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公开(公告)号：US20180092213A1
公开(公告)日：2018-03-29
申请号：US15710579
申请日：2017-09-20
Applicant: Apple Inc.
Inventor： Corey S. Provencher , Meng Chi Lee , Derek J. Walters , Ian A. Spraggs , Flynn P. Carson , Shakti S. Chauhan , Daniel W. Jarvis , David A. Pakula , Jun Zhai , Michael V. Yeh , Alex J. Crumlin , Dennis R. Pyper , Amir Salehi , Vu T. Vo , Gregory N. Stephens
CPC classification number: H05K1/181 , H05K1/0298 , H05K1/113 , H05K1/115 , H05K1/144 , H05K3/0014 , H05K3/284 , H05K3/341 , H05K3/3436 , H05K2201/10159 , H05K2201/10674 , H05K2203/1316 , Y02P70/611
Abstract: The present disclosure is related to printed circuit board packages and methods of assembly that may be used in the fabrication of electrical devices. Printed circuit board packages may be manufactured by stacking printed circuit board assemblies. Each printed circuit board assembly may have multiple printed circuit boards supported by a resin mold. The printed circuit board assemblies may be shaped to improve space utilization efficiency and to accommodate large electrical components that are attached to the printed circuit board package.
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公开(公告)号：US09520645B2
公开(公告)日：2016-12-13
申请号：US14262574
申请日：2014-04-25
Applicant: Apple Inc.
Inventor： Derek J. Walters , Michael Eng , Brian S. Tryon , Connor R. Duke , Kieran Poulain , Nicholas J. Kunst , Shaohai Chen , Shaoqing Xiang , Sung Woo Yoo , Chun Cheng Teo , Paul Nangeroni , Eric Steven Jol
Abstract: A wireless electronic device may be provided with components such as electrical and structural components. During transmission of radio-frequency signals, antennas and wireless communications circuitry of the wireless electronic device may produce associated time-varying magnetic fields. One or more components may be covered with magnetic-resistant shield structures that protect the components from the time-varying magnetic fields by preventing magnetic-induced vibrations. The magnetic-resistant shield structures may include a conductive base layer such a layer of brass. A magnetic-resistant layer may be plated onto the conductive base layer. The magnetic-resistant layer may be formed from an amorphous nickel-phosphorous alloy. The amorphous nickel-phosphorous alloy may be produced by controlling the manufacturing temperature and proportion of phosphorous in the alloy while performing the plating operations within a length of time that ensures non-equilibrium conditions during the plating operations.
Abstract translation: 无线电子设备可以设置有诸如电气和结构部件的部件。 在射频信号的传输期间，无线电子设备的天线和无线通信电路可产生相关联的时变磁场。 一个或多个部件可以用防磁屏蔽结构覆盖，该结构通过防止磁致振动来保护部件免受时变磁场的影响。 磁性屏蔽结构可以包括导电基底层，例如黄铜层。 可以将耐磁层电镀到导电基底层上。 耐磁层可以由非晶镍 - 磷合金形成。 可以通过在确保电镀操作期间的非平衡条件的时间长度内进行电镀操作来控制合金中的磷的制造温度和比例来制造无定形镍 - 磷合金。
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公开(公告)号：US10455738B2
公开(公告)日：2019-10-22
申请号：US15712071
申请日：2017-09-21
Applicant: Apple Inc.
Inventor： David A. Pakula , Daniel W. Jarvis , Gregory N. Stephens , Ian A. Spraggs , Vu Thanh Vo , Amir Salehi , Dennis R. Pyper , Alex J. Crumlin , Corey S. Provencher , Derek J. Walters , Michael V. Yeh
IPC: H05K5/02 , H04B1/03 , H05K7/20 , G06F3/041 , H01M2/10 , H05K1/02 , H05K1/14 , G06F1/16 , H05K9/00 , H01M2/08 , H02J7/00 , G06F3/044
Abstract: A circuit board assembly in an electronic is disclosed. To conserve space in the electronic device, the circuit board assembly includes stacked circuit boards in electrical communication with each other, such as a first circuit board stacked over a second circuit board. Each circuit board may include multiple surfaces that carry operational components. Moreover, the first circuit board may include a first surface and the second circuit board may include a second surface facing the first surface. The first and second surfaces may include operational components in corresponding locations. Also, the operational components may include corresponding shapes such that one component is positioned in another component. The components may electrically connect to each other. Also, the circuit board assembly may include EMI shields around an outer perimeter in order to shield the operational components form EMI and to components in the electronic device from EMI emanating from the operational components.
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公开(公告)号：US20150070236A1
公开(公告)日：2015-03-12
申请号：US14262574
申请日：2014-04-25
Applicant: Apple Inc.
Inventor： Derek J. Walters , Michael Eng , Brian S. Tryon , Connor R. Duke , Kieran Poulain , Nicholas J. Kunst , Shaohai Chen , Shaoqing Xiang , Sung Woo Yoo , Chun Cheng Teo , Paul Nangeroni , Eric Steven Jol
Abstract: A wireless electronic device may be provided with components such as electrical and structural components. During transmission of radio-frequency signals, antennas and wireless communications circuitry of the wireless electronic device may produce associated time-varying magnetic fields. One or more components may be covered with magnetic-resistant shield structures that protect the components from the time-varying magnetic fields by preventing magnetic-induced vibrations. The magnetic-resistant shield structures may include a conductive base layer such a layer of brass. A magnetic-resistant layer may be plated onto the conductive base layer. The magnetic-resistant layer may be formed from an amorphous nickel-phosphorous alloy. The amorphous nickel-phosphorous alloy may be produced by controlling the manufacturing temperature and proportion of phosphorous in the alloy while performing the plating operations within a length of time that ensures non-equilibrium conditions during the plating operations.
Abstract translation: 无线电子设备可以设置有诸如电气和结构部件的部件。 在射频信号的传输期间，无线电子设备的天线和无线通信电路可产生相关联的时变磁场。 一个或多个部件可以用防磁屏蔽结构覆盖，该结构通过防止磁致振动来保护部件免受时变磁场的影响。 磁性屏蔽结构可以包括导电基底层，例如黄铜层。 可以将耐磁层电镀到导电基底层上。 耐磁层可以由非晶镍 - 磷合金形成。 可以通过在确保电镀操作期间的非平衡条件的时间长度内进行电镀操作来控制合金中的磷的制造温度和比例来制造无定形镍 - 磷合金。
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