摘要:
A method uses three dimensional feature metrology for implementation of critical image control and feedback of lithographic focus and x/y tilt. The method is for measuring 3 dimensional profile changes in a photo sensitive film and feeding back compensatory exposure tool focus corrections to maintain a stable lithographic process. The measured focus change from the optimal tool focus offset is monitored directly on the critical product images for both contact hole and line images. Z Focus corrections and x/y tilt corrections are fed back independently of dose to maintain critical dimension (CD) control. Additionally, the method can be used to diagnose problems with the focusing system by measuring the relationship between line edge width and barometric pressure.
摘要:
Disclosed are data processing method, apparatus, and computer readable medium for generating data about mask, reticle, etc., for making exposure, and exposing method, apparatus and computer readable medium for performing exposure during manufacture of LSI, semiconductor device, magnetic device, liquid crystal, etc. When generating revision exposure data from design data, the correction position of revision data is designated and data processing of only designated correction portion is performed. Positional information of correction portion is added to header or footer section of revision exposure data.
摘要:
An alignment system for a lithographic apparatus has a source of alignment radiation that has a first wavelength and a second wavelength; a detection system that has a first wavelength channel arranged to receive alignment radiation from an alignment mark at the first wavelength and a second wavelength channel arranged to receive alignment radiation from the alignment mark at the second wavelength; and a position determining unit in communication with the detection system. The position determining unit processes information from the first and second wavelength channels in combination to determine a position of the alignment mark based on information from the first wavelength channel, information from the second wavelength channel or combined information from the first and second wavelength channels according to a relative strength of the alignment radiation detected at the first wavelength to alignment radiation detected at the second wavelength. A lithographic apparatus includes the above alignment system. Methods of alignment and manufacturing devices use the above alignment system and lithographic apparatus, respectively.
摘要:
An exposure method for a photolithographic process uses a projection exposure apparatus including a projection optical system. The surface of a first shot area on a wafer is caused to be coincident with an image plane of the projection optical system within an exposure field thereof so as to achieve focused condition, and an image of a reticle pattern is transferred onto the first shot area. Then, a second shot area is moved into the exposure field, during which the vertical position of the wafer is corrected by means of a Z/levelling-stage so as to compensate for the variation in the vertical position of the wafer W which could otherwise occur depending on the angle formed between the running plane of the wafer stage and the image plane. Then, an AF sensor system is used to measure and store a defocus amount of the second shot area relative to the image plane. Then, focusing and exposure are performed for the second shot area. This procedure is repeated for the shot areas on the wafer so as to obtain a plurality of defocus amounts, from which any foreign matter existing on the bottom of the wafer are detected. In another embodiment, the vertical position and tilt angle of the wafer are caused to be coincident with those of the image plane, and the first shot area is exposed. Then, the wafer is moved so as to position the second shot area into the exposure field, during which the tilt angle of the surface of the wafer is kept unchanged. Then, the tilt angle of the wafer is measured and stored. Thereafter, the vertical position and tilt angle of the wafer are caused to be coincident with those of the image plane, and the second shot area is exposed. Foreign matter are detected from a distribution of the tilt angles on the surface of the wafer.
摘要:
The position or the inclination of a substrate surface is detected at a high accuracy and a high speed, and corrected. When moving the substrate in a direction substantially at right angles to an optical axis of a projection optical system and feeding an area on the substrate into an image space of the projection optical system, at least one of the position and inclination in the optical axis direction of the substrate is detected, to bring that area into focus with the focal plane of the projection optical system. One of a first mode of conducting the measurement during travel of the substrate and a second mode of performing the measurement in a state in which that area has substantially been positioned in the image space is selected.
摘要:
A coordinate position of a stage for supporting a wafer or a reticle which is driven by a linear motor includes a stator and a mover is measured by a laser interferometer, and a thrust obtained from a deviation between the measured coordinate position and an aimed coordinate position is output to a multiplier. Further, a cosine function corresponding to a phase between the stator and the mover is obtained on the basis of the measured coordinate position and is output to the multiplier. Then, an exciting current is supplied to an armature coil of the linear motor on the basis of an output of the multiplier.
摘要:
An aligner for exposing a pattern image of an original plate by projecting the image onto an exposure surface of a substrate, which is held on a table, in a focused state through a projection optical system includes a defocusing detection device for detecting a deviation from a focusing position at each of a plurality of points within an exposure region on the surface of the substrate, which is arranged at an exposure position, a device for determining an approximate plane of the exposure surface of the substrate within the exposure region on the basis of deviation detection values detected at the plurality of points by the defocusing detection device and a decision device for determining a deviation of the approximate plane of the exposure surface of the substrate, on the basis of the deviation detection values detected at each of the plurality of points, to decide whether contamination is present between the table and the back side of the substrate. Also disclosed is a contamination detecting method applied to such an aligner.
摘要:
A through-the-lens method and system for focusing a projected image onto an imaging surface employs a confocal process and apparatus. Electromagnetic radiation projected through a subresolution aperture of origin located in an object plane passes through a confocal imaging device which forms an image of the aperture in the image plane. The radiation strikes the surface and is reflected back through the confocal imaging device to the aperture. The power of reflected radiation passing through the aperture is detected/measured. The distance between the imaging surface and the imaging device is then adjusted to maximize the detected power.
摘要:
In the microlithographic system disclosed herein, the spaces between elements in a projection lens are filled with flowing helium gas which substantially reduces the refraction errors caused by barometric changes in the atmosphere, even though the portions of the optical path outside the lens are exposed to the atmosphere.
摘要:
In an electron beam lithography apparatus a capacitance height gauge is used to determine the distance between a reticule and electron optics. In order to calibrate the capacitance gauge an optical interferometer, including a mirror are mounted on the same axis as the capacitance gauge. The mirror is moved a predetermined distance so that the movement distance measured by the capacitance gauge and the interferometer can be compared.