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1.发明授权公开(公告)号：US12080689B2
公开(公告)日：2024-09-03
申请号：US17632058
申请日：2019-09-03
申请人： LG ELECTRONICS INC.
发明人： Dohee Kim , Gunho Kim , Yongil Shin , Bongchu Shim , Hyunwoo Cho
IPC分类号： H01L25/075 , H01L23/00 , H01L33/00
CPC分类号： H01L25/0753 , H01L24/83 , H01L24/95 , H01L24/29 , H01L24/32 , H01L33/007 , H01L33/0093 , H01L2224/29021 , H01L2224/32237 , H01L2224/83801 , H01L2224/95101 , H01L2224/95133 , H01L2224/95136
摘要： The present invention relates to a display device having a structure in which an assembly substrate on which self-assembly has taken place can be used as a final substrate, and a method for manufacturing same. According to an embodiment of the present invention, first-conductive-type electrodes of vertical-type semiconductor light-emitting elements can be connected to seed metal, which is used as a wiring electrode, via a solder part, and thus there is the effect of directly using, as a final substrate, an assembly substrate on which the vertical-type semiconductor light-emitting elements are self-assembled, without an additional transfer process.
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公开(公告)号：US11756938B2
公开(公告)日：2023-09-12
申请号：US17404943
申请日：2021-08-17
发明人： Yeoung Keol Woo , Chui Min Bae , Heon Sik Ha
IPC分类号： H01L25/075 , H01L33/62 , H01L23/00 , H01L33/38
CPC分类号： H01L25/0753 , H01L24/96 , H01L33/62 , H01L33/38 , H01L2224/95101 , H01L2224/95133 , H01L2933/0066
摘要： A light emitting device includes: a substrate; a first electrode and a second electrode on the substrate and spaced apart from each other; a light emitting diode between the first electrode and the second electrode and connected to the first and second electrodes; a first contact on the first electrode; and a second contact on the second electrode. The first contact contacts the first electrode and a first portion of the light emitting diode, and the second contact contacts the second electrode and a second portion of the light emitting diode.
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公开(公告)号：US11891299B2
公开(公告)日：2024-02-06
申请号：US17506247
申请日：2021-10-20
发明人： Anne Plochowietz , Matthew Shreve
CPC分类号： B81C99/002 , H01L21/67271 , H01L21/67294 , H01L24/95 , H01L2224/95133 , H01L2224/95145 , H01L2924/1461 , Y10T29/49133 , Y10T29/5313
摘要： Disclosed are methods and systems of controlling the placement of micro-objects on the surface of a micro-assembler. Control patterns may be used to cause phototransistors or electrodes of the micro-assembler to generate dielectrophoretic (DEP) and electrophoretic (EP) forces which may be used to manipulate, move, position, or orient one or more micro-objects on the surface of the micro-assembler. A set of micro-object may be analyzed. Geometric properties of the set of micro-objects may be identified. The set of micro-objects may be divided into multiple sub-sets of micro-objects based on the one or more geometric properties and one or more control patterns.
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公开(公告)号：US11798915B2
公开(公告)日：2023-10-24
申请号：US17819300
申请日：2022-08-11
发明人： Sung Jin Lee , Jin Yeong Kim , Jin Taek Kim , Soo Hyun Moon , Tae Hoon Yang , Seung Min Lee
CPC分类号： H01L24/97 , H01L24/24 , H01L24/82 , H01L25/167 , H01L27/1259 , H01L2224/24147 , H01L2224/95101 , H01L2224/95133
摘要： Provided is a display device including a substrate including a display area including a plurality of pixel areas, and a non-display area outside the display area, a pixel circuit layer including a plurality of circuit elements in the display area, a display element layer including a plurality of light-emitting elements in the display area on the pixel circuit layer, and first and second alignment lines on the substrate, and each including a main line at the same layer as at least one electrode on the display element layer, and a sub line electrically connected to the main line and at the same layer as at least one electrode on the pixel circuit layer, wherein the first alignment line and the second alignment line do not include the main line in the non-display area, and include the sub line to be spaced apart from one edge of the substrate.
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公开(公告)号：US20180182650A1
公开(公告)日：2018-06-28
申请号：US15391140
申请日：2016-12-27
IPC分类号： H01L21/67 , H01L21/68 , H01L21/683
CPC分类号： H01L21/67121 , B81C3/004 , B81C99/002 , H01L21/68 , H01L21/6835 , H01L21/6875 , H01L23/5386 , H01L24/95 , H01L25/0655 , H01L25/50 , H01L2221/68368 , H01L2224/95085 , H01L2224/95133
摘要： An apparatus including a bumped electrode array and a method of fabricating a bumped electrode array is disclosed. The method includes providing a substrate for the electrode array. The method also includes disposing a plurality of non-planar structures including electrodes above the substrate of the electrode array. The method further includes disposing a dielectric layer above the plurality of non-planar structures having a defined radius of curvature.
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6.发明授权公开(公告)号：US09137935B2
公开(公告)日：2015-09-15
申请号：US14497377
申请日：2014-09-26
IPC分类号： B23K31/02 , H05K13/00 , B23K1/00 , B23K1/20 , H05K3/30 , H01L23/00 , H05K13/02 , H05K13/04 , H05K3/34
CPC分类号： H05K13/0015 , B23K1/0016 , B23K1/20 , H01L24/05 , H01L24/13 , H01L24/81 , H01L24/95 , H01L2224/0401 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/13111 , H01L2224/29111 , H01L2224/81002 , H01L2224/81085 , H01L2224/81444 , H01L2224/81447 , H01L2224/81455 , H01L2224/95001 , H01L2224/95085 , H01L2224/95133 , H01L2924/0132 , H01L2924/10156 , H01L2924/15788 , H05K3/303 , H05K3/3436 , H05K13/027 , H05K13/04 , H05K2201/083 , H05K2203/04 , H05K2203/048 , H05K2203/0776 , H05K2203/104 , Y02P70/613 , H01L2924/01082 , H01L2924/01083 , H01L2924/0105 , H01L2924/00
摘要： A method and apparatus for self-assembling a part on a substrate are disclosed herein. In some embodiments, a method includes placing a substrate having a first binding site capable of generating a first magnetic field and having a first shaped surface with a first droplet conformably disposed thereon into a first fluid; placing a part having a second binding site capable of generating a second magnetic field and having a second shaped surface with a second droplet conformably disposed on the second shaped surface into the first fluid; and attracting the part towards the first binding site such that an equilibrium is formed between an attractive force and a repulsive force such that the part is free to rotate about the first binding site to minimize the repulsive force when the first and second shaped surfaces rotate into an alignment causing the part to aligned with the first binding site.
摘要翻译： 本文公开了一种用于自组装衬底上的部件的方法和装置。 在一些实施例中，一种方法包括放置具有能够产生第一磁场的第一结合位点的基底，并具有第一成形表面，其中第一液滴顺应地设置在第一流体中; 放置具有能够产生第二磁场的第二结合位点的部分，并具有第二成形表面，其中第二液滴在第二成形表面上顺应地设置在第一流体中; 并且将部分吸引到第一结合部位，使得在吸引力和排斥力之间形成平衡，使得部件围绕第一结合部位自由旋转，以使当第一和第二成形表面旋转时的排斥力最小化 使部分与第一结合位点对准的对准。
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公开(公告)号：US12068279B2
公开(公告)日：2024-08-20
申请号：US17630595
申请日：2020-06-03
发明人： Won Ho Lee , Hyun Deok Im , Jong Hyuk Kang , Jin Oh Kwag , Keun Kyu Song , Sung Chan Jo , Hyun Min Cho
CPC分类号： H01L24/95 , B41M3/006 , H01L21/68 , H01L25/167 , H01L24/24 , H01L24/25 , H01L2224/24051 , H01L2224/24101 , H01L2224/24145 , H01L2224/25175 , H01L2224/95102 , H01L2224/95133
摘要： A dipole alignment device includes an electric field forming part including a stage, and a probe part which form an electric field on the stage; an inkjet printing apparatus including at least one inkjet head which sprays ink including dipoles and a solvent with the dipoles dispersed therein onto the stage; a transportation part comprising a first moving part which moves the electric field forming part in at least one direction; and a light irradiation apparatus including a light irradiation part which applies light to the ink sprayed onto the stage.
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8.发明公开公开(公告)号：US20240266329A1
公开(公告)日：2024-08-08
申请号：US18580914
申请日：2021-07-22
申请人： LG ELECTRONICS INC.
发明人： Junoh SHIN , Byoungkwon CHO , Wonseok CHOI , Jeonghyo KWON
IPC分类号： H01L25/075 , H01L33/00 , H01L33/38 , H01L33/44
CPC分类号： H01L25/0753 , H01L33/0093 , H01L33/38 , H01L33/44 , H01L2224/95133 , H01L2933/0016
摘要： The present disclosure is applicable to a technical field related to display devices, and relates to a display device using, for example, a micro light emitting diode (LED), and a manufacturing method therefor. The present disclosure may comprise: a substrate; a partition defining a unit pixel region; a first electrode located in the unit pixel region; a semiconductor light-emitting element electrically connecting a first-type electrode to the first electrode and provided in the unit pixel region; an inclined a layer formed on the semiconductor light-emitting element and the partition, and having a high incline on the semiconductor light-emitting element; and a second electrode electrically connected, on the inclined coating layer, to a second-type electrode of the semiconductor light-emitting element.
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公开(公告)号：US11673800B2
公开(公告)日：2023-06-13
申请号：US17591493
申请日：2022-02-02
发明人： Anne Plochowietz , Bradley Rupp , Jengping Lu , Julie A. Bert , Lara S. Crawford , Sourobh Raychaudhuri , Eugene M. Chow , Matthew Shreve , Sergey Butylkov
CPC分类号： B81C99/002 , H01L21/67271 , H01L21/67294 , H01L24/95 , H01L2224/95133 , H01L2224/95145 , H01L2924/1461 , Y10T29/49131 , Y10T29/5313
摘要： Disclosed are methods and systems of controlling the placement of micro-objects on the surface of a micro-assembler. Control patterns may be used to cause electrodes of the micro-assembler to generate dielectrophoretic (DEP) and electrophoretic (EP) forces which may be used to manipulate, move, position, or orient one or more micro-objects on the surface of the micro-assembler. The control patterns may be part of a library of control patterns.
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10.发明申请公开(公告)号：US20150048148A1
公开(公告)日：2015-02-19
申请号：US14497377
申请日：2014-09-26
CPC分类号： H05K13/0015 , B23K1/0016 , B23K1/20 , H01L24/05 , H01L24/13 , H01L24/81 , H01L24/95 , H01L2224/0401 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/13111 , H01L2224/29111 , H01L2224/81002 , H01L2224/81085 , H01L2224/81444 , H01L2224/81447 , H01L2224/81455 , H01L2224/95001 , H01L2224/95085 , H01L2224/95133 , H01L2924/0132 , H01L2924/10156 , H01L2924/15788 , H05K3/303 , H05K3/3436 , H05K13/027 , H05K13/04 , H05K2201/083 , H05K2203/04 , H05K2203/048 , H05K2203/0776 , H05K2203/104 , Y02P70/613 , H01L2924/01082 , H01L2924/01083 , H01L2924/0105 , H01L2924/00
摘要： A method and apparatus for self-assembling a part on a substrate are disclosed herein. In some embodiments, a method includes placing a substrate having a first binding site capable of generating a first magnetic field and having a first shaped surface with a first droplet conformably disposed thereon into a first fluid; placing a part having a second binding site capable of generating a second magnetic field and having a second shaped surface with a second droplet conformably disposed on the second shaped surface into the first fluid; and attracting the part towards the first binding site such that an equilibrium is formed between an attractive force and a repulsive force such that the part is free to rotate about the first binding site to minimize the repulsive force when the first and second shaped surfaces rotate into an alignment causing the part to aligned with the first binding site.
摘要翻译： 本文公开了一种用于自组装衬底上的部件的方法和装置。 在一些实施例中，一种方法包括放置具有能够产生第一磁场的第一结合位点的基底，并具有第一成形表面，其中第一液滴顺应地设置在第一流体中; 放置具有能够产生第二磁场的第二结合位点的部分，并具有第二成形表面，其中第二液滴在第二成形表面上顺应地设置在第一流体中; 并且将部分吸引到第一结合部位，使得在吸引力和排斥力之间形成平衡，使得部件围绕第一结合部位自由旋转，以使当第一和第二成形表面旋转时的排斥力最小化 使部分与第一结合位点对准的对准。
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