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公开(公告)号：US10701833B2
公开(公告)日：2020-06-30
申请号：US15712068
申请日：2017-09-21
Applicant: Apple Inc.
Inventor： David A. Pakula , Daniel W. Jarvis , Gregory N. Stephens , Ian A. Spraggs , James A. Bertin , Eric M. Bennett , Simon C. Helmore , Melissa A. Wah , Matthew D. Hill , Jon F. Housour , Douglas G. Fournier , Christopher S. Tomasetta
IPC: H01M10/44 , H01M10/46 , H05K7/20 , G06F1/16 , H05K9/00 , H05K1/14 , G06F3/041 , H01M2/10 , H05K1/02 , H01M2/08 , H02J7/00 , G06F3/044
Abstract: An electronic device having a battery assembly is disclosed. Unlike traditional battery assemblies that include rectilinear electrodes with two sides of equal length, the battery assemblies described herein may include electrodes having a shape/configuration resembling an L-shape electrode used to form chemical reactions in order to generate electrical energy. However, other shapes/configurations are possible. The shape/configuration of the housing of the battery assembly confirms to the shape/configuration of the electrodes. Further, in order to accommodate an internal component (such as a circuit board assembly), the shape of the battery assembly provides additional space in the electronic device. In order to form the electrodes, the electrodes may undergo a die cutting operation. Also, the housing may include a channel, or reduced dimension, that accommodates a flexible circuit in the electronic device that passes over the battery assembly at the channel.
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公开(公告)号：US10386970B2
公开(公告)日：2019-08-20
申请号：US14766639
申请日：2014-02-06
Applicant: Apple Inc.
Inventor： Jonah A. Harley , Peter W. Richards , Brian Q. Huppi , Omar Sze Leung , Dhaval N. Shah , Martin P. Grunthaner , Steven P. Hotelling , Miguel C Christophy , Vivek Katiyar , Tang Yew Tan , Christopher J. Butler , Erik G. de Jong , Ming Sartee , Rui Qiao , Steven J. Martisauskas , Storrs T. Hoen , Richard Hung Minh Dinh , Lee E. Hooton , Ian A. Spraggs , Sawyer I. Cohen , David A. Pakula
Abstract: A device configured to determine the location and magnitude of a touch on a surface of the device. The device includes a transparent touch sensor that is configured to detect a location of a touch on the transparent touch sensor. The device also includes a force-sensing structure disposed at the periphery of the transparent touch sensor. The force sensor includes an upper capacitive plate and a compressible element disposed on one side of the upper capacitive plate. The force sensor also includes a lower capacitive plate disposed on a side of the compressible element that is opposite the upper capacitive plate.
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公开(公告)号：USD849009S1
公开(公告)日：2019-05-21
申请号：US29612836
申请日：2017-08-04
Applicant: Apple Inc.
Designer： Jody Akana , Molly Anderson , Bartley K. Andre , Shota Aoyagi , Anthony Michael Ashcroft , Marine C. Bataille , Jeremy Bataillou , Daniele De Iuliis , Markus Diebel , M. Evans Hankey , Julian Hoenig , Lee E. Hooton , Richard P. Howarth , Jonathan P. Ive , Julian Jaede , Daniel W. Jarvis , Duncan Robert Kerr , David A. Pakula , Michael D. Quinones , Marwan Rammah , Peter Russell-Clarke , Benjamin Andrew Shaffer , Mikael Silvanto , Christopher J. Stringer , Joe Sung Ho Tan , Tang Yew Tan , Clement Tissandier , Eugene Antony Whang , Rico Zörkendörfer
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公开(公告)号：USD831025S1
公开(公告)日：2018-10-16
申请号：US29613506
申请日：2017-08-10
Applicant: Apple Inc.
Designer： Jody Akana , Molly Anderson , Bartley K. Andre , Shota Aoyagi , Anthony Michael Ashcroft , Marine C. Bataille , Jeremy Bataillou , James A. Bertin , Daniele De Iuliis , Markus Diebel , David J. Dunsmoor , M. Evans Hankey , Matthew David Hill , Julian Hoenig , Richard P. Howarth , Stoyan P. Hristov , Jonathan P. Ive , Julian Jaede , Duncan Robert Kerr , David A. Pakula , Peter Russell-Clarke , Benjamin Andrew Shaffer , Mikael Silvanto , Ian Spraggs , Christopher J. Stringer , Joe Sung Ho Tan , Tang Yew Tan , Clement Tissandier , Melissa A. Wah , Eugene Antony Whang , Rico Zörkendörfer
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公开(公告)号：US20180098444A1
公开(公告)日：2018-04-05
申请号：US15832606
申请日：2017-12-05
Applicant: Apple Inc.
Inventor： Bryan P. Kiple , Charles B. Woodhull , David A. Pakula , Tang Y. Tan
IPC: H05K5/04 , B23P17/00 , B23P11/00 , G03F1/38 , H04M1/02 , H01Q1/24 , H05K5/02 , B23C5/10 , H04M1/11 , B23C5/00 , B23P17/02 , C25D11/34
CPC classification number: H05K5/04 , B23C5/00 , B23C5/1081 , B23C2220/04 , B23C2220/16 , B23C2220/20 , B23C2220/28 , B23C2220/48 , B23C2226/31 , B23C2226/315 , B23P11/00 , B23P17/00 , B23P17/02 , C25D7/00 , C25D11/02 , C25D11/022 , C25D11/12 , C25D11/246 , C25D11/34 , G03F1/38 , H01Q1/243 , H01Q1/42 , H04M1/0249 , H04M1/0254 , H04M1/11 , H05K5/02 , H05K5/0217 , H05K5/0243 , H05K5/0247 , H05K5/03 , H05K13/00 , Y10T29/47 , Y10T29/49002 , Y10T29/49826 , Y10T156/10 , Y10T156/1064 , Y10T407/1906 , Y10T409/300896 , Y10T409/303752 , Y10T409/30952
Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.
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Patent Agency Ranking
公开(公告)号：US20180092213A1
公开(公告)日：2018-03-29
申请号：US15710579
申请日：2017-09-20
Applicant: Apple Inc.
Inventor： Corey S. Provencher , Meng Chi Lee , Derek J. Walters , Ian A. Spraggs , Flynn P. Carson , Shakti S. Chauhan , Daniel W. Jarvis , David A. Pakula , Jun Zhai , Michael V. Yeh , Alex J. Crumlin , Dennis R. Pyper , Amir Salehi , Vu T. Vo , Gregory N. Stephens
CPC classification number: H05K1/181 , H05K1/0298 , H05K1/113 , H05K1/115 , H05K1/144 , H05K3/0014 , H05K3/284 , H05K3/341 , H05K3/3436 , H05K2201/10159 , H05K2201/10674 , H05K2203/1316 , Y02P70/611
Abstract: The present disclosure is related to printed circuit board packages and methods of assembly that may be used in the fabrication of electrical devices. Printed circuit board packages may be manufactured by stacking printed circuit board assemblies. Each printed circuit board assembly may have multiple printed circuit boards supported by a resin mold. The printed circuit board assemblies may be shaped to improve space utilization efficiency and to accommodate large electrical components that are attached to the printed circuit board package.
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公开(公告)号：US20180084323A1
公开(公告)日：2018-03-22
申请号：US15699064
申请日：2017-09-08
Applicant: Apple Inc.
Inventor： Thomas R. Luce , Anthony P. Grazian , Hongdan Tao , Christopher Wilk , Daniel W. Jarvis , David A. Pakula
CPC classification number: H04R1/025 , H04R1/023 , H04R1/028 , H04R1/2811 , H04R7/18 , H04R9/025 , H04R9/06 , H04R2400/11 , H04R2499/11
Abstract: An electronic device is disclosed that includes one or more sealed audio modules that are unaffected by changes in the internal pressure within the electronic device. The audio modules can also include one or more features that increase the audible bandwidth of the electronic device.
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公开(公告)号：US09759988B2
公开(公告)日：2017-09-12
申请号：US15264394
申请日：2016-09-13
Applicant: Apple Inc.
Inventor： Marwan Rammah , Eric N. Nyland , Matthew D. Hill , Sawyer I. Cohen , Scott A. Myers , David A. Pakula , Michael Benjamin Wittenberg , Ashutosh Y. Shukla
CPC classification number: G03B17/12 , G02B7/003 , G03B17/02 , G03B43/00 , H04M1/0264 , H04N5/2257
Abstract: An electronic device having a securing member for a camera module is disclosed. The securing member may include several flexible spring elements extending around the camera module to maintain the position of the camera module during an assembly process of the electronic device. The securing member and the housing may be made from an electrically conductive material or materials. In this manner, the securing member may further provide the camera module with an electrical ground to prevent excessive electric charge within the camera module. In some embodiments, an alignment member is positioned on the housing and aligns the camera module and/or securing member with an aperture of the housing.
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公开(公告)号：US09538272B2
公开(公告)日：2017-01-03
申请号：US14659319
申请日：2015-03-16
Applicant: APPLE INC.
Inventor： Martin J. Auclair , Jared M. Kole , Ashutosh Y. Shukla , Scott A. Myers , David A. Pakula , Marwan Rammah
CPC classification number: H04R1/023 , G06F1/1626 , G06F1/1656 , G06F1/1688 , G10K11/18 , H04R1/086 , H04R25/654 , H04R2499/11
Abstract: An acoustically permeable material is disposed within an aperture of an electronic device to provide aesthetic appeal for the electronic device and protection for an acoustic device mounted within the electronic device. A stiffener is used in conjunction with the acoustically permeable material to improve its ability to resist permanent mechanical deformation from external forces. In some embodiments the stiffener may have multiple cavities enabling improved isolation between multiple acoustic devices within the same aperture. Other methods of employing acoustically permeable materials are disclosed that improve the aesthetic appeal, acoustic performance and/or manufacturability of the electronic device.
Abstract translation: 声透性材料设置在电子设备的孔内，以为电子设备提供美观的吸引力，并且保护安装在电子设备内的声学设备。 加强筋与声透射材料结合使用，以提高其抗外力的永久性机械变形的能力。 在一些实施例中，加强件可以具有多个空腔，从而能够改善在同一孔内的多个声学装置之间的隔离。 公开了采用声透射材料的其它方法，其提高了电子设备的美学吸引力，声学性能和/或可制造性。
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公开(公告)号：USD769833S1
公开(公告)日：2016-10-25
申请号：US29501054
申请日：2014-08-29
Applicant: Apple Inc.
Designer： Shota Aoyagi , Richard P. Howarth , Shayan Malek , Scott A. Myers , David A. Pakula , Gregory Nicolaus Stephens
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