Bolometer circuitry and methods for difference imaging

    公开(公告)号:US09958332B2

    公开(公告)日:2018-05-01

    申请号:US15483655

    申请日:2017-04-10

    CPC classification number: G01J5/24 G01J1/44 G01J2005/0077 G01J2005/202

    Abstract: Various techniques are disclosed for bolometer circuits and related methods for thermal imaging in a difference domain, where each pixel value represents a difference in incident IR radiation intensity between adjacent bolometers. For example, a bolometer circuit may include an array of bolometers each configured to generate a pixel signal in response to a bias and incident infrared radiation. Each column of the bolometer array may comprise an amplifier, a first plurality of switches each configured to selectively provide a supply voltage to a respective one of bolometers of the each column, a second plurality of switches each configured to selectively route a difference of the pixel signals of a respective adjacent pair of the bolometers of the each column to an input of the amplifier, and a third plurality of switches configured to selectively provide a common voltage to a respective one of the bolometers of the each column.

    Fragment detection method and apparatus

    公开(公告)号:US09910001B2

    公开(公告)日:2018-03-06

    申请号:US14872489

    申请日:2015-10-01

    CPC classification number: G01N25/72 G01J5/0066 G01J5/025 G01J2005/0077

    Abstract: A method and apparatus for detecting machined substrate fragments by thermography. A heat source applies heat to a surface of machined component, the surface providing access to one or more internal chambers within an interior space of the component. The application of heat is sufficient in temperature and duration to cause a fragment temperature elevation rate in at least one machined substrate fragment present in at least one internal chamber that is greater than temperature elevation rate of the component. An IR detection device operably connected to a visual output device captures the IR signal from the component surface following the application of heat and outputs a thermal image of the component. Heat elevation points within the thermal image correspond with the presence of machined substrate fragments within at least one internal chamber of the component.

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