公开(公告)号：US10455738B2

公开(公告)日：2019-10-22

申请号：US15712071

申请日：2017-09-21

Applicant: Apple Inc.

Inventor： David A. Pakula ,  Daniel W. Jarvis ,  Gregory N. Stephens ,  Ian A. Spraggs ,  Vu Thanh Vo ,  Amir Salehi ,  Dennis R. Pyper ,  Alex J. Crumlin ,  Corey S. Provencher ,  Derek J. Walters ,  Michael V. Yeh

IPC: H05K5/02 ,  H04B1/03 ,  H05K7/20 ,  G06F3/041 ,  H01M2/10 ,  H05K1/02 ,  H05K1/14 ,  G06F1/16 ,  H05K9/00 ,  H01M2/08 ,  H02J7/00 ,  G06F3/044

Abstract: A circuit board assembly in an electronic is disclosed. To conserve space in the electronic device, the circuit board assembly includes stacked circuit boards in electrical communication with each other, such as a first circuit board stacked over a second circuit board. Each circuit board may include multiple surfaces that carry operational components. Moreover, the first circuit board may include a first surface and the second circuit board may include a second surface facing the first surface. The first and second surfaces may include operational components in corresponding locations. Also, the operational components may include corresponding shapes such that one component is positioned in another component. The components may electrically connect to each other. Also, the circuit board assembly may include EMI shields around an outer perimeter in order to shield the operational components form EMI and to components in the electronic device from EMI emanating from the operational components.

公开(公告)号：US20180013311A1

公开(公告)日：2018-01-11

申请号：US15587272

申请日：2017-05-04

Applicant: Apple Inc.

Inventor： Corey S. Provencher ,  Michael V. Yeh ,  Jason L. Pang

IPC: H02J7/02 ,  H01M10/615 ,  H01M10/6571 ,  H01M10/48

CPC classification number: H02J7/025 ,  H01M10/486 ,  H01M10/488 ,  H01M10/615 ,  H01M10/6571 ,  H01M2220/30 ,  H02J50/10

Abstract: A wireless power transmitting device may transmit wireless power signals to a wireless power receiving electronic device. The electronic device may have a coil that receives the transmitted wireless power signals and may have a power receiving circuit that rectifies the received wireless power signals to produce a corresponding direct-current voltage signal. The direct-current signal may be used to power circuitry in the electronic device and may be used to charge a battery in the electronic device. Control circuitry in the electronic device may use a temperature sensor to make temperature measurements. In response to detecting that the device is below a given threshold temperature and based on other information such as information on which applications are running on a controller in device, the device may supply drive current signals to the coil to heat the battery and improve battery performance.

公开(公告)号：US09329685B1

公开(公告)日：2016-05-03

申请号：US13799098

申请日：2013-03-13

Applicant: Apple Inc.

Inventor： Paul G. Puskarich ,  Corey S. Provencher ,  Craig C. Leong ,  Brandon D. Slack

IPC: G08B21/00 ,  G06F3/01 ,  G06F3/045 ,  G06F3/02 ,  G01G9/00 ,  G01G3/14

CPC classification number: G06F3/0414 ,  H03K17/962 ,  H03K17/975

Abstract: Systems and methods for controlling electronic devices using force sensors include a plurality of force sensors configured such that they are operable to support one or more housings on one or more surfaces. When force is exerted on the housing, this force is measured by the force sensors as force data. This force data is interpreted as at least one input for an electronic device. In some implementations, the electronic device may include various different statuses. In such implementations, the status of the electronic device may be determined and the input that the force data is interpreted as may depend on the determined status of the electronic device. In various cases, the status of the electronic device may be a combination of one or more different statuses.

Abstract translation: 用于使用力传感器控制电子设备的系统和方法包括多个力传感器，其被配置为使得它们可操作以支撑一个或多个表面上的一个或多个壳体。 当力被施加在壳体上时，该力由力传感器作为力数据测量。 该力数据被解释为用于电子设备的至少一个输入。 在一些实现中，电子设备可以包括各种不同的状态。 在这样的实现中，可以确定电子设备的状态，并且将力数据解释为的输入可以取决于所确定的电子设备的状态。 在各种情况下，电子设备的状态可以是一种或多种不同状态的组合。

公开(公告)号：US11650484B1

公开(公告)日：2023-05-16

申请号：US16943835

申请日：2020-07-30

Applicant: Apple Inc.

Inventor： Rong Liu ,  Benjamin M. Oztalay ,  Chenhua You ,  Corey S. Provencher ,  Florence W. Ow ,  Jeremy L. Britt ,  Joshua A. Spechler ,  Jun Qi ,  Ling Han ,  Shaofeng Liu ,  Sherry Cao ,  Tavys Q. Ashcroft ,  Victor H. Yin ,  Wenyong Zhu ,  Ziruo Hong ,  Janos C. Keresztes ,  Hung Sheng Lin

IPC: G03B17/18 ,  F21V3/06 ,  H04N5/232 ,  F21Y113/17 ,  F21Y115/10 ,  F21Y115/30 ,  F21W111/00

CPC classification number: G03B17/18 ,  F21V3/0625 ,  H04N5/23229 ,  F21W2111/00 ,  F21Y2113/17 ,  F21Y2115/10 ,  F21Y2115/30

Abstract: An electronic device may have a camera. The camera may capture still and moving images. A camera status indicator may be included in the electronic device. The camera status indicator may emit light to indicate when the camera is in use capturing video or other images. The camera status indicator may have multiple light-emitting devices such as light-emitting diodes or lasers. The light-emitting devices may have different colors. Clear encapsulant may cover the light-emitting devices. A white polymer wall or other light recycling structure may run along an outer peripheral edge of the encapsulant. A light diffusing coating layer may coat an outer surface of the clear encapsulant. Light reflections from the status indicator may be reduced in captured images.

公开(公告)号：US20180092213A1

公开(公告)日：2018-03-29

申请号：US15710579

申请日：2017-09-20

Applicant: Apple Inc.

Inventor： Corey S. Provencher ,  Meng Chi Lee ,  Derek J. Walters ,  Ian A. Spraggs ,  Flynn P. Carson ,  Shakti S. Chauhan ,  Daniel W. Jarvis ,  David A. Pakula ,  Jun Zhai ,  Michael V. Yeh ,  Alex J. Crumlin ,  Dennis R. Pyper ,  Amir Salehi ,  Vu T. Vo ,  Gregory N. Stephens

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/34

CPC classification number: H05K1/181 ,  H05K1/0298 ,  H05K1/113 ,  H05K1/115 ,  H05K1/144 ,  H05K3/0014 ,  H05K3/284 ,  H05K3/341 ,  H05K3/3436 ,  H05K2201/10159 ,  H05K2201/10674 ,  H05K2203/1316 ,  Y02P70/611

Abstract: The present disclosure is related to printed circuit board packages and methods of assembly that may be used in the fabrication of electrical devices. Printed circuit board packages may be manufactured by stacking printed circuit board assemblies. Each printed circuit board assembly may have multiple printed circuit boards supported by a resin mold. The printed circuit board assemblies may be shaped to improve space utilization efficiency and to accommodate large electrical components that are attached to the printed circuit board package.