公开(公告)号：US20240399506A1

公开(公告)日：2024-12-05

申请号：US18545864

申请日：2023-12-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sang Min Lee ,  Seongpyo Hong ,  Sangwoo Bae ,  Namil Koo

IPC: B23K26/38

Abstract: Embodiments of a substrate processing apparatus and substrate processing method are provided. Embodiments include a laser that directs a laser beam toward a substrate. Embodiments further include a chuck spaced apart in a first direction from the laser. Embodiments include a lower particle blocker disposed between the chuck and the laser. In some cases, the lower particle blocker includes a first particle blocker. In some cases, the first particle blocker includes a first slit that penetrates the first particle blocker in the first direction. In some cases, the first slit extends in a second direction perpendicular to the first direction.

公开(公告)号：US20250137136A1

公开(公告)日：2025-05-01

申请号：US18919340

申请日：2024-10-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hunyong Park ,  Yeontae Kim ,  Janghwi Lee ,  Sangwoo Bae ,  Jungchul Lee

IPC: C23C16/48

Abstract: A layer deposition apparatus includes a process chamber configured to provides a space for processing a substrate, the process chamber including an upper chamber and a lower chamber that define an inner space; a substrate support disposed within the process chamber and configured to support the substrate; a lamp heating portion disposed above the upper chamber outside the process chamber and including a plurality of light sources configured to irradiate light onto the substrate through the upper chamber; and an interference thin layer pattern disposed on an upper surface of the upper chamber and configured to reflect at least a portion of light from the plurality of light sources.

公开(公告)号：US20240218561A1

公开(公告)日：2024-07-04

申请号：US18515664

申请日：2023-11-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Janghwi Lee ,  Yeontae Kim ,  Junbum Park ,  Hunyong Park ,  Suhwan Park ,  Sangwoo Bae ,  Motoshi Sakai ,  Wondon Joo ,  Jaeho Jin

IPC: C30B25/16 ,  C30B25/12

CPC classification number: C30B25/16 ,  C30B25/12

Abstract: A thin-film deposition apparatus includes: a housing; a chamber located within the housing and providing an internal space; a platform disposed within the chamber and configured to support a substrate; a reflector disposed within the housing and disposed outside the chamber; a light source disposed between opposing walls of the reflector and configured to radiate light onto the substrate; a light receiver disposed within the housing, spaced apart from the light source with a portion of the reflector therebetween, and having a hole through which light emitted from the substrate is introduced; an optical cable connected to the light receiver and extending to the outside of the housing; and a sensor disposed outside the housing, connected to the optical cable, and configured to measure a temperature of the substrate by analyzing light transmitted from the optical cable.

公开(公告)号：US20230392925A1

公开(公告)日：2023-12-07

申请号：US18123788

申请日：2023-03-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jiyoung Chu ,  Hyungjin Kim ,  Minhwan Seo ,  Wondon Joo ,  Dongyoon Koo ,  Sangwoo Bae ,  Sungmin Ahn ,  Jungyu Lee ,  Yunpyo Hong

IPC: G01B11/27 ,  G02B27/28 ,  G02B5/08

CPC classification number: G01B11/272 ,  G02B27/283 ,  G02B27/286 ,  G02B5/0808

Abstract: A method of bonding a die to a wafer using a die bonding system measures, using an obtained image showing interference fringes, a parallelism between the die and the wafer. In some embodiments, parallelism and die deformation are detected using interference fringes produced by an optical apparatus of the die bonding system. A parallelism measurement optical apparatus includes a light source, an optical assembly configured to control polarization of a reference light and a measurement light. In some embodiments, the measurement light is sequentially incident on and reflected from a first measurement surface and a second measurement surface that are spaced apart along a vertical direction to face each other, and is emitted to have information on parallelism between the first and second measurement surfaces. In some embodiments, a first polarizer is configured to interfere the reference light and the measurement light emitted from the optical assembly with each other. A light detector is configured to detect an interference signal of lights including the interference fringes.

公开(公告)号：US20240118072A1

公开(公告)日：2024-04-11

申请号：US18215437

申请日：2023-06-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungho Jang ,  Sangwoo Bae ,  Minhwan Seo ,  Jangwoon Sung ,  Akinori Okubo ,  Seungwoo Lee ,  Jungchul Lee ,  Jaehwang Jung ,  Sangjoon Hong

IPC: G01B11/06 ,  G01B9/02

CPC classification number: G01B11/0608 ,  G01B9/02041 ,  G01B2290/70

Abstract: Provided are a level sensor configured to detect a height level of a substrate, and a substrate processing apparatus including the level sensor. The level sensor includes a measurement light source configured to radiate measurement light toward the substrate, a prism configured to split reflected light of the measurement light into first polarized light and second polarized light and generate a first optical path length difference between the first polarized light and the second polarized light, an optical path length modulator configured to keep constant an optical path length of the first polarized light and periodically change an optical path length of the second polarized light, and a detector configured to detect the first optical path length difference based on an interference signal between the first polarized light and the second polarized light.

公开(公告)号：US11946809B2

公开(公告)日：2024-04-02

申请号：US17740529

申请日：2022-05-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ingi Kim ,  Minhwan Seo ,  Sangwoo Bae ,  Akinori Okubo ,  Jungchul Lee ,  Eunhee Jeang

IPC: G01J4/02 ,  G01J4/04

CPC classification number: G01J4/02 ,  G01J4/04

Abstract: Provided is a polarization measuring device including a stage on which a measurement target is provided, a light source assembly configured to emit incident light, a first polarimeter configured to polarize the incident light, a second polarimeter configured to polarize reflected light reflected from the measurement target that is irradiated by the incident light, a filter assembly configured to remove noise from the reflected light, and a detector configured to receive the reflected light and measure an intensity of the reflected light and a phase of the reflected light.

公开(公告)号：US11823961B2

公开(公告)日：2023-11-21

申请号：US17021087

申请日：2020-09-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Eunhee Jeang ,  Boris Afinogenov ,  Sangwoo Bae ,  Wondon Joo ,  Maksim Riabko ,  Anton Medvedev ,  Aleksandr Shorokhov ,  Anton Sofronov ,  Ingi Kim ,  Taehyun Kim ,  Minhwan Seo ,  Sangmin Lee ,  Seulgi Lee

IPC: H01L21/66 ,  H01L21/67 ,  G01N21/95 ,  G01N21/64

CPC classification number: H01L22/12 ,  G01N21/648 ,  G01N21/9505 ,  H01L21/67288 ,  G01N2201/06113

Abstract: A substrate inspection apparatus includes a light source unit, a pulsed beam matching unit, a substrate support unit, an incidence angle adjusting unit, and a detecting unit. The light source unit emits a first laser beam having a first wavelength and a second laser beam having a second wavelength. The pulsed beam matching unit matches the first laser beam and the second laser beam to superimpose a pulse of the first laser beam on a pulse of the second laser beam in time and space. The substrate support unit supports a substrate to be inspected. The incidence angle adjusting unit adjusts angles of incidence of the matched first laser beam and second laser beams to irradiate the first laser beam and the second laser beam on the substrate, and mixes the first laser beam and the second laser beam to generate an evanescent wave on the substrate. The evanescent wave generates scattered light due to a defect of the substrate. The detecting unit detects the scattered light generated due to the defect of the substrate.

公开(公告)号：US20220068681A1

公开(公告)日：2022-03-03

申请号：US17229197

申请日：2021-04-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyunghun Han ,  Ingi Kim ,  Sangwoo Bae ,  Jungchul Lee ,  Minhwan Seo ,  Myeongock Ko ,  Youngjoo Lee ,  Taehyun Kim ,  Seulgi Lee

IPC: H01L21/67 ,  G02B7/02 ,  G06T5/20 ,  G06T7/00 ,  G01N21/65 ,  G01N21/41 ,  G01N21/95

Abstract: A wafer inspection apparatus includes: an objective lens on an optical path of first and second input beams; and an image sensor configured to generate an image of the wafer based on scattered light according to a nonlinear optical phenomenon based on the first and second input beams, wherein the first input beam passing through the objective lens is obliquely incident on the wafer at a first incident angle with respect to a vertical line that is normal to an upper surface of the wafer, the second input beam passing through the objective lens is incident on the wafer at a second incident angle oblique to the vertical line that is normal to the upper surface of the wafer, and the first and second incident angles are different from each other.

公开(公告)号：US20250052559A1

公开(公告)日：2025-02-13

申请号：US18620802

申请日：2024-03-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Minhwan Seo ,  Jiyoung Chu ,  Hyungjin Kim ,  Sangwoo Bae ,  Seungyeol Oh

IPC: G01B9/02015 ,  G01B9/02001 ,  G01B11/27 ,  G02B27/28

Abstract: A parallelism measurement optical system module includes a polarization beam splitter, a mirror positioned on a first surface of the polarization beam splitter, a first quarter wave plate positioned on a second surface of the polarization beam splitter that is perpendicular to the first surface, and a second quarter wave plate positioned on a third surface of the polarization beam splitter that is perpendicular to the first surface and parallel to the second surface.

公开(公告)号：US20240019362A1

公开(公告)日：2024-01-18

申请号：US18220672

申请日：2023-07-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junbum Park ,  Namil Koo ,  Jaeho Kim ,  Jongsu Kim ,  Suhwan Park ,  Sangwoo Bae ,  Inkeun Baek ,  Ikseon Jeon ,  Martin Priwisch

IPC: G01N21/3581 ,  G01N21/956

CPC classification number: G01N21/3581 ,  G01N21/956 ,  G01N2021/95676

Abstract: An inspection apparatus is provided. The inspection apparatus includes a substrate extending in a first direction and a second direction perpendicular to the first direction, a receiver antenna arranged on the substrate and including first and second antenna electrodes, a first waveguide on the substrate, and a second waveguide on the substrate, wherein the first antenna electrode overlaps the first waveguide in a third direction that is perpendicular to the first direction and the second direction, and the second antenna electrode overlaps the second waveguide in the third direction.