Acoustic module for handheld electronic device

    公开(公告)号:US12225146B2

    公开(公告)日:2025-02-11

    申请号:US17472140

    申请日:2021-09-10

    Applicant: Apple Inc.

    Abstract: A portable electronic device may include a touch-sensitive display, a housing at least partially enclosing the touch-sensitive display, the housing defining an audio port along a side of the housing, the audio port defining a partially enclosed volume, and an acoustic module positioned within the housing and including an audio enclosure defining a first passage and a second passage, a microphone operably coupled to the partially enclosed volume of the audio port by the first passage, a pressure sensor operably coupled to the partially enclosed volume of the audio port by the second passage, and an acoustic mesh positioned between an end of the second passage and the audio port.

    Electronic Device Having a Composite Structure

    公开(公告)号:US20200007670A1

    公开(公告)日:2020-01-02

    申请号:US16569525

    申请日:2019-09-12

    Applicant: Apple Inc.

    Abstract: Embodiments are directed to an enclosure for an electronic device. In one aspect, an embodiment includes an enclosure having an enclosure component and an internal component that may be affixed along a bonding region. The enclosure component may be formed from an enclosure material and defines an exterior surface of the enclosure and an opening configured to receive a display. The internal component may be formed from a metal material different than the enclosure material. The bonding region may include an interstitial material that has a melting temperature that is less than a melting temperature of either one of the enclosure material or the metal material. The bonding region may also include one or more of the enclosure material or the metal material.

    Electronic Device Having a Composite Structure

    公开(公告)号:US20180084653A1

    公开(公告)日:2018-03-22

    申请号:US15606920

    申请日:2017-05-26

    Applicant: Apple Inc.

    Abstract: Embodiments are directed to an enclosure for an electronic device. In one aspect, an embodiment includes an enclosure having an enclosure component and an internal component that may be affixed along a bonding region. The enclosure component may be formed from an enclosure material and defines an exterior surface of the enclosure and an opening configured to receive a display. The internal component may be formed from a metal material different than the enclosure material. The bonding region may include an interstitial material that has a melting temperature that is less than a melting temperature of either one of the enclosure material or the metal material. The bonding region may also include one or more of the enclosure material or the metal material.

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