公开(公告)号：US06833289B2

公开(公告)日：2004-12-21

申请号：US10436677

申请日：2003-05-12

申请人： Chuan Hu ,  Daoqiang Lu

发明人： Chuan Hu ,  Daoqiang Lu

IPC分类号： H01L2150

CPC分类号： H01L23/3735 ,  H01L24/75 ,  H01L2224/04026 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/00

摘要： A thinned semiconductor die is coupled to an integrated heat spreader with thermal interface material to form a semiconductor package. The method for forming the package comprises forming a metallization layer on a backside of a thinned semiconductor die. A thermal interface portion, including a solder layer including a fluxlessly-capable solder such as AuSn, is formed on the topside of the integrated heat spreader. The metallization layer and the solder layer are then forced together under load and heat without flux to bond the semiconductor die to the integrated heat spreader.

摘要翻译： 减薄的半导体管芯与具有热界面材料的集成散热器耦合以形成半导体封装。 用于形成封装的方法包括在薄化的半导体管芯的背面上形成金属化层。 在集成散热器的顶侧上形成有包括无助焊剂如AuSn的焊料层的热界面部分。 然后将金属化层和焊料层在负载和热力下一起被压在一起，而没有焊剂将半导体管芯结合到集成散热器。

公开(公告)号：US06821816B1

公开(公告)日：2004-11-23

申请号：US10461577

申请日：2003-06-13

申请人： Daniel A. Lawlyes

发明人： Daniel A. Lawlyes

IPC分类号： H01L2150

CPC分类号： H01L23/433 ,  H01L21/563 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83104 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/0401

摘要： A method and assembly (10) for conducting heat from a semiconductor device, such as a power flip chip (12). The assembly (10) is generally constructed to dissipate heat from the flip chip (12) when mounted to a flexible or rigid substrate (20). Heat is conducted from the flip chip (12) through upper and lower pedestals (26, 28) each of which includes a pliable pre-cured silicone adhesive pad (32, 36). The pre-cured silicon adhesive pads (32, 36) promote thermal contact while also decoupling any lateral mechanical strains that may arise as a result of different thermal expansion and movement between the flip chips (12). The housing portions (16, 18) form a housing (14) when assembled, with each housing portion (16, 18) including a configured edge (37, 41) that controls the travel of the pedestals (26, 28) toward each other, to thereby limit the pressure exerted on the flip chip (12) disposed therebetween. Silicone adhesive can be applied between the edges (37, 41) to hold the housing portions (16, 18) together.

摘要翻译： 一种用于从诸如功率倒装芯片（12）的半导体器件传导热量的方法和组件（10）。 组件（10）通常构造成当安装到柔性或刚性基底（20）时从倒装芯片（12）散发热量。 通过上下基座（26,28）从倒装芯片（12）传导热量，每个基座包括柔韧的预固化硅氧烷粘合垫（32,36）。 预固化的硅粘合剂垫（32,36）促进热接触，同时还使由于倒装芯片（12）之间的不同热膨胀和移动而可能出现的任何横向机械应变解耦。 当组装时，壳体部分（16,18）形成壳体（14），每个壳体部分（16,18）包括控制基座（26,28）朝向彼此的移动的构造边缘（37,41） ，从而限制施加在设置在其间的倒装芯片（12）的压力。 可以在边缘（37,41）之间施加硅胶粘合剂以将壳体部分（16,18）保持在一起。

公开(公告)号：US06780668B1

公开(公告)日：2004-08-24

申请号：US10031000

申请日：2002-01-16

申请人： Norihito Tsukahara ,  Takashi Akiguchi ,  Hidenori Miyakawa

发明人： Norihito Tsukahara ,  Takashi Akiguchi ,  Hidenori Miyakawa

IPC分类号： H01L2150

CPC分类号： H01L24/82 ,  G06K19/07745 ,  H01L21/56 ,  H01L21/561 ,  H01L21/563 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/49855 ,  H01L24/19 ,  H01L24/27 ,  H01L24/29 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/274 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/18161 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3511 ,  H01L2224/82 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599

摘要： A bump is formed on each element electrode of a semiconductor device, and a thermoplastic resin sheet is aligned in position with the semiconductor device. The sheet and the semiconductor device are subjected to hot pressing to melt the sheet, forming a thermoplastic resin portion that covers a portion other than the end surface of each bump of the semiconductor device. The thermoplastic resin portion obtained after the hot pressing is out.

摘要翻译： 在半导体器件的每个元件电极上形成凸起，并且热塑性树脂片与半导体器件对准。 对片材和半导体器件进行热压以熔化片材，形成覆盖半导体器件的每个凸起的端面之外的部分的热塑性树脂部分。 热压后获得的热塑性树脂部分出来。

公开(公告)号：US06686222B2

公开(公告)日：2004-02-03

申请号：US10147070

申请日：2002-05-17

申请人： Shoko Omizo ,  Atsushi Yoshimura ,  Mikio Matsui ,  Takao Sato

发明人： Shoko Omizo ,  Atsushi Yoshimura ,  Mikio Matsui ,  Takao Sato

IPC分类号： H01L2150

CPC分类号： H01L23/49811 ,  H01L23/544 ,  H01L25/105 ,  H01L2223/54473 ,  H01L2224/16 ,  H01L2225/1023 ,  H01L2225/107 ,  H05K3/4614 ,  H05K3/4638

摘要： In a semiconductor device manufacturing method, a semiconductor element is mounted on a substrate including first connection electrodes, first interconnections electrically connected to the first connection electrodes and a first alignment mark with the semiconductor element electrically connected to the first interconnections. Then, the substrate having the semiconductor element mounted thereon and a core substrate including second connection electrodes and second interconnections electrically connected to the second connection electrode and having adhesive layers formed on both surfaces thereof are positioned with respect to and stacked on each other based on recognition of the first alignment mark, thermo-compression bonding is performed at temperatures at which an adhesive agent of the adhesive layers is melted, without being cured, to temporarily fix the substrate having the semiconductor element mounted thereon on the core substrate by tackiness of the adhesive agent.

摘要翻译： 在半导体器件制造方法中，半导体元件安装在包括第一连接电极的基板上，与第一连接电极电连接的第一互连和与第一互连电连接的半导体元件的第一对准标记。 然后，在其上安装有半导体元件的基板和包括第二连接电极的芯基板和与第二连接电极电连接并且在其两个表面上形成的粘合剂层的第二互连基于识别而相对于彼此定位 在第一对准标记的温度下，在粘合剂层的粘合剂被熔化而不固化的温度下进行热压接，通过粘合剂的粘性将其上安装有半导体元件的基板临时固定在芯基板上 代理商

公开(公告)号：US06593167B2

公开(公告)日：2003-07-15

申请号：US10214373

申请日：2002-08-06

申请人： Hisanobu Dobashi ,  Shinji Nishimura ,  Toshinori Sonehara

发明人： Hisanobu Dobashi ,  Shinji Nishimura ,  Toshinori Sonehara

IPC分类号： H01L2150

CPC分类号： G06K19/07726 ,  G06K19/07749 ,  G06K19/07779 ,  G06K19/07783 ,  G06K19/07784 ,  H05K1/0286

摘要： An IC card whose state of usage can be judged by a user from an appearance of the card, and a relevant IC card system and method are provided. In an IC card fed electricity from an IC card reader-writer via feeding means using one of electromagnetic coupling and electrostatic coupling, and the IC card having an IC chip which communicates with the IC card reader-writer, the possible/impossible state of usage of the card by a user is determined using electric means for disconnecting or non-disconnecting the feeding means or providing another circuit and disconnecting this circuit, and appearance of the IC card is also changed at the time of the change caused by such electric means and thereby the state of usage of the card is indicated to the user.

公开(公告)号：US06551862B2

公开(公告)日：2003-04-22

申请号：US09978724

申请日：2001-10-18

申请人： Riyouichi Oota ,  Tsugihiko Hirano ,  Atsushi Fujisawa ,  Takafumi Konno

发明人： Riyouichi Oota ,  Tsugihiko Hirano ,  Atsushi Fujisawa ,  Takafumi Konno

IPC分类号： H01L2150

CPC分类号： H01L21/6836 ,  H01L21/565 ,  H01L23/16 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/564 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device is disclosed, comprising a tape substrate which supports a semiconductor chip, an insulating adhesive layer disposed between the semiconductor chip and the tape substrate, an insulating sheet member laminated to the insulating adhesive layer and formed harder than the insulating adhesive layer, wires for connecting pads on the semiconductor chip with connecting terminals on the tape substrate, a sealing portion formed by sealing the semiconductor chip with resin, and plural solder balls provided on a back of the tape substrate. A die bonding layer for fixing the semiconductor chip thereto is composed of an insulating adhesive layer and the insulating sheet member laminated thereto. The die bonding layer is formed thick by such a multi-layer structure, whereby the resin balance of the surface and back of the semiconductor chip is improved to prevent warping of a package and improve the mounting temperature cyclicity and reflow characteristic.

公开(公告)号：US06531232B1

公开(公告)日：2003-03-11

申请号：US09807688

申请日：2001-04-16

申请人： François Baleras ,  Pierre Renard

发明人： François Baleras ,  Pierre Renard

IPC分类号： H01L2150

CPC分类号： H01L23/66 ,  B81B7/0064 ,  B81C1/00269 ,  B81C2203/019 ,  H01L21/50 ,  H01L23/10 ,  H01L23/552 ,  H01L2924/1617 ,  Y10T428/12347 ,  Y10T428/12396 ,  Y10T428/12528

摘要： The invention relates to a system comprising a first substrate (100) with at least one bonding area (110a, 110b), liable to be assembled with a second substrate (200), the bonding area (110a, 110b) comprising an area made of a material (104) that can be wetted with a meltable material. According to the invention, the bonding area (110a, 110b) comprises at least one cavity (120) to receive meltable material.

摘要翻译： 本发明涉及一种包括具有至少一个接合区域（110a，110b）的第一衬底（100）的系统，易于与第二衬底（200）组装，所述接合区域（110a，110b）包括由 可以用可熔材料润湿的材料（104）。 根据本发明，接合区域（110a，110b）包括至少一个用于接收可熔化材料的空腔（120）。

公开(公告)号：US06495399B1

公开(公告)日：2002-12-17

申请号：US09431238

申请日：1999-11-01

申请人： Shyue-Fong Quek ,  Ting Cheong Ang ,  Duay Ing Ong ,  Sang Yee Loong

发明人： Shyue-Fong Quek ,  Ting Cheong Ang ,  Duay Ing Ong ,  Sang Yee Loong

IPC分类号： H01L2150

CPC分类号： H01L23/3107 ,  H01L23/5221 ,  H01L23/5222 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor chip device package comprised of a semiconductor substrate having semiconductor devices formed on the semiconductor substrate. At least one dielectric layer is over the semiconductor substrate. At least one layer of interconnects is over the semiconductor devices and within the at least one respective dielectric layer with at least a portion of the interconnects being separated by voids having a vacuum or air therein. A passivation layer is over the uppermost of the at least one layer of interconnects. Wherein the semiconductor chip device is vacuum sealed within a semiconductor chip device package.

摘要翻译： 一种半导体芯片器件封装，包括形成在半导体衬底上的具有半导体器件的半导体衬底。 至少一个电介质层在半导体衬底之上。 至少一层互连在半导体器件之上，并且在至少一个相应的电介质层内，其中至少一部分互连由其中具有真空或空气的空隙分开。 钝化层位于至少一层互连层的最上面。 其中半导体芯片器件被真空密封在半导体芯片器件封装内。

公开(公告)号：US06489185B1

公开(公告)日：2002-12-03

申请号：US09660755

申请日：2000-09-13

申请人： Steven Towle ,  Paul Koning

发明人： Steven Towle ,  Paul Koning

IPC分类号： H01L2150

CPC分类号： H01L21/568 ,  H01L21/56 ,  H01L21/561 ,  H01L21/6835 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/20 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01078 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/18162 ,  H01L2924/351 ,  H01L2224/82 ,  H01L2924/00

摘要： A present invention includes a packaging technology that fabricates build-up layers on an encapsulated microelectronic die that has expanded area larger than that of the microelectronic die. An active surface of a microelectronic die is attached by an adhesive material to a protective film sheet to protect the active surface and to control the position of the microelectronic die during an encapsulation process. The protective film sheet has adhesive material substantially only in an area where the microelectronic die and/or a microelectronic package core are attached, or has the adhesive properties of the adhesive material diminished or eliminated in areas where an encapsulation material will be applied.

摘要翻译： 本发明包括一种封装技术，其在封装的微电子管芯上制造积层，该封装的微电子管芯的扩展面积大于微电子管芯的扩展面积。 微电子管芯的活性表面通过粘合剂材料附着到保护膜片上以保护活性表面并且在封装过程期间控制微电子管芯的位置。 保护膜片基本上仅在微电子管芯和/或微电子封装芯附接的区域中具有粘合剂材料，或者在将要施加封装材料的区域中粘合剂材料的粘合性能减弱或消除。

公开(公告)号：US06458624B1

公开(公告)日：2002-10-01

申请号：US09946689

申请日：2001-09-04

申请人： Tongbi Jiang ,  Whonchee Lee

发明人： Tongbi Jiang ,  Whonchee Lee

IPC分类号： H01L2150

CPC分类号： H01L24/31 ,  C09J9/02 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2224/83886 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H05K3/321 ,  H05K3/323 ,  H05K2203/121 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2224/05624 ,  H01L2924/00014 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05669

摘要： Resistance-reducing conductive adhesives, and apparatus and methods of attaching electronic components using resistance-reducing conductive adhesives are provided. In one embodiment, a resistance-reducing conductive adhesive includes a first quantity of conductive adhesive, and a second quantity of a chelating agent combined with the conductive adhesive. The chelating agent reacts with an oxidized conductive material (e.g. alumina or aluminum ion) on a conductive lead to form soluble conductive metal-ligand complex. The chelating agent may also passivate the oxide-free conductive material by forming hydrogen bonds. The resistance of the resulting electrical connection is reduced in comparison with prior art methods of conductive adhesive coupling, providing improved signal strength, reduced power consumption, and decreased waste heat. In alternate embodiments, the conductive adhesive may include an anisotropically conductive adhesive, an isotropically conductive adhesive, a conductive epoxy, or a hydrophilic adhesive.

摘要翻译： 提供了降低阻力的导电粘合剂，以及使用电阻降低导电粘合剂附着电子元件的装置和方法。 在一个实施方案中，电阻降低导电粘合剂包括第一量的导电粘合剂和与导电粘合剂组合的第二量的螯合剂。 螯合剂与导电引线上的氧化的导电材料（例如氧化铝或铝离子）反应形成可溶的导电金属 - 配体络合物。 螯合剂也可以通过形成氢键来钝化无氧化物的导电材料。 与现有技术的导电粘合剂耦合方法相比，所得到的电连接的电阻降低，提供改善的信号强度，降低的功率消耗和减少的废热。 在替代实施例中，导电粘合剂可以包括各向异性导电粘合剂，各向异性导电粘合剂，导电环氧树脂或亲水性粘合剂。