公开(公告)号：US20240399506A1

公开(公告)日：2024-12-05

申请号：US18545864

申请日：2023-12-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sang Min Lee ,  Seongpyo Hong ,  Sangwoo Bae ,  Namil Koo

IPC: B23K26/38

Abstract: Embodiments of a substrate processing apparatus and substrate processing method are provided. Embodiments include a laser that directs a laser beam toward a substrate. Embodiments further include a chuck spaced apart in a first direction from the laser. Embodiments include a lower particle blocker disposed between the chuck and the laser. In some cases, the lower particle blocker includes a first particle blocker. In some cases, the first particle blocker includes a first slit that penetrates the first particle blocker in the first direction. In some cases, the first slit extends in a second direction perpendicular to the first direction.