A method and assembly (10) for conducting heat from a semiconductor device, such as a power flip chip (12). The assembly (10) is generally constructed to dissipate heat from the flip chip (12) when mounted to a flexible or rigid substrate (20). Heat is conducted from the flip chip (12) through upper and lower pedestals (26, 28) each of which includes a pliable pre-cured silicone adhesive pad (32, 36). The pre-cured silicon adhesive pads (32, 36) promote thermal contact while also decoupling any lateral mechanical strains that may arise as a result of different thermal expansion and movement between the flip chips (12). The housing portions (16, 18) form a housing (14) when assembled, with each housing portion (16, 18) including a configured edge (37, 41) that controls the travel of the pedestals (26, 28) toward each other, to thereby limit the pressure exerted on the flip chip (12) disposed therebetween. Silicone adhesive can be applied between the edges (37, 41) to hold the housing portions (16, 18) together.