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公开(公告)号:US20240298743A1
公开(公告)日:2024-09-12
申请号:US18662828
申请日:2024-05-13
申请人: NIKE, Inc.
发明人: Devon Frazier , Walter M. Hancock , Dave Klinger , Robert Mervar , Brian G. Prevo , Hilary Walker
IPC分类号: A43B13/02 , A43B23/02 , B29C51/12 , B29C51/14 , B29K9/06 , B29L31/50 , B32B5/02 , B32B5/24 , B32B27/12 , B32B27/40 , D02G3/36 , D04B1/16 , D06M15/233 , D06M15/70 , D06M101/32 , D06M101/34
CPC分类号: A43B13/026 , A43B23/0215 , A43B23/0225 , A43B23/0235 , A43B23/0255 , A43B23/026 , B29C51/12 , B29C51/145 , B32B5/026 , B32B5/245 , B32B27/12 , B32B27/40 , D02G3/36 , D04B1/16 , D06M15/233 , D06M15/70 , B29K2009/06 , B29L2031/504 , B29L2031/505 , B32B2307/536 , B32B2437/02 , D06M2101/32 , D06M2101/34 , D06M2200/35 , D06M2200/40 , D10B2331/02 , D10B2331/04 , D10B2331/10 , D10B2401/041 , D10B2401/06 , D10B2401/061 , D10B2401/063 , D10B2501/043
摘要: Films, fibers, filaments, yarns and textiles including thermoplastic elastomeric compositions are described, as are methods of making the films, fibers, filaments, yarns and textiles. These films, fibers, filaments, yarns and textiles can be used to make articles of apparel, footwear, and sporting equipment. When thermoformed, the thermoplastic elastomeric compositions can impart abrasion resistance, traction, and other advantageous properties to the articles. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present disclosure.
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公开(公告)号:US20240297377A1
公开(公告)日:2024-09-05
申请号:US18279656
申请日:2022-03-03
发明人: Dong Gyun Seol , Yong Su Choi , Sung Ryul Kwon , Gi Beom Kang
IPC分类号: H01M50/105 , B29C51/08 , B29C51/10 , B29C51/14 , B29K23/00 , B29K67/00 , B29K77/00 , B29L9/00 , B29L31/00 , B32B7/12 , B32B15/085 , B32B15/088 , B32B15/20 , B32B27/08 , B32B27/32 , B32B27/34 , B32B27/36 , H01M50/119 , H01M50/121 , H01M50/129
CPC分类号: H01M50/105 , B29C51/082 , B29C51/10 , B29C51/14 , B32B7/12 , B32B15/085 , B32B15/088 , B32B15/20 , B32B27/08 , B32B27/32 , B32B27/34 , B32B27/36 , H01M50/119 , H01M50/121 , H01M50/129 , B29K2023/12 , B29K2067/003 , B29K2077/00 , B29L2009/003 , B29L2031/7146 , B32B2439/02 , B32B2457/10
摘要: The present invention relates to a method for forming a pouch, and the method for forming the pouch according to the present invention comprises: a curling process of bending a pouch sheet in a round shape; a seating process of seating the bent pouch sheet on a lower mold, in which a molding groove is formed; and a forming process of pressing the pouch sheet by using a punch mold to form an accommodation part, in which an electrode assembly is accommodated, in the pouch sheet.
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公开(公告)号:US20240286367A1
公开(公告)日:2024-08-29
申请号:US18658218
申请日:2024-05-08
发明人: Yanghui Zheng , Sen Qiu , Yanghong Zheng , Jingyan Zheng , Qiushun Liu , Shaohua Chen
IPC分类号: B29C70/70 , A45C11/00 , B29C51/08 , B29C51/14 , B29C51/26 , B29C70/88 , B29K105/00 , B29K277/00 , B29K309/08 , B29L31/34 , B32B3/08 , B32B3/26 , B32B5/02 , B32B5/26 , B32B37/04 , B32B37/06 , B32B37/10 , B32B37/18 , B32B37/26 , B32B38/00
CPC分类号: B29C70/70 , A45C11/00 , B29C51/08 , B29C51/14 , B29C51/264 , B29C70/88 , B32B3/08 , B32B3/266 , B32B5/02 , B32B5/26 , B32B37/04 , B32B37/06 , B32B37/10 , B32B37/18 , B32B37/26 , B32B38/0004 , A45C2011/002 , A45C2011/003 , B29K2105/0097 , B29K2277/10 , B29K2309/08 , B29K2995/0008 , B29L2031/3481 , B32B2037/268 , B32B2260/021 , B32B2260/046 , B32B2262/0269 , B32B2262/101 , B32B2305/076 , B32B2307/208 , B32B2307/7376 , B32B2309/02 , B32B2309/04 , B32B2315/085 , B32B2377/00 , B32B2457/00 , B32B2571/00
摘要: A protective case for electronic device includes an inner shell, an outer shell, and a magnetic interlayer that fits and in contact with the inner shell and the outer shell, wherein: the magnetic interlayer includes an interlayer base material and a magnetic part, the magnetic interlayer is provided with a through installation hole, and the magnetic part is fixedly embedded in the installation hole, the thickness of the magnetic part matches with the depth of the installation hole, the interlayer base material includes a hot-melt base material and reinforcing fiber yarn contained in the hot-melt base material, and the hot-melt base material is filled between the magnetic part and the inner side wall of the installation hole.
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公开(公告)号:US20240286339A1
公开(公告)日:2024-08-29
申请号:US18571894
申请日:2022-06-20
申请人: AUTOGLAS D & K B. V.
CPC分类号: B29C51/10 , B29C51/14 , B29C51/428 , B32B17/10211 , B32B17/10495 , B32B17/10844 , B32B17/10889 , B29L2009/00
摘要: A method for pre-forming a curved thermoplastic laminate to be incorporated in composed automotive windows, the method including the processing steps of; providing a thermoplastic laminate, clamping said thermoplastic laminate from opposite flat sides between a first and a second flexible clamping layer, applying a clamping force to the thermoplastic laminate, heating the clamped thermoplastic laminate, forming the clamped and heated thermoplastic laminate, and cooling the thermoplastic laminate. The invention also relates to a pre-formed thermoplastic laminate that is pre-formed by such method as well a system for pre-forming such a thermoplastic laminate.
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公开(公告)号:US12070891B2
公开(公告)日:2024-08-27
申请号:US17565860
申请日:2021-12-30
发明人: Kazunori Teramoto
IPC分类号: B29C51/26 , B29C51/02 , B29C51/12 , B29C51/16 , B29C51/42 , B29C51/10 , B29C51/14 , B29K23/00 , B29L31/50
CPC分类号: B29C51/262 , B29C51/02 , B29C51/12 , B29C51/165 , B29C51/167 , B29C51/261 , B29C51/264 , B29C51/425 , B29C51/10 , B29C51/14 , B29C2791/006 , B29C2793/0081 , B29K2023/06 , B29K2023/12 , B29L2031/50
摘要: A thermoforming device includes: a base configured to hold a substrate; a hot plate including a heating surface facing vertically downward; a sheet transport portion that supplies a sheet onto the heating surface of the hot plate; and a substrate supply portion configured to attach the substrate to the base and detach the substrate from the base, and to dispose the substrate at a substrate supply position positioned in a lower area of the sheet which is opposite to a side of the sheet in which the heating surface is provided. In the thermoforming device, heating of the sheet using the hot plate and attachment and detachment of the substrate with respect to the base are performable at the same time, and the sheet heated and softened by the hot plate is attached to the substrate at the substrate supply position.
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公开(公告)号:US20240227278A9
公开(公告)日:2024-07-11
申请号:US18380924
申请日:2023-10-17
发明人: Choong Ho KWON , Deok Man LEE
CPC分类号: B29C51/36 , B29C51/145 , B29L2031/3011
摘要: In the present invention, a laser pointer is mounted on an upper mold and formed to mark a position of an auxiliary raw material disposed on a raw material disposed on a lower mold so that everyone can easily accurately arrange the auxiliary raw material at a predetermined position and molds the auxiliary raw material to improve a molding efficiency. In particular, in the present invention, the laser pointer is formed to mark vertex positions of the auxiliary raw material so that an operator can arrange vertexes of the auxiliary raw material at the predetermined position to quickly arrange the auxiliary raw material at the predetermined position and accurately mold the auxiliary raw material. In this case, in the present invention, at least two laser points are mounted along an edge of the upper mold to mark vertices of the auxiliary raw material so that the auxiliary raw material can be more quickly accurately disposed at the predetermined position and integrally molded.
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公开(公告)号:US12012048B2
公开(公告)日:2024-06-18
申请号:US17509332
申请日:2021-10-25
发明人: Mosen Sepasi
CPC分类号: B60R13/02 , B29C51/02 , B29C51/082 , B29C51/266 , B29C51/145 , B29C2791/001 , B29C2793/009 , B29K2311/10 , B29L2031/3008 , B29L2031/3014 , B29L2031/302 , B29L2031/3041
摘要: A thermoformed article is disclosed that includes a self-supporting structural base layer, a covering applied to a first side of the base layer, and one or more secondary features co-injected upon a second side of the base layer. The covering and the secondary features of the thermoformed article are applied to the base layer during the same molding operation. Also disclosed is a process for forming a thermoformed article that includes placing a covering in a mold tool as a first layer, placing a self-supporting structural base layer in the mold tooling as a second layer, closing the mold tooling with the covering and base layer, and co-injecting upon a side of the base layer opposite to the covering one or more secondary features.
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公开(公告)号:US20240149819A1
公开(公告)日:2024-05-09
申请号:US18414226
申请日:2024-01-16
发明人: Jae Hyun An , In Soo Han , Woo Hyun Lim , Kyu Ha Yoo , Dong II Son , Dong Hyuk Choi , Chang Woo Kang , Chang Bok Park , Wan Gyu Choi
CPC分类号: B60R21/04 , B29C51/14 , B29C51/422 , B32B27/065 , B32B27/08 , B32B27/32 , B32B27/40 , B29L2031/3005
摘要: The present disclosure relates to an interior material for a vehicle and a method for molding the interior material for the vehicle, and more specifically the method for molding an interior material for a vehicle according to the present disclosure includes heating a skin inserted into an upper end heater and a lower end heater spaced apart from each other; preforming the heated skin using an upper mold having a mold temperature set to have a set shape and a lower mold having a second mold temperature; and pressing the preformed skin and a core using a 1-1 mold and a 1-2 mold having set mold temperatures.
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公开(公告)号:US20240059005A1
公开(公告)日:2024-02-22
申请号:US18339466
申请日:2023-06-22
申请人: BAY MATERIALS, LLC.
发明人: Ray F. Stewart , John Lahlouh
CPC分类号: B29C51/445 , B29C33/68 , B29C51/002 , B29C51/14 , B29C51/32 , B29C51/428 , B29C2793/009
摘要: The present invention relates to the field of printed circuit board technologies. A printed circuit board with good heat dissipation performance is provided in embodiments and includes a substrate serving as a board body of the printed circuit board, a heating component embedded in the substrate, and a cooling liquid channel disposed in the substrate. The cooling liquid channel is disposed in the printed circuit board, and passes around the heating component to exchange heat with the heating component, so that a heat dissipation path is shortened and heat dissipation efficiency is improved, thereby quickening heat dissipation of the printed circuit board, and prolonging a service life of the printed circuit board.
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公开(公告)号:US11904786B2
公开(公告)日:2024-02-20
申请号:US17560932
申请日:2021-12-23
发明人: Jae Hyun An , In Soo Han , Woo Hyun Lim , Kyu Ha Yoo , Dong Il Son , Dong Hyuk Choi , Chang Woo Kang , Chang Bok Park , Wan Gyu Choi
IPC分类号: B29C51/14 , B29C51/42 , B29L31/30 , B32B27/08 , B32B27/32 , B32B27/40 , B60R21/04 , B32B27/06 , B29K105/04
CPC分类号: B60R21/04 , B29C51/14 , B29C51/422 , B32B27/065 , B32B27/08 , B32B27/32 , B32B27/40 , B29K2105/04 , B29L2031/3005 , B32B2250/04 , B32B2250/24 , B32B2266/025 , B32B2266/0278 , B32B2307/546 , B32B2605/003
摘要: The present disclosure relates to an interior material for a vehicle and a method for molding the interior material for the vehicle, and more specifically the method for molding an interior material for a vehicle according to the present disclosure includes heating a skin inserted into an upper end heater and a lower end heater spaced apart from each other; preforming the heated skin using an upper mold having a mold temperature set to have a set shape and a lower mold having a second mold temperature; and pressing the preformed skin and a core using a 1-1 mold and a 1-2 mold having set mold temperatures.
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