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公开(公告)号：US20220352446A1
公开(公告)日：2022-11-03
申请号：US17638444
申请日：2019-08-30
申请人： LG ELECTRONICS INC.
发明人： Indo CHUNG , Jeonghyo KWON , Dohan KIM
摘要： The present specification provides a new type of a display device in which a wiring process is easily performed after a semiconductor light emitting element having a vertical structure is assembled on a substrate. Here, a semiconductor light emitting device according to an embodiment of the present invention is characterized by comprising: a substrate; a wiring electrode positioned on the substrate; a dielectric film positioned on the wiring electrode; an assembly electrode positioned on the dielectric film; an assembly insulating film positioned on the assembly electrode; a partition wall positioned on the assembly insulting film and defining an assembly groove to which a semiconductor light emitting element is assembled; and the semiconductor light emitting element which is assembled to the assembly groove and provided with conductive electrodes on both ends thereof, wherein the wiring electrode is provided with a protrusion portion, and the protrusion portion protrudes toward the assembly groove and is electrically connected to the conductive electrode on one end of the semiconductor light emitting element.
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2.发明申请公开(公告)号：US20230005887A1
公开(公告)日：2023-01-05
申请号：US17780873
申请日：2019-12-03
申请人： LG ELECTRONICS INC.
发明人： Jeonghyo KWON , Soohyun KIM , Indo CHUNG
IPC分类号： H01L25/075 , H01L33/44 , H01L33/62
摘要： Discussed is a display device including a base portion; assembly electrodes that extend in one direction and are disposed on the base portion at predetermined intervals; a dielectric layer deposited on the base portion to cover the assembly electrodes; a first wiring electrode that extends in the same direction as the assembly electrodes and is disposed on the dielectric layer so as not to overlap the assembly electrodes; a partition wall portion deposited on the dielectric layer while arranging cells at predetermined intervals to overlap the assembly electrodes and the first wiring electrode along an extension direction of the assembly electrodes; and semiconductor light-emitting elements seated in the cells, respectively, wherein a solder layer electrically connecting a semiconductor light-emitting element seated in a cell and the first wiring electrode overlapping the cell is filled in the cell from among the plurality semiconductor light emitting elements and the cells.
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3.发明公开公开(公告)号：US20240266329A1
公开(公告)日：2024-08-08
申请号：US18580914
申请日：2021-07-22
申请人： LG ELECTRONICS INC.
发明人： Junoh SHIN , Byoungkwon CHO , Wonseok CHOI , Jeonghyo KWON
IPC分类号： H01L25/075 , H01L33/00 , H01L33/38 , H01L33/44
CPC分类号： H01L25/0753 , H01L33/0093 , H01L33/38 , H01L33/44 , H01L2224/95133 , H01L2933/0016
摘要： The present disclosure is applicable to a technical field related to display devices, and relates to a display device using, for example, a micro light emitting diode (LED), and a manufacturing method therefor. The present disclosure may comprise: a substrate; a partition defining a unit pixel region; a first electrode located in the unit pixel region; a semiconductor light-emitting element electrically connecting a first-type electrode to the first electrode and provided in the unit pixel region; an inclined a layer formed on the semiconductor light-emitting element and the partition, and having a high incline on the semiconductor light-emitting element; and a second electrode electrically connected, on the inclined coating layer, to a second-type electrode of the semiconductor light-emitting element.
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公开(公告)号：US20230049446A1
公开(公告)日：2023-02-16
申请号：US17794395
申请日：2020-02-12
申请人： LG ELECTRONICS INC.
发明人： Soohyun KIM , Sungyun PARK , Indo CHUNG , Jeonghyo KWON
IPC分类号： H01L25/075 , H01L33/62
摘要： The present invention relates to a display apparatus, specifically to a display apparatus using semiconductor light-emitting elements of a few micrometers to tens of micrometers in size. The present invention provides a display apparatus comprising: a base part; a partition part having a plurality of grooves; a plurality of semiconductor light-emitting elements arranged on the base part and mounted in the plurality of grooves; first and second wiring electrodes arranged on one side and the other side of each of the semiconductor light-emitting elements, respectively; an assembly electrode arranged on the base part and arranged on the one side of each of the semiconductor light-emitting elements; and a dielectric layer arranged on the base part and arranged between the assembly electrode and the first wiring electrode, wherein each of the plurality of grooves includes at least one recess portion formed in the horizontal direction with respect to the base part.
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公开(公告)号：US20240363818A1
公开(公告)日：2024-10-31
申请号：US18572064
申请日：2021-06-30
申请人： LG ELECTRONICS INC.
发明人： Jeonghyo KWON , Wonseok CHOI , Junoh SHIN , Sungmin PARK
CPC分类号： H01L33/62 , H01L25/167
摘要： The display device can comprise a first wiring, a second wiring disposed on a different layer from the first wiring, a pad disposed on the same layer as the second wiring and that vertically overlaps the first wiring, and on the pad and the second wiring. It is disposed and can comprise an insulating layer having an assembly hole, and a semiconductor light emitting device disposed on a pad and a second wiring within the assembly hole. The embodiment prevents separation of the semiconductor light emitting device, improves the light efficiency of the semiconductor light emitting device to implement high luminance, and significantly improves light efficiency, thereby implementing further improved high resolution.
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6.发明公开公开(公告)号：US20240266472A1
公开(公告)日：2024-08-08
申请号：US18691668
申请日：2021-09-14
发明人： Junoh SHIN , Jeonghyo KWON
IPC分类号： H01L33/38 , H01L25/075 , H01L33/12 , H01L33/20 , H01L33/62
CPC分类号： H01L33/382 , H01L25/0753 , H01L33/12 , H01L33/20 , H01L33/62
摘要： The present invention is applicable to display device-related technical fields and, for example, relates to a display device using micro LED (Light Emitting Diode) and a method of manufacturing the same. The present invention includes a substrate including a pixel area and a pad area located around the pixel area; a barrier layer located on the substrate and defining a plurality of unit pixel areas within the pixel area; a stress separation line located between the unit pixel areas on the barrier layer; a first electrode located in the unit pixel area; a semiconductor light emitting device in which a first type electrode is electrically connected to the first electrode within the unit pixel area; a coating layer formed on the semiconductor light emitting device and the barrier layer; and a second electrode electrically connected to the type second electrode of the semiconductor light emitting device on the coating layer.
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公开(公告)号：US20230110862A1
公开(公告)日：2023-04-13
申请号：US17904506
申请日：2020-02-25
申请人： LG ELECTRONICS INC.
发明人： Youngdo KIM , Soohyun KIM , Indo CHUNG , Jeonghyo KWON , Junoh SHIN
IPC分类号： H01L33/38 , H01L25/075 , H01L33/62
摘要： A display apparatus according to the present invention comprises a substrate including semiconductor light-emitting devices and a wiring electrode electrically connected to the semiconductor light-emitting devices, wherein the substrate comprises: a base portion; assembly electrodes extending in one direction and arranged on the base portion; a dielectric layer formed to cover the assembly electrodes; a barrier portion formed on the dielectric layer while forming a cell on which the semiconductor light-emitting devices are mounted along an extension direction of the assembly electrodes; and a planarization layer formed to cover the barrier portion while forming a hole overlapping the cell, wherein the hole comprises: a first hole exposing the semiconductor light-emitting device; and a second hole exposing the dielectric layer or the base portion.
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8.发明公开公开(公告)号：US20240038825A1
公开(公告)日：2024-02-01
申请号：US18227788
申请日：2023-07-28
申请人： LG ELECTRONICS INC.
发明人： Byoungkwon CHO , Wonseok CHOI , Jeonghyo KWON , Sungmin PARK
CPC分类号： H01L27/156 , G09G3/32 , H01L33/24 , H01L33/44 , H01L33/405 , G09G2300/0842
摘要： The embodiment relates to a semiconductor light emitting device for a display pixel and a display device including the same. A semiconductor light emitting device for a display pixel according to an embodiment can include a light emitting structure including a first conductivity type semiconductor layer, a second conductivity type semiconductor layer and an active layer disposed therebetween, a passivation layer disposed on the light emitting structure, and a second electrode layer disposed under the light emitting structure. The light emitting structure may include a rounding semiconductor layer in which an upper surface thereof is partially rounded.
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公开(公告)号：US20230215982A1
公开(公告)日：2023-07-06
申请号：US18093700
申请日：2023-01-05
发明人： Sunyong SONG , Wonseok CHOI , Jeonghyo KWON , Junoh SHIN , Youngdo KIM
CPC分类号： H01L33/382 , H01L33/62
摘要： Discussed is a display device including a semiconductor light emitting device. A display device can include a substrate, first assembly electrodes, second assembly electrodes and the first assembly electrodes spaced apart from each other on the substrate, an insulating layer disposed on the second assembly electrode, an assembly barrier wall including a predetermined assembly hole and disposed on the insulating layer, a plating layer electrically connected to the first assembly electrode and the second assembly electrode, and a semiconductor light emitting device disposed in the assembly hole and electrically connected to the first assembly electrode and the second assembly electrode by the plating layer.
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公开(公告)号：US20220375915A1
公开(公告)日：2022-11-24
申请号：US17770855
申请日：2019-10-22
申请人： LG ELECTRONICS INC.
发明人： Dohan KIM , Jeonghyo KWON , Soohyun KIM , Indo CHUNG
摘要： The present disclosure provides a novel form of a display device which enables semiconductor light emitting elements having a vertical structure to be assembled onto a substrate and then wiring process to be performed stably without any change to the position of the elements during post-processing. The display device according to one embodiment of the present disclosure comprises: a substrate; a pair of assembly electrodes positioned on the substrate; a dielectric layer positioned on the assembly electrodes; a wiring electrode positioned on the dielectric layer and comprising a base electrode part and a low melting point junction; a partition wall which overlaps with a portion of the wiring electrode, is positioned on the dielectric layer, and defines an assembly groove to which a semiconductor light emitting element is assembled; and the vertical semiconductor light emitting element which is assembled in the assembly groove and is electrically connected to the low melting point junction of the wiring electrode, wherein the low melting point junction has a flow stop angle for controlling the thermal flow characteristic of the junction.
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