公开(公告)号：US11614324B2

公开(公告)日：2023-03-28

申请号：US16662158

申请日：2019-10-24

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Hongqing Zhang ,  Jay A. Bunt ,  David J. Lewison ,  Joyce Molinelli Acocella ,  Yu Luo

IPC: H01L21/02 ,  G01B15/02 ,  H01L21/50 ,  H01L21/66

Abstract: Aspects of the invention include a non-destructive bond line thickness measurement of thermal interface material on silicon packages. A non-limiting example computer-implemented method includes receiving a chip mounted on a laminate and depositing a high-density material on the chip. The computer-implemented method deposits a thermal interface material on the chip and lids the chip, and the laminate with a lid. The computer-implemented method X-rays the lid, the chip, and the laminate to produce an X-ray and measures, using a processor, from the X-ray a bond line thickness of the TIM as a distance from a bottom of the lid to a top surface of the high-density material.

公开(公告)号：US12005148B2

公开(公告)日：2024-06-11

申请号：US17245356

申请日：2021-04-30

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Hongqing Zhang ,  David J. Lewison ,  Frank L. Pompeo ,  James Busby ,  Jay A. Bunt ,  Joyce E. Molinelli Acocella ,  Madhana Sunder ,  Michael J. Ellsworth, Jr.

IPC: A61L2/10 ,  F21V29/58 ,  H05K7/20

CPC classification number: A61L2/10 ,  F21V29/59 ,  A61L2202/11 ,  A61L2202/14 ,  H05K7/20763

Abstract: Apparatuses and methods of fabrication are provided which include a coolant-cooled heat sink through which coolant passes to facilitate cooling the coolant-cooled heat sink, and an ultra-violet (UV) light assembly associated with the coolant-cooled heat sink for directing UV light towards an interior surface of the coolant-cooled heat sink across which the coolant passes. The UV light inhibits bacterial growth at the interior surface of the coolant-cooled heat sink.

公开(公告)号：US20230381705A1

公开(公告)日：2023-11-30

申请号：US17664925

申请日：2022-05-25

Applicant: International Business Machines Corporation

Inventor： Madhana Sunder ,  Allan Cory VanDeventer ,  Jay A. Bunt ,  Joyce E. Molinelli Acocella ,  Heather Nicole Polgrean ,  Hongqing Zhang ,  Steven H. Boettcher

IPC: B01D46/42 ,  B01D29/13 ,  B01D29/50 ,  B01D29/96 ,  B01D35/02 ,  B01D35/30 ,  B01D46/00 ,  B01D46/24 ,  B01D46/56 ,  B01D37/02

CPC classification number: B01D46/4227 ,  B01D29/13 ,  B01D29/50 ,  B01D29/96 ,  B01D35/02 ,  B01D35/30 ,  B01D46/0012 ,  B01D46/24 ,  B01D46/56 ,  B01D37/025 ,  B01D2201/30 ,  B01D2201/34 ,  B01D2271/02

Abstract: A device that comprises an outer component, an inner component and a filter module. The outer component includes a first hollow cylinder, and exterior ports in sidewalls of the first hollow cylinder. The inner component is positioned coaxially within the first hollow cylinder, and includes a second cylinder, and interior ports in the second cylinder, wherein the interior fluid ports are aligned parallel to the exterior ports. The filter module includes a hollow prism positioned coaxially within the outer component and surrounding the inner component, the hollow prism comprising at least four faces configured to retain filters. The filter module also includes vanes positioned along edges connecting the at least four faces and forming seals with the first hollow cylinder. A first filter is provided on a first face, of the at least four faces, which is aligned between a pair of the interior and exterior ports.

公开(公告)号：US20220155049A1

公开(公告)日：2022-05-19

申请号：US16950855

申请日：2020-11-17

Applicant: International Business Machines Corporation

Inventor： David J. Lewison ,  Jay A. Bunt ,  Frank L. Pompeo ,  Richard Walter Oldrey ,  John D. Sylvestri ,  Phong T. Tran

IPC: G01B5/20 ,  G01B5/06 ,  G01B5/30

Abstract: A method of preparing a computer processor die includes determining a warpage shape of the computer processor die at a testing temperature. The method also includes selectively contouring a thickness of the computer processor die at a contouring temperature by physically removing material from a surface of the computer processor die such that the surface will be substantially flat at the testing temperature.

公开(公告)号：US11191155B1

公开(公告)日：2021-11-30

申请号：US17117277

申请日：2020-12-10

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Hongqing Zhang ,  Jay A. Bunt ,  Shidong Li ,  Zhigang Song ,  Junjun Li ,  Guoda Lian

IPC: H05K7/00 ,  H05K1/02 ,  H05K3/30

Abstract: Tamper-respondent assemblies are provided which include a circuit board, an enclosure assembly mounted to the circuit board, and a pressure sensor. The circuit board includes an electronic component, and the enclosure assembly is coupled to the circuit board to enclose the electronic component within a secure volume. The enclosure assembly includes an enclosure with a sealed inner compartment, and a structural material within the sealed inner compartment of the enclosure. The structural material within the enclosure inhibits deflection of the enclosure due to a pressure differential between pressure of the sealed inner compartment and pressure around, at least in part, the enclosure. The pressure sensor senses pressure within the sealed inner compartment of the enclosure to facilitate identifying a pressure change indicative of a tamper event.

公开(公告)号：US20210249333A1

公开(公告)日：2021-08-12

申请号：US16787241

申请日：2020-02-11

Applicant: International Business Machines Corporation

Inventor： David J. Lewison ,  Hongqing Zhang ,  Jay A. Bunt ,  Jeffrey A. Zitz ,  Sushumna Iruvanti

IPC: H01L23/40 ,  H01L23/427 ,  F28F13/00

Abstract: An integrated circuit (IC) device package includes an IC device connected to an upper surface of the IC device carrier. Due to operation conditions or IC device package makeup, the IC device may warp. The warped IC device may include a convex upper surface. A conformable lid is connected to the IC device and includes an internal chamber and a deformable floor. The deformable floor is able to deform or bend along with the IC device. After deformation, the deformable floor may include a concave lower surface. A uniform bond line thickness of a thermal interface material that connects the IC device and the conformable lid is able to be achieved due to the deformable floor deforming or bending along with the IC device.

公开(公告)号：US11940271B2

公开(公告)日：2024-03-26

申请号：US16950855

申请日：2020-11-17

Applicant: International Business Machines Corporation

Inventor： David J. Lewison ,  Jay A. Bunt ,  Frank L. Pompeo ,  Richard Walter Oldrey ,  John D. Sylvestri ,  Phong T. Tran

IPC: G01B5/20 ,  G01B5/06 ,  G01B5/30 ,  H01L21/67

CPC classification number: G01B5/20 ,  G01B5/06 ,  G01B5/30 ,  H01L21/67253

Abstract: A method of preparing a computer processor die includes determining a warpage shape of the computer processor die at a testing temperature. The method also includes selectively contouring a thickness of the computer processor die at a contouring temperature by physically removing material from a surface of the computer processor die such that the surface will be substantially flat at the testing temperature.

公开(公告)号：US11716808B2

公开(公告)日：2023-08-01

申请号：US17117267

申请日：2020-12-10

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Hongqing Zhang ,  Arthur J. Higby ,  David J. Lewison ,  Philipp K. Buchling Rego ,  Jay A. Bunt ,  James Busby ,  Levi Campbell

IPC: G08B21/00 ,  H05K1/02 ,  F28F13/00 ,  G08B21/18 ,  H05K7/20

CPC classification number: H05K1/0275 ,  F28F13/003 ,  G08B21/18 ,  H05K7/20445 ,  H05K7/20409 ,  H05K2201/09263 ,  H05K2201/09672 ,  H05K2201/10151

Abstract: Tamper-respondent assemblies are provided which include a circuit board, an enclosure assembly mounted to the circuit board, and a pressure sensor. The circuit board includes an electronic component, and the enclosure assembly is mounted to the circuit board to enclose the electronic component within a secure volume. The enclosure assembly includes a thermally conductive enclosure with a sealed inner compartment, and a porous heat transfer element within the sealed inner compartment. The porous heat transfer element is sized and located to facilitate conducting heat from the electronic component across the sealed inner compartment of the thermally conductive enclosure. The pressure sensor senses pressure within the sealed inner compartment of the thermally conductive enclosure to facilitate identifying a pressure change indicative of a tamper event.

公开(公告)号：US11430710B2

公开(公告)日：2022-08-30

申请号：US16773937

申请日：2020-01-27

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Shidong Li ,  Jay A. Bunt ,  Kenneth C. Marston ,  Hilton Toy ,  Hongqing Zhang ,  David J. Lewison

IPC: H01L23/367 ,  H01L23/00 ,  H01L25/065 ,  H01L23/04

Abstract: An electronic apparatus that includes a semiconductor device; an electronic packaging substrate for receiving the semiconductor device; a thermal interface material on the semiconductor device; and a lid in contact with the thermal interface material and having a zone of targeted flexibility spaced from the semiconductor device.

公开(公告)号：US11158562B2

公开(公告)日：2021-10-26

申请号：US16787241

申请日：2020-02-11

Applicant: International Business Machines Corporation

Inventor： David J. Lewison ,  Hongqing Zhang ,  Jay A. Bunt ,  Jeffrey A. Zitz ,  Sushumna Iruvanti

IPC: H01L23/40 ,  H05K7/20 ,  F28F13/00 ,  H01L23/427

Abstract: An integrated circuit (IC) device package includes an IC device connected to an upper surface of the IC device carrier. Due to operation conditions or IC device package makeup, the IC device may warp. The warped IC device may include a convex upper surface. A conformable lid is connected to the IC device and includes an internal chamber and a deformable floor. The deformable floor is able to deform or bend along with the IC device. After deformation, the deformable floor may include a concave lower surface. A uniform bond line thickness of a thermal interface material that connects the IC device and the conformable lid is able to be achieved due to the deformable floor deforming or bending along with the IC device.