公开(公告)号：US20210028079A1

公开(公告)日：2021-01-28

申请号：US16519277

申请日：2019-07-23

Applicant: International Business Machines Corporation

Inventor： Charles L. Arvin ,  Kevin Drummond ,  Luca Del Carro ,  Thomas Brunschwiler ,  Stephanie Allard ,  Kenneth C. Marston ,  Marcus E. Interrante

IPC: H01L23/10 ,  H01L23/057 ,  H01L23/31 ,  H01L21/56 ,  H01L23/367

Abstract: An IC device package includes a carrier, one or more IC devices and a lid. The lid includes a lid-ridge. The lid is connected to the carrier by connecting the lid-ridge to the carrier with first nano particle metallic paste, prior to connecting the IC device to the carrier. Subsequent to connecting the IC device to the carrier, the lid is connected to the lid-ridge with second nano particle metallic paste. The nano particle metallic paste may be sintered to form a metallic connection. In multi-IC device packages, the lid-ridge may be positioned between the lid and the carrier and between the IC devices.

公开(公告)号：US11152226B2

公开(公告)日：2021-10-19

申请号：US16601799

申请日：2019-10-15

Applicant: International Business Machines Corporation

Inventor： Kevin Drummond ,  Thomas Lombardi ,  Steve Ostrander ,  Stephanie Allard ,  Catherine Dufort

IPC: H01L21/56 ,  H01L23/00 ,  H05K3/32 ,  H05K1/11

Abstract: A structure with controlled capillary coverage is provided and includes a substrate including one or more first contacts, a component and adhesive. The component includes one or more second contacts and a rib disposed at a distance from each of the one or more second contacts. The component is disposed such that the one or more second contacts are communicative with the one or more first contacts and corresponding surfaces of the substrate and the rib face each other at a controlled gap height to define a fill-space. The adhesive is dispensed at a discrete point whereby the adhesive is drawn to fill the fill-space by capillary action.

公开(公告)号：US10993324B2

公开(公告)日：2021-04-27

申请号：US16451367

申请日：2019-06-25

Applicant: International Business Machines Corporation

Inventor： Charles Leon Arvin ,  Mark K. Hoffmeyer ,  Kevin Drummond ,  Chris Muzzy

IPC: H05K1/14 ,  H01R13/11 ,  H01R12/52 ,  H01R12/71 ,  H05K1/18

Abstract: A modified socket mechanism comprises a printed circuit board and a connector component located on a first face of the printed circuit board. The modified socket mechanism may comprise a first region of electrical contacts located on the first face. The first region of electrical contacts may be designed to interface with a processor module. The modified socket mechanism may also comprise a second region of electrical contacts located on a second face of the printed circuit board. The second region of electrical contacts may be designed to interface with a motherboard. The modified socket mechanism may also comprise a first electrical connection between the connector component and the first region of electrical contacts through the printed circuit board. Finally, the modified socket mechanism may also comprise a second electrical connection between the first region of electrical contacts and the second region of electrical contacts through the printed circuit board.

公开(公告)号：US11164804B2

公开(公告)日：2021-11-02

申请号：US16519277

申请日：2019-07-23

Applicant: International Business Machines Corporation

Inventor： Charles L. Arvin ,  Kevin Drummond ,  Luca Del Carro ,  Thomas Brunschwiler ,  Stephanie Allard ,  Kenneth C. Marston ,  Marcus E. Interrante

IPC: H01L23/10 ,  H01L23/31 ,  H01L21/56 ,  H01L23/053 ,  H01L23/057 ,  H01L23/367 ,  H01L25/065 ,  H01L23/00

Abstract: An IC device package includes a carrier, one or more IC devices and a lid. The lid includes a lid-ridge. The lid is connected to the carrier by connecting the lid-ridge to the carrier with first nano particle metallic paste, prior to connecting the IC device to the carrier. Subsequent to connecting the IC device to the carrier, the lid is connected to the lid-ridge with second nano particle metallic paste. The nano particle metallic paste may be sintered to form a metallic connection. In multi-IC device packages, the lid-ridge may be positioned between the lid and the carrier and between the IC devices.

公开(公告)号：US11152282B1

公开(公告)日：2021-10-19

申请号：US16906015

申请日：2020-06-19

Applicant: International Business Machines Corporation

Inventor： Charles Leon Arvin ,  Kevin Drummond ,  Kenneth Charles Marston ,  Chris Muzzy ,  Sushumna Iruvanti

IPC: H01L23/36 ,  H01L23/433 ,  H01L21/48

Abstract: An IC device package includes an IC device that is connected to a lid by a thermal interface material (TIM). A catalyst material is formed upon one or more regions upon an upper surface of the IC device and/or an under surface of the lid. The catalyst material increases the rate of crosslinking of polymer chains of the TIM during TIM curing and/or increases the strength of crosslinks that link polymer chains of the TIM during TIM curing. The catalytically enhanced regions have a higher coefficient of heat transfer relative to non-catalytically enhanced regions. Therefore, the catalytically enhanced regions efficiently transfer heat from the IC device to the lid.

公开(公告)号：US20210111039A1

公开(公告)日：2021-04-15

申请号：US16601799

申请日：2019-10-15

Applicant: International Business Machines Corporation

Inventor： Kevin Drummond ,  Thomas Lombardi ,  Steve Ostrander ,  Stephanie Allard ,  Catherine Dufort

IPC: H01L21/56 ,  H01L23/00 ,  H05K3/32 ,  H05K1/11

Abstract: A structure with controlled capillary coverage is provided and includes a substrate including one or more first contacts, a component and adhesive. The component includes one or more second contacts and a rib disposed at a distance from each of the one or more second contacts. The component is disposed such that the one or more second contacts are communicative with the one or more first contacts and corresponding surfaces of the substrate and the rib face each other at a controlled gap height to define a fill-space. The adhesive is dispensed at a discrete point whereby the adhesive is drawn to fill the fill-space by capillary action.