CONFIGURABLE DIGITAL BLOCK FOR INFRARED SENSORS

    公开(公告)号:US20240175754A1

    公开(公告)日:2024-05-30

    申请号:US18060501

    申请日:2022-11-30

    CPC classification number: G01J5/027 G01J5/24

    Abstract: A sensor device includes an infrared sensor configured to generate sensor data. The sensor device also includes a configurable digital analysis block. The configurable digital analysis block is configured to generate classification data based on the sensor data. The configurable digital analysis block includes a plurality of selectable analysis blocks that can be selectively included in generating the classification data.

    System and method for thermal imaging

    公开(公告)号:US11761821B2

    公开(公告)日:2023-09-19

    申请号:US17547825

    申请日:2021-12-10

    Applicant: Basler AG

    Inventor: Julian Wingert

    CPC classification number: G01J5/24 G01J2005/0077 G01J2005/202

    Abstract: A system with a detector array, a processor unit and a signal interface. The detector array includes a plurality of bolometric measuring cells and a base body. Each measuring cell is configured to detect infrared radiation and to transmit a measurement signal, which is representative of the readings of the measuring cells, to the processor unit. The processor unit is configured to determine a body heat stored by the base body, to determine a predictive value compensated according to the time delay of the respective measuring cell for each current reading, to determine a temperature value corrected according to the measurement error for each current predictive value, and to determine a thermal image based on the current temperature values, allowing an image signal representing the thermal image to be sent from the signal interface. A corresponding method is also provided.

    Snapshot infrared sensor
    5.
    发明授权

    公开(公告)号:US11656129B2

    公开(公告)日:2023-05-23

    申请号:US17628818

    申请日:2020-06-26

    Applicant: LYNRED

    Inventor: Patrick Robert

    CPC classification number: G01J5/24 G01J2005/202

    Abstract: An infrared sensor includes an assembly of pixels juxtaposed in rows and in columns, each pixel integrating an imaging microbolometer and an integrator assembly. The integrator assembly includes a transistor assembled as an amplifier, and a capacitor assembled in feedback on the transistor between an output node and an integration node. The integration node is connected to a skimming transistor operating as a current mirror with a skimming control transistor offset outside of the pixel. A skimming current flowing through the skimming control transistor is controlled according to the temperature of at least one thermalized microbolometer. The current mirror assembly enables to transmit the skimming current flowing through said skimming control transistor onto the integration node so that the capacitor integrates the difference between a current flowing through the imaging microbolometer and the skimming current.

    PHOTOSENSOR
    6.
    发明申请
    PHOTOSENSOR 审中-公开

    公开(公告)号:US20180219047A1

    公开(公告)日:2018-08-02

    申请号:US15939381

    申请日:2018-03-29

    Abstract: A photosensor includes: a first electrode; a second electrode; a photoelectric conversion layer that is located between the first and second electrodes and generates electric charges; a first charge blocking layer located between the first electrode and the photoelectric conversion layer; a second charge blocking layer located between the second electrode and the photoelectric conversion layer; a voltage supply circuit that applies a voltage to at least one of the first and second electrodes such that an electric field is generated in the photoelectric conversion layer; and a detection circuit that detects a signal corresponding to a change in capacitance between the first and second electrodes. The first charge blocking layer suppresses movement of electric charges between the photoelectric conversion layer and the first electrode. The second charge blocking layer suppresses movement of electric charges between the photoelectric conversion layer and the second electrode.

    Bolometer circuitry and methods for difference imaging

    公开(公告)号:US09958332B2

    公开(公告)日:2018-05-01

    申请号:US15483655

    申请日:2017-04-10

    CPC classification number: G01J5/24 G01J1/44 G01J2005/0077 G01J2005/202

    Abstract: Various techniques are disclosed for bolometer circuits and related methods for thermal imaging in a difference domain, where each pixel value represents a difference in incident IR radiation intensity between adjacent bolometers. For example, a bolometer circuit may include an array of bolometers each configured to generate a pixel signal in response to a bias and incident infrared radiation. Each column of the bolometer array may comprise an amplifier, a first plurality of switches each configured to selectively provide a supply voltage to a respective one of bolometers of the each column, a second plurality of switches each configured to selectively route a difference of the pixel signals of a respective adjacent pair of the bolometers of the each column to an input of the amplifier, and a third plurality of switches configured to selectively provide a common voltage to a respective one of the bolometers of the each column.

    LOW COST AND HIGH PERFORMANCE BOLOMETER CIRCUITRY AND METHODS

    公开(公告)号:US20170219436A1

    公开(公告)日:2017-08-03

    申请号:US15484989

    申请日:2017-04-11

    CPC classification number: G01J5/24 G01J1/44 G01J2005/0077 G01J2005/202

    Abstract: A bolometer circuit may include an active bolometer configured to receive external infrared (IR) radiation and a resistive load, which are configured to be connected in series in a bolometer conduction path from a supply voltage node to a common voltage node. A node in the bolometer conduction path between the resistive load and the active bolometer is coupled to a first input of an op-amp. A variable voltage source is coupled to a second input of the op-amp to provide a reference voltage level. The op-amp maintains the reference voltage level at the first input to generate a current flow in response to a resistance change of the active bolometer due to the external IR radiation. The amplifier circuit may be configured as a feedback amplifier or an integrating amplifier. The bolometer circuit may be configured to enable a low-power mode of operation.

    GRAPHENE-BASED INFRARED SINGLE PHOTON DETECTOR
    10.
    发明申请
    GRAPHENE-BASED INFRARED SINGLE PHOTON DETECTOR 有权
    基于石墨的红外单光子探测器

    公开(公告)号:US20170038260A1

    公开(公告)日:2017-02-09

    申请号:US14793418

    申请日:2015-07-07

    Inventor: Kin Chung Fong

    Abstract: A detector for detecting single photons of infrared radiation. In one embodiment a waveguide configured to transmit infrared radiation is arranged to be adjacent a graphene sheet and configured so that evanescent waves from the waveguide overlap the graphene sheet. The graphene sheet has two contacts connected to an amplifier, a power detector, and a pulse detector. An infrared photon absorbed by the graphene sheet from the evanescent waves heats the graphene sheet, which increases the Johnson noise generated at the contacts. The Johnson noise is amplified and the absorption of a photon is detected by the power detector and pulse detector.

    Abstract translation: 用于检测单个光子的红外辐射的检测器。 在一个实施例中,配置成透射红外辐射的波导被布置成与石墨烯片相邻并且被配置为使得来自波导的消逝波与石墨烯片重叠。 石墨烯片具有连接到放大器,功率检测器和脉冲检测器的两个触点。 由ev逝波吸收的石墨烯片的红外光子加热石墨烯片,这增加了在触点处产生的约翰逊噪声。 约翰逊噪声被放大,光子的吸收由功率检测器和脉冲检测器检测。

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