Systems and methods for thermal radiation detection

    公开(公告)号:US11592336B2

    公开(公告)日:2023-02-28

    申请号:US17206177

    申请日:2021-03-19

    Abstract: Systems and methods for thermal radiation detection utilizing a thermal radiation detection system are provided. The thermal radiation detection system includes one or more mercury-cadmium-telluride (HgCdTe)-based photodiode infrared detectors or Indium Antimonide (InSb)-based photodiode infrared detectors and a temperature sensing circuit. The temperature sensing circuit is configured to generate signals correlated to the temperatures of one or more of the plurality of infrared sensor elements. The thermal radiation detection system also includes a signal processing circuit.

    Readout circuits and methods
    6.
    发明授权

    公开(公告)号:US11555744B2

    公开(公告)日:2023-01-17

    申请号:US17048046

    申请日:2019-04-17

    Abstract: Methods of sensor readout and calibration and circuits for performing the methods are disclosed. In some embodiments, the methods include driving an active sensor at a voltage. In some embodiments, the methods include use of a calibration sensor, and the circuits include the calibration sensor. In some embodiments, the methods include use of a calibration current source and circuits include the calibration current source. In some embodiments, a sensor circuit includes a Sigma-Delta ADC. In some embodiments, a column of sensors is readout using first and second readout circuits during a same row time.

    Infrared sensor array with sensors configured for different spectral responses

    公开(公告)号:US11035786B2

    公开(公告)日:2021-06-15

    申请号:US16905871

    申请日:2020-06-18

    Abstract: Improved techniques for infrared imaging and gas detection are provided. In one example, a system includes a sensor array configured to receive infrared radiation from a scene comprising a background portion and a gas. The sensor array includes a first set of infrared sensors configured with a first spectral response corresponding to a first wavelength range of the infrared radiation associated with the background portion. The sensor array also includes a second set of infrared sensors configured with a second spectral response corresponding to a second wavelength range of the infrared radiation associated with the gas. The system also includes a read out integrated circuit (ROIC) configured to provide pixel values for first and second images captured by the first and second sets of infrared sensors, respectively, in response to the received infrared radiation. Additional systems and methods are also provided.

    Low cost and high performance bolometer circuitry and methods

    公开(公告)号:US11015979B2

    公开(公告)日:2021-05-25

    申请号:US16542673

    申请日:2019-08-16

    Abstract: A bolometer circuit may include an active bolometer configured to receive external infrared (IR) radiation. The bolometer circuit may be configured to reduce power consumption at high temperatures. In particular, the bolometer circuit may include additional resistors provided in the resistive loads for bolometer conduction paths to limit power at high temperatures. In some embodiments, the bias (e.g., a voltage level) to the gates of transistors in the resistive loads for the bolometer conduction paths may be adjusted based on temperature to limit power and/or current at high temperatures. In bolometer circuits with a feedback resistor provided across an amplifier to configure a feedback amplifier, a circuit with adjustable amplifier power may be provided to save power. In some embodiments, a bolometer circuits may be provided with reduced gains to allow for very hot scenes to be imaged without railing the output.

    High Dynamic Device for Integrating an Electric Current

    公开(公告)号:US20210072087A1

    公开(公告)日:2021-03-11

    申请号:US16962642

    申请日:2019-02-27

    Applicant: LYNRED

    Abstract: A device of integration of an electric current received on an integration node, includes an operational amplifier, an integration capacitor, and a circuit for modifying an output voltage of the operational amplifier formed by a charge transfer circuit configured to be connected on the integration node and to transfer charges into the integration capacitor. The device also includes a comparison circuit configured to trigger the modification circuit at least once during the integration duration, and a storage circuit configured to store the number of triggerings which have occurred during the integration duration. The received electric current is calculated according to the output voltage as well as to the number of triggerings multiplied by the modification of the output voltage induced by the modification circuit.

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