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399 条记录 (耗时 0.02 秒)

    Component-embedded module and manufacturing method thereof
    91.
    发明授权
    Component-embedded module and manufacturing method thereof 有权
    组件嵌入式模块及其制造方法

    公开(公告)号：US08072769B2

    公开(公告)日：2011-12-06

    申请号：US12579617

    申请日：2009-10-15

    申请人： Tsutomu Ieki ,  Kazuyuki Yuda

    发明人： Tsutomu Ieki ,  Kazuyuki Yuda

    IPC分类号： H05K1/18

    CPC分类号： H05K1/141 ,  H01L23/552 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15192 ,  H01L2924/15313 ,  H01L2924/19105 ,  H05K1/0218 ,  H05K1/183 ,  H05K1/187 ,  H05K3/007 ,  H05K3/20 ,  H05K3/284 ,  H05K3/303 ,  H05K3/46 ,  H05K3/4694 ,  H05K3/4697 ,  H05K2201/0715 ,  H05K2201/0979 ,  H05K2201/09972 ,  H05K2203/016 ,  H05K2203/167 ,  Y10T29/4913 ,  H01L2224/0401

    摘要： A component-embedded module includes a module substrate having wiring electrodes on the upper surface thereof, first circuit components mounted on the wiring electrodes, a sub-module disposed on an area on which no wiring electrodes are provided, and an insulating resin layer provided on substantially the entire upper surface of the module substrate such that the insulating resin layer covers at least a portion of the first circuit components and sub-module. The second circuit components including an integrated circuit element are mounted on the sub-module or embedded therein. Via conductors are provided through the module substrate from the lower surface thereof and are directly coupled to terminal electrodes on the lower surface of the sub-module. By using a substrate having a wiring greater accuracy than that of the module substrate, a reliable component-embedded module is obtained.

    摘要翻译： 组件嵌入式模块包括在其上表面上具有布线电极的模块基板，安装在布线电极上的第一电路部件，设置在不设有布线电极的区域上的子模块以及设置在其上的绝缘树脂层 基本上整个模块基板的上表面，使得绝缘树脂层覆盖第一电路部件和子模块的至少一部分。 包括集成电路元件的第二电路部件安装在子模块上或嵌入其中。 通孔导体通过模块基板从其下表面提供，并且直接耦合到子模块的下表面上的端子电极。 通过使用具有比模块基板的布线精度更高的布线的基板，获得了可靠的部件嵌入式模块。

    METHOD FOR PRODUCING A FLEXIBLE CIRCUIT CONFIGURATION
    92.
    发明申请
    METHOD FOR PRODUCING A FLEXIBLE CIRCUIT CONFIGURATION 有权
    生产柔性电路配置的方法

    公开(公告)号：US20110274829A1

    公开(公告)日：2011-11-10

    申请号：US12896350

    申请日：2010-10-01

    申请人： Ernst Feurer ,  Bruno Holl ,  Alexander Kaiser ,  Karin Ruess

    发明人： Ernst Feurer ,  Bruno Holl ,  Alexander Kaiser ,  Karin Ruess

    IPC分类号： H05K3/02

    CPC分类号： H05K3/0097 ,  H01L21/4857 ,  H01L21/6835 ,  H01L23/49822 ,  H01L23/4985 ,  H01L2221/68345 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/007 ,  H05K3/4682 ,  H05K2203/016 ,  H05K2203/1536 ,  H01L2924/00

    摘要： For a method for producing a flexible circuit configuration in the form of a layer sequence of at least one insulating layer and at least one conductive layer, typically multiple insulating layers (N1, N2, N3, NF) and multiple structured conductive layers (L1, L2), the layer sequence for the flexible circuit configuration is deposited on a rigid substrate so that the adhesion of the layer sequence with respect to the substrate is less in an inner area, in which at least one, preferably multiple flexible circuit configurations are created, than in an edge area (RB) which surrounds the inner area (ZB). An intermediate layer can advantageously be deposited for this purpose in the edge area, which causes a stronger adhesion of the layer sequence over the edge area than the inner area, which is not provided with an intermediate layer.

    摘要翻译： 对于以至少一个绝缘层和至少一个导电层（通常为多个绝缘层（N1，N2，N3，NF））和多个结构化导电层（L1，N2）的层序列形式的柔性电路结构的制造方法， L2），用于柔性电路配置的层序列沉积在刚性衬底上，使得层序列相对于衬底的粘附力在内部区域中较少，其中至少一个，优选地多个柔性电路配置被创建 ，而不是围绕内部区域（ZB）的边缘区域（RB）。 中间层可以有利地沉积在边缘区域中，这使得层序列在边缘区域上比不具有中间层的内部区域更强的附着。

    Imaging module and method of manufacturing imaging module
    94.
    发明授权
    Imaging module and method of manufacturing imaging module 有权
    成像模块及成像模块制造方法

    公开(公告)号：US07808551B2

    公开(公告)日：2010-10-05

    申请号：US11934420

    申请日：2007-11-02

    申请人： Hiroshi Ito ,  You Kondoh ,  Mikio Nakamura

    发明人： Hiroshi Ito ,  You Kondoh ,  Mikio Nakamura

    IPC分类号： H04N5/225

    CPC分类号： H04N5/2253 ,  H01L27/14618 ,  H01L2924/0002 ,  H04N2005/2255 ,  H05K1/0274 ,  H05K1/189 ,  H05K3/007 ,  H05K3/4644 ,  H05K2201/09072 ,  H05K2201/10121 ,  H05K2203/016 ,  H01L2924/00

    摘要： An imaging module includes a flexible printed circuit board which has a first area on which a first functional element is mounted, a second area on which a second functional element is mounted, and a third area which is formed between the first area and the second area, an electronic component which is mounted on the first area, and an imaging device which is mounted on the second area. The flexible printed circuit board is formed by an insulating layer which is integrated, spreading over the first area, the second area, and the third area. The flexible printed circuit board is formed such that the flexible printed circuit board can be bent at least in the third area.

    摘要翻译： 成像模块包括柔性印刷电路板，其具有安装有第一功能元件的第一区域，安装有第二功能元件的第二区域和形成在第一区域和第二区域之间的第三区域 安装在第一区域上的电子部件和安装在第二区域上的摄像装置。 柔性印刷电路板由整合在第一区域，第二区域和第三区域上的绝缘层形成。 柔性印刷电路板形成为使得柔性印刷电路板可以至少在第三区域中弯曲。

    Device Carrying an Intergrated Circuit/Components and Method of Producing the Same
    98.
    发明申请
    Device Carrying an Intergrated Circuit/Components and Method of Producing the Same 审中-公开
    装载集成电路的器件及其制造方法

    公开(公告)号：US20100025095A1

    公开(公告)日：2010-02-04

    申请号：US12083442

    申请日：2005-10-12

    申请人： Li Hui Guo ,  Qing Xin Zhang

    发明人： Li Hui Guo ,  Qing Xin Zhang

    IPC分类号： H05K1/16 ,  H05K3/30

    CPC分类号： H05K1/16 ,  H05K3/007 ,  H05K3/4688 ,  H05K2203/0152 ,  H05K2203/016 ,  H05K2203/066 ,  H05K2203/1572 ,  Y10T29/4913

    摘要： A method of forming an integrated circuit component on an insulating substrate (21), comprising providing a first layer arrangement and a second layer arrangement, each layer arrangement comprising a supply substrate and a dielectric layer (17), the dielectric layer of at least one of the layer arrangements comprising the integrated circuit component therein; attaching the first layer arrangement on one surface of the insulating substrate with the dielectric layer of the first layer arrangement facing the insulating substrate, and attaching the second layer arrangement on an opposing surface of the insulating substrate with the dielectric layer of the second layer arrangement facing the insulating substrate, wherein the first layer arrangement and the second layer arrangement are so arranged to sandwich at least a portion of the insulating substrate between the first and second layer arrangements.

    摘要翻译： 一种在绝缘衬底（21）上形成集成电路部件的方法，包括提供第一层布置和第二层布置，每个层布置包括供电基板和介电层（17），所述电介质层至少一个 包括其中的集成电路部件的层布置; 将所述第一层布置在所述绝缘基板的一个表面上，其中所述第一层布置的介电层面向所述绝缘基板，以及将所述第二层布置附接在所述绝缘基板的相对表面上，所述第二层布置的介电层面向 绝缘基板，其中第一层布置和第二层布置被布置成将绝缘基板的至少一部分夹在第一和第二层布置之间。