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公开(公告)号：CN100444343C
公开(公告)日：2008-12-17
申请号：CN200610006143.9
申请日：2006-01-19
Applicant: 精工爱普生株式会社
IPC: H01L21/60 , H01L21/3213
CPC classification number: H05K3/3489 , H01L21/4853 , H01L21/563 , H01L23/49816 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/81 , H01L24/83 , H01L2224/02166 , H01L2224/02331 , H01L2224/0236 , H01L2224/02377 , H01L2224/02381 , H01L2224/0239 , H01L2224/0381 , H01L2224/0391 , H01L2224/0401 , H01L2224/05624 , H01L2224/06131 , H01L2224/06155 , H01L2224/11 , H01L2224/1191 , H01L2224/13 , H01L2224/13022 , H01L2224/13099 , H01L2224/131 , H01L2224/13111 , H01L2224/13144 , H01L2224/16 , H01L2224/16225 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/73204 , H01L2224/81801 , H01L2224/83851 , H01L2924/00 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/00014
Abstract: 本发明提供一种能够提高外部端子的可靠性的半导体装置的制造方法以及电连接部的处理方法。半导体装置的制造方法包括：(a)在与半导体基板(20)电导通的电连接部(14)上，设置含酸的料浆(54)；(b)通过清洗电连接部(14)，从电连接部(14)上去除料浆(54)；以及，(c)在电连接部(14)上设置导电材料。
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公开(公告)号：CN101359641A
公开(公告)日：2009-02-04
申请号：CN200810130154.7
申请日：2008-07-30
Applicant: 精工爱普生株式会社
CPC classification number: H01L23/3107 , H01L21/4832 , H01L21/568 , H01L23/49517 , H01L23/49582 , H01L23/544 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2221/68377 , H01L2224/16225 , H01L2224/16245 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48639 , H01L2224/48644 , H01L2224/73265 , H01L2224/85439 , H01L2224/85444 , H01L2224/92 , H01L2224/92247 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19043 , H01L2924/19105 , H01L2924/3025 , H05K1/185 , H05K1/187 , H05K3/06 , H05K3/20 , Y10T29/49224 , H01L2924/00014 , H01L2224/81 , H01L2224/85 , H01L2224/83 , H01L2924/00012 , H01L2924/00 , H01L2924/3512
Abstract: 本发明提供一种衬底及其制造方法、半导体装置及其制造方法，该衬底用于固定IC元件，把焊盘端子向外部引出，具有俯视中在纵向和横向排列的多根柱体(5)以及在从表面到背面之间的一部分彼此连结多根柱体(5)的连结部(6)。作为用于搭载IC元件的裸芯片连接盘，或者作为IC元件的外部端子，能利用多根柱体(5)，并能够根据任意设定的IC固定区域的形状和尺寸，把多根柱体(5)作为裸芯片连接盘或外部端子分开使用。不增加对IC元件的制约，能把搭载IC元件的布线衬底的规格共通化。
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Patent Agency Ranking
公开(公告)号：CN101179039A
公开(公告)日：2008-05-14
申请号：CN200710186022.1
申请日：2006-01-19
Applicant: 精工爱普生株式会社
CPC classification number: H05K3/3489 , H01L21/4853 , H01L21/563 , H01L23/49816 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/81 , H01L24/83 , H01L2224/02166 , H01L2224/02331 , H01L2224/0236 , H01L2224/02377 , H01L2224/02381 , H01L2224/0239 , H01L2224/0381 , H01L2224/0391 , H01L2224/0401 , H01L2224/05624 , H01L2224/06131 , H01L2224/06155 , H01L2224/11 , H01L2224/1191 , H01L2224/13 , H01L2224/13022 , H01L2224/13099 , H01L2224/131 , H01L2224/13111 , H01L2224/13144 , H01L2224/16 , H01L2224/16225 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/73204 , H01L2224/81801 , H01L2224/83851 , H01L2924/00 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/00014
Abstract: 本发明提供一种能够提高外部端子的可靠性的半导体装置的制造方法以及电连接部的处理方法。半导体装置的制造方法包括：(a)在与半导体基板(20)电导通的电连接部(14)上，设置含酸的料浆(54)；(b)通过清洗电连接部(14)，从电连接部(14)上去除料浆(54)；以及，(c)在电连接部(14)上借助助焊剂设置导电材料，上述料浆由与上述助焊剂相同的材料构成。
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公开(公告)号：CN100570848C
公开(公告)日：2009-12-16
申请号：CN200710186022.1
申请日：2006-01-19
Applicant: 精工爱普生株式会社
CPC classification number: H05K3/3489 , H01L21/4853 , H01L21/563 , H01L23/49816 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/81 , H01L24/83 , H01L2224/02166 , H01L2224/02331 , H01L2224/0236 , H01L2224/02377 , H01L2224/02381 , H01L2224/0239 , H01L2224/0381 , H01L2224/0391 , H01L2224/0401 , H01L2224/05624 , H01L2224/06131 , H01L2224/06155 , H01L2224/11 , H01L2224/1191 , H01L2224/13 , H01L2224/13022 , H01L2224/13099 , H01L2224/131 , H01L2224/13111 , H01L2224/13144 , H01L2224/16 , H01L2224/16225 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/73204 , H01L2224/81801 , H01L2224/83851 , H01L2924/00 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/00014
Abstract: 本发明提供一种能够提高外部端子的可靠性的半导体装置的制造方法以及电连接部的处理方法。半导体装置的制造方法包括：(a)在与半导体基板(20)电导通的电连接部(14)上，设置含酸的料浆(54)；(b)通过清洗电连接部(14)，从电连接部(14)上去除料浆(54)；以及，(c)在电连接部(14)上借助助焊剂设置导电材料，上述料浆由与上述助焊剂相同的材料构成。
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公开(公告)号：CN1819133A
公开(公告)日：2006-08-16
申请号：CN200610006143.9
申请日：2006-01-19
Applicant: 精工爱普生株式会社
IPC: H01L21/60 , H01L21/3213
CPC classification number: H05K3/3489 , H01L21/4853 , H01L21/563 , H01L23/49816 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/81 , H01L24/83 , H01L2224/02166 , H01L2224/02331 , H01L2224/0236 , H01L2224/02377 , H01L2224/02381 , H01L2224/0239 , H01L2224/0381 , H01L2224/0391 , H01L2224/0401 , H01L2224/05624 , H01L2224/06131 , H01L2224/06155 , H01L2224/11 , H01L2224/1191 , H01L2224/13 , H01L2224/13022 , H01L2224/13099 , H01L2224/131 , H01L2224/13111 , H01L2224/13144 , H01L2224/16 , H01L2224/16225 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/73204 , H01L2224/81801 , H01L2224/83851 , H01L2924/00 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/00014
Abstract: 本发明提供一种能够提高外部端子的可靠性的半导体装置的制造方法以及电连接部的处理方法。半导体装置的制造方法包括：(a)在与半导体基板(20)电导通的电连接部(14)上，设置含酸的料浆(54)；(b)通过清洗电连接部(14)，从电连接部(14)上去除料浆(54)；以及，(c)在电连接部(14)上设置导电材料。
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公开(公告)号：CN101359650B
公开(公告)日：2011-03-16
申请号：CN200810130147.7
申请日：2008-07-30
Applicant: 精工爱普生株式会社
IPC: H01L23/544 , H01L23/50 , H01L21/48 , H01L23/31 , H01L21/50
CPC classification number: H01L23/544 , H01L21/4832 , H01L21/563 , H01L21/568 , H01L21/6835 , H01L23/3107 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/90 , H01L24/97 , H01L25/16 , H01L2221/68345 , H01L2221/68377 , H01L2223/54426 , H01L2223/54473 , H01L2224/16225 , H01L2224/16245 , H01L2224/2919 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48247 , H01L2224/484 , H01L2224/48599 , H01L2224/49171 , H01L2224/73203 , H01L2224/73265 , H01L2224/81121 , H01L2224/81801 , H01L2224/83191 , H01L2224/83855 , H01L2224/85001 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/15311 , H01L2924/15788 , H01L2924/181 , H01L2924/18301 , H01L2924/19043 , H01L2924/19105 , H01L2924/3025 , Y10T29/4921 , H01L2224/85 , H01L2224/83 , H01L2224/81 , H01L2924/00012 , H01L2924/00 , H01L2224/85399 , H01L2224/05599
Abstract: 本发明提供不会使加在IC元件上的限制增加且能使搭载IC元件的基板的规格共用化的基板及其制造方法、以及半导体装置及其制造方法。所述基板是用于固定IC元件并将其焊盘端子引出到外部的基板，具有俯视下纵向以及横向排列的多个接线柱(5)、和用从表面至背面之间的一部分相互连结多个接线柱(5)的连结部(6)，在一部分接线柱(5)的表面形成有与其他接线柱有区分的识别标记(8)。作为用于搭载IC元件的芯片焊盘，或者作为IC元件的外部端子，可以利用多个接线柱(5)，根据任意设定的IC固定区域的形状以及大小，可以将多个接线柱(5)作为芯片焊盘或外部端子分别使用。
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公开(公告)号：CN101359650A
公开(公告)日：2009-02-04
申请号：CN200810130147.7
申请日：2008-07-30
Applicant: 精工爱普生株式会社
IPC: H01L23/544 , H01L23/50 , H01L21/48 , H01L23/31 , H01L21/50
CPC classification number: H01L23/544 , H01L21/4832 , H01L21/563 , H01L21/568 , H01L21/6835 , H01L23/3107 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/90 , H01L24/97 , H01L25/16 , H01L2221/68345 , H01L2221/68377 , H01L2223/54426 , H01L2223/54473 , H01L2224/16225 , H01L2224/16245 , H01L2224/2919 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48247 , H01L2224/484 , H01L2224/48599 , H01L2224/49171 , H01L2224/73203 , H01L2224/73265 , H01L2224/81121 , H01L2224/81801 , H01L2224/83191 , H01L2224/83855 , H01L2224/85001 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/15311 , H01L2924/15788 , H01L2924/181 , H01L2924/18301 , H01L2924/19043 , H01L2924/19105 , H01L2924/3025 , Y10T29/4921 , H01L2224/85 , H01L2224/83 , H01L2224/81 , H01L2924/00012 , H01L2924/00 , H01L2224/85399 , H01L2224/05599
Abstract: 本发明提供不会使加在IC元件上的限制增加且能使搭载IC元件的基板的规格共用化的基板及其制造方法、以及半导体装置及其制造方法。所述基板是用于固定IC元件并将其焊盘端子引出到外部的基板，具有俯视下纵向以及横向排列的多个接线柱(5)、和用从表面至背面之间的一部分相互连结多个接线柱(5)的连结部(6)，在一部分接线柱(5)的表面形成有与其他接线柱有区分的识别标记(8)。作为用于搭载IC元件的芯片焊盘，或者作为IC元件的外部端子，可以利用多个接线柱(5)，根据任意设定的IC固定区域的形状以及大小，可以将多个接线柱(5)作为芯片焊盘或外部端子分别使用。
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