one or more test cards, respectively.

公开(公告)号：US20190170809A1

公开(公告)日：2019-06-06

申请号：US15830051

申请日：2017-12-04

Applicant: International Business Machines Corporation

Inventor： Lloyd A. Walls ,  Nam H. Pham ,  Jason R. Eagle ,  Nathan L. Dunfee ,  Pavel Roy Paladhi

IPC: G01R31/28 ,  H05K1/02 ,  H01L23/498 ,  H01L23/66 ,  G01R1/067 ,  G01R1/04

Abstract: An apparatus, multi-layer semiconductor substrate and system for testing a high-speed signal through a printed circuit board is provided. Embodiment of the present invention provides an apparatus comprises a multi-layer substrate, one or more transmission lines disposed within the multi-layer substrate, one or more connectors attached to the multi-layer substrate for connecting one or more test cards, a lid, comprising one or more cutouts for the one or more connectors, a clamp for compressing the multi-layer substrate against the lid, and one or more high-speed connectors attached to the one or more test cards, respectively.