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    MANUFACTURE OF TRUNCATED LENSES, OF PAIRS OF TRUNCATED LENSES AND OF CORRESPONDING DEVICES
    1.
    发明申请
    MANUFACTURE OF TRUNCATED LENSES, OF PAIRS OF TRUNCATED LENSES AND OF CORRESPONDING DEVICES 审中-公开
    截断镜片的制造，截面镜片和相关器件的制造

    公开(公告)号：US20150217524A1

    公开(公告)日：2015-08-06

    申请号：US14426472

    申请日：2013-09-03

    Applicant: HEPTAGON MICRO OPTICS PTE. LTD.

    Inventor： Hartmut Rudmann ,  Jürgen Soechtig ,  Nicola Spring ,  Alexander Bietesch

    IPC: B29D11/00 ,  B29C33/38 ,  G02B13/00

    CPC classification number: B29D11/00 ,  B29C33/0022 ,  B29C33/3842 ,  B29D11/00365 ,  B29K2995/0094 ,  B29L2011/0016 ,  G02B3/0031 ,  G02B3/0062 ,  G02B13/0085

    Abstract: The invention relates to wafer-level manufacturing of optical devices such as modules comprising micro-lenses. In one aspect, passive optical components such as truncated lenses are manufactured by providing a substrate on which a multitude of precursor optical structures is present; and removing material from each of said multitude of precursor optical structures. Another aspect comprises a method for manufacturing a device comprising a set of at least two passive optical components, said method comprising the steps of using a tool obtained by carrying out the steps of manufacturing a precursor tool having a replication surface; and modifying said replication surface by removing material from said precursor tool. An yet another aspect comprises a method for manufacturing a device comprising a set of at least two passive optical components, wherein the method comprises the step of using a master comprising a replication surface comprising, for each of said passive optical components, a first portion describing a shape corresponding to the shape of at least a portion of the respective passive optical component, wherein the master comprises, in addition, at least one protruding portion protruding from at least one of said first portions of said replication surfaces.

    Abstract translation: 本发明涉及诸如包括微透镜的模块的光学装置的晶片级制造。 在一个方面，通过提供其上存在多个前体光学结构的基板来制造诸如截头透镜的无源光学部件; 以及从所述多个前驱体光学结构中的每一个去除材料。 另一方面包括一种用于制造包括一组至少两个无源光学部件的装置的方法，所述方法包括以下步骤：使用通过进行制造具有复制表面的前体工具的步骤获得的工具; 以及通过从所述前体工具中去除材料来修饰所述复制表面。 另一方面包括一种用于制造包括一组至少两个无源光学部件的设备的方法，其中该方法包括使用包括复制表面的主设备的步骤，该复制表面包括针对每个所述无源光学部件的描述的第一部分 与相应的无源光学部件的至少一部分的形状相对应的形状，其中所述主机还包括从所述复制表面的所述第一部分中的至少一个突出的至少一个突出部分。

    FLASH MODULE WITH SHIELDING FOR USE IN MOBILE PHONES AND OTHER DEVICES
    5.
    发明申请
    FLASH MODULE WITH SHIELDING FOR USE IN MOBILE PHONES AND OTHER DEVICES 审中-公开
    具有屏蔽功能的移动电话和其他设备的闪光模组

    公开(公告)号：US20160091777A1

    公开(公告)日：2016-03-31

    申请号：US14891589

    申请日：2014-05-15

    Applicant: HEPTAGON MICRO OPTICS PTE. LTD.

    Inventor： Kam Pui Kuan ,  Hakan Karpuz ,  Michel Barge ,  Nicola Spring ,  Robert Lenart

    IPC: G03B15/05

    CPC classification number: G03B15/05 ,  G03B15/03 ,  G03B2215/0592 ,  G03B2215/0596

    Abstract: A flash module comprises an optics portion that includes a base plate, a light guide on a first side of the base plate, and a lens element on a second side of the base plate. A casing is attached to the optics portion and defines an interior region in which the lens element is located. An active light emitting component is mounted within the casing. Sidewalls of the light guide are coated with first and second layers of different materials. The second layer is a coating over the first layer and is substantially non-transparent to light emitted by the active light emitting component. The first layer can provide a predetermined aesthetic appearance and can be selected, for example, to match the color of the exterior surface of a device in which the flash module is to be integrated.

    Abstract translation: 闪光模块包括光学部分，其包括基板，在基板的第一侧上的导光体和在基板的第二侧上的透镜元件。 壳体附接到光学部件并且限定透镜元件所在的内部区域。 主动发光部件安装在壳体内。 导光板的侧壁涂有第一层和第二层不同的材料。 第二层是在第一层上的涂层，并且对于由有源发光部件发射的光基本上不透明。 第一层可以提供预定的美学外观，并且可以选择，例如，以匹配闪光模块将被集成在其中的装置的外表面的颜色。

    SPACER ELEMENT AND METHOD FOR MANUFACTURING A SPACER ELEMENT
    6.
    发明申请
    SPACER ELEMENT AND METHOD FOR MANUFACTURING A SPACER ELEMENT 审中-公开
    间隔元件和制造间隔元件的方法

    公开(公告)号：US20130280492A1

    公开(公告)日：2013-10-24

    申请号：US13923861

    申请日：2013-06-21

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Markus Rossi ,  Hartmut Rudmann ,  Nicola Spring ,  Alexander Bietsch

    IPC: B32B41/00 ,  B32B37/02

    CPC classification number: B32B41/00 ,  B32B37/02 ,  G02B2006/12166 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14683 ,  H01L2924/0002 ,  H04N5/2257 ,  Y10T156/10 ,  Y10T428/15 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/2457 ,  H01L2924/00

    Abstract: A spacer wafer for a wafer stack includes a spacer body with a first surface and a second surface, and is intended to be sandwiched between a first wafer and a second wafer. That is, the spacer is to keep a first wafer placed against the first surface and a second wafer placed against the second surface at a constant distance from each other. The spacer provides openings arranged such that functional elements of the first wafer and of the second wafer can be aligned with the openings. The spacer is formed from a forming tool by means of a shape replication process and is preferably made of a material hardened by curing. At least one of the first and second surface includes edges separating the surface from the openings, and the thickness of the spacer wafer at the edges exceeds the thickness of the spacer wafer at surface locations around the edges.

    Abstract translation: 用于晶片堆叠的间隔晶片包括具有第一表面和第二表面的间隔体，并且旨在夹在第一晶片和第二晶片之间。 也就是说，间隔件是保持第一晶片放置在第一表面上，并且第二晶片以彼此保持恒定的距离放置在第二表面上。 间隔件提供开口布置成使得第一晶片和第二晶片的功能元件可与开口对准。 间隔件通过形状复制工艺由成形工具形成，并且优选由通过固化硬化的材料制成。 第一和第二表面中的至少一个包括将表面与开口分开的边缘，并且边缘处的间隔晶片的厚度在边缘周围的表面位置超过间隔晶片的厚度。

    OPTICAL ELEMENT STACK ASSEMBLIES
    8.
    发明申请
    OPTICAL ELEMENT STACK ASSEMBLIES 审中-公开

    公开(公告)号：US20180329175A1

    公开(公告)日：2018-11-15

    申请号：US15775232

    申请日：2016-11-04

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Ji Wang ,  Kam Wah Leong ,  Bojan Tesanovic ,  Qichuan Yu ,  Tobias Senn ,  Nicola Spring ,  Robert Lenart

    IPC: G02B9/04 ,  B29C39/10 ,  B29C39/42 ,  G02B7/02

    CPC classification number: G02B9/04 ,  B29C39/10 ,  B29C39/42 ,  B29K2995/0031 ,  B29L2011/00 ,  B29L2011/0016 ,  G02B7/021

    Abstract: Optical stack assemblies and fabrication techniques thereof. The optical stack assembly includes first and second sub-assemblies, each of which include a substrate and a sub-structure fixed to the respective substrate. Each sub-structures includes a respective first edge feature and a respective second edge feature that project away from the substrate of that sub-structure, each second edge feature being disposed laterally closer to an outer periphery of the respective sub-structure than the first edge feature of the same sub-structure. The first edge feature of the first sub-structure is in direct contact with the first edge feature of the second sub¬structure, while the second edge feature of the first sub-structure and the second edge feature of the second sub-structure are attached to one another by adhesive. At least one of the first or second sub-structures includes an optical element on a same side of the sub-structure as the first and second edge features of that sub-structure. The optical element stack assembly further includes a spacer laterally surrounding, and moulded to, the first and second sub-assemblies.

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