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公开(公告)号:US11685649B2
公开(公告)日:2023-06-27
申请号:US16982519
申请日:2019-03-20
Applicant: Obsidian Sensors, Inc.
Inventor: John Hong , Tallis Chang , Edward Chan , Bing Wen , Yaoling Pan , Kenji Nomura
CPC classification number: B81C1/00269 , B81B7/0038 , B81C1/00285 , B81C2203/019 , B81C2203/0118 , B81C2203/035 , B81C2203/05 , G01J5/20
Abstract: A method of manufacturing MEMS housings includes: providing glass spacers; providing a window plate; attaching the window plate to the glass spacers; aligning the glass spacers with a device glass plate having MEMS devices thereon; bonding the glass spacers to the device glass plate; and singulating the glass spacers, window plate, and device glass plate to produce the MEMS housings.
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公开(公告)号:US12061331B2
公开(公告)日:2024-08-13
申请号:US17207433
申请日:2021-03-19
Applicant: Obsidian Sensors, Inc.
Inventor: John Hong , Tallis Chang , Bing Wen , Edward Chan , Sean Andrews , Heesun Shin
CPC classification number: G02B26/0833 , B81B7/02 , B81C1/00373 , B81B2201/042 , B81B2207/015
Abstract: Microelectromechanical system (MEMS) devices, methods of operating the MEMS device, and methods of manufacturing the MEMS device are disclosed. In some embodiments, the MEMS device includes a glass substrate; an electrode on the glass substrate; a hinge mechanically coupled to the electrode; a membrane mirror mechanically coupled to the hinge; a TFT on the glass substrate and electrically coupled to the electrode; and a control circuit comprising: a multiplexer configured to turn on or turn off the TFT; and a drive source configured to provide a drive signal for charging the electrode through the TFT. An amplitude of the drive signal corresponds to an amount of charge, and the amount of charge generates an electrostatic force for actuating the hinge and a portion of the membrane mirror mechanically coupled to the hinge.
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公开(公告)号:US11959806B2
公开(公告)日:2024-04-16
申请号:US18132773
申请日:2023-04-10
Applicant: Obsidian Sensors, Inc.
Inventor: John Hong , Bing Wen , Edward Chan , Tallis Chang , Sean Andrews
CPC classification number: G01J5/024 , B81B3/0029 , G01J5/20 , H04N23/11 , B81B2201/047
Abstract: Disclosed herein are MEMS devices and systems and methods of manufacturing or operating the MEMS devices and systems. In some embodiments, the MEMS devices and systems are used in imaging applications.
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公开(公告)号:US11624657B2
公开(公告)日:2023-04-11
申请号:US17267789
申请日:2019-08-09
Applicant: Obsidian Sensors, Inc.
Inventor: John Hong , Bing Wen , Edward Chan , Tallis Chang , Sean Andrews
Abstract: Disclosed herein are MEMS devices and systems and methods of manufacturing or operating the MEMS devices and systems for transmitting and detecting radiation. The devices and methods described herein are applicable to terahertz radiation. In some embodiments, the MEMS devices and systems are used in imaging applications. In some embodiments, a microelectromechanical system comprises a glass substrate configured to pass radiation from a first surface of the glass substrate through a second surface of the glass substrate, the glass substrate comprising TFT circuitry; a lid comprising a surface; spacers separating the lid and glass substrate; a cavity defined by the spacers, surface of the lid, and second surface of the glass substrate; a pixel in the cavity, positioned on the second surface of the glass substrate, electrically coupled to the TFT circuitry, and comprising an absorber to detect the radiation; and a reflector to direct the radiation to the absorbers and positioned on the lid.
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公开(公告)号:US11555744B2
公开(公告)日:2023-01-17
申请号:US17048046
申请日:2019-04-17
Applicant: Obsidian Sensors, Inc.
Inventor: Edward Chan , Bing Wen , John Hong , Tallis Chang , Seung-Tak Ryu
Abstract: Methods of sensor readout and calibration and circuits for performing the methods are disclosed. In some embodiments, the methods include driving an active sensor at a voltage. In some embodiments, the methods include use of a calibration sensor, and the circuits include the calibration sensor. In some embodiments, the methods include use of a calibration current source and circuits include the calibration current source. In some embodiments, a sensor circuit includes a Sigma-Delta ADC. In some embodiments, a column of sensors is readout using first and second readout circuits during a same row time.
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公开(公告)号:US12006209B2
公开(公告)日:2024-06-11
申请号:US16980792
申请日:2019-03-14
Applicant: Obsidian Sensors, Inc.
Inventor: John Hong , Tallis Chang , Edward Chan , Bing Wen , Yaoling Pan , Sean Andrews
CPC classification number: B81C1/00595 , B81B3/0081 , B81C1/0069 , G01J5/20 , B81B2201/0207 , B81B2203/019 , B81C2201/0105 , B81C2201/014
Abstract: A method of manufacturing an electromechanical systems structure includes manufacturing sub-micron structural features. In some embodiments, the structural features are less than the lithographic limit of a lithography process.
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