Invention Grant
- Patent Title: Lid/heat spreader having targeted flexibility
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Application No.: US16773937Application Date: 2020-01-27
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Publication No.: US11430710B2Publication Date: 2022-08-30
- Inventor: Shidong Li , Jay A. Bunt , Kenneth C. Marston , Hilton Toy , Hongqing Zhang , David J. Lewison
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agent L. Jeffrey Kelly
- Main IPC: H01L23/367
- IPC: H01L23/367 ; H01L23/00 ; H01L25/065 ; H01L23/04
Abstract:
An electronic apparatus that includes a semiconductor device; an electronic packaging substrate for receiving the semiconductor device; a thermal interface material on the semiconductor device; and a lid in contact with the thermal interface material and having a zone of targeted flexibility spaced from the semiconductor device.
Public/Granted literature
- US20210233825A1 LID/HEAT SPREADER HAVING TARGETED FLEXIBILITY Public/Granted day:2021-07-29
Information query
IPC分类:
