摘要:
Apparatus and methods are disclosed, including memory devices and systems. Example memory devices, systems and methods include a buffer interface to translate high speed data interactions on a host interface side into slower, wider data interactions on a DRAM interface side. The slower, and wider DRAM interface may be configured to substantially match the capacity of the narrower, higher speed host interface. In some examples, the buffer interface may be configured to provide multiple sub-channel interfaces each coupled to one or more regions within the memory structure and configured to facilitate data recovery in the event of a failure of some portion of the memory structure. Selected example memory devices, systems and methods include an individual DRAM die, or one or more stacks of DRAM dies coupled to a buffer die.
摘要:
Methods, apparatuses, and systems related to combining and utilizing multiple memory circuits having complementary characteristics are described. An apparatus may include a first memory circuit having a first emphasized characteristic and a second memory circuit having a second emphasized characteristic. The first and second memory circuits may be connected in parallel and to a common interface configured to communicate data between the apparatus and an external device.
摘要:
Memory devices, systems and methods include a buffer interface to translate high speed data interactions on a host interface side into slower, wider data interactions on a DRAM interface side. The slower, and wider DRAM interface may be configured to substantially match the capacity of the narrower, higher speed host interface. In some configurations, the buffer interface may be configured to provide multiple sub-channel interfaces each coupled to one or more regions within the memory structure and configured to facilitate data recovery in the event of a failure of some portion of the memory structure. Selected memory devices, systems and methods include an individual DRAM die, or one or more stacks of DRAM dies coupled to a buffer die.
摘要:
Provided is a semiconductor device including an error correction code circuit. The semiconductor device includes a bank including a memory area for storing data and an error correction for storing parity data, an error correction code calculation circuit that corrects an error of a failed cell in correspondence to the data and the parity data and outputs a flag signal activated at a time of a generation of failed data and an address activated in the bank, an address latch circuit that stores the address applied from the error correction code calculation circuit and outputs a failed address according to the flag signal, and a fail prevention circuit that performs an operation for repairing the failed data in correspondence to the flag signal and the failed address.
摘要:
A method for updating a DRAM memory array is disclosed. The method comprises: a) transitioning the DRAM memory array from an idle state to a refresh state in accordance with a command from a memory controller; b) initiating a refresh on the DRAM memory array using DRAM internal control circuitry by activating a row of data into an associated sense amplifier buffer; and c) during the refresh, performing an ERR Correction Code (ECC) scrub operation of selected bits in the activated row of the DRAM memory array.
摘要:
A memory device may include a plurality of memory cells; and an error detection unit suitable for latching first read data of one or more memory cells selected from the plurality of memory cells after refreshing the selected memory cells, in a first phase, and suitable for detecting errors of the selected memory cells before refreshing the selected memory cells, in a second phase.
摘要:
A dynamic random access memory (DRAM) with code bit and self-refresh operation is disclosed. In one particular exemplary embodiment, at least one code bit is appended to N bits of user data to form a new code data. The user data are stored in a plurality of user data sub-arrays and code bit is stored in code bit sub-array respectively. Each sub-array stores at least one bit per user-specified row and column address. Each sub-array is independently controlled in either refresh operation or user operation.Refresh operation works on at least one sub-array at a time out of a plurality of sub-arrays. User operations work on other sub-arrays out of a plurality of sub-arrays. User read operation and internal refresh operation can work concurrently.
摘要:
A system and method of refreshing dynamic random access memory (DRAM) are disclosed. A device includes a DRAM, a bus, and a system-on-chip (SOC) coupled via the bus to the DRAM. The SOC is configured to refresh the DRAM at a particular refresh rate based on a temperature of the DRAM and based on calibration data determined based on one or more calibration tests performed while the SOC is coupled to the DRAM.
摘要:
A DRAM memory device includes several banks of memory cells each of which are divided into first and second sets of memory cells. The memory cells in the first set can be refreshed at a relatively slow rate to reduce the power consumed by the DRAM device. Error checking and correcting circuitry in the DRAM device corrects any data retention errors in the first set of memory cells caused by the relatively slow refresh rate. The memory cells in the second set are refreshed at a normal rate, which is fast enough that data retention errors do not occur. A mode register in the DRAM device may be programmed to select the size of the second set of memory cells.
摘要:
A device includes a plurality of memory cells, an error detection circuit configured to detect at least one memory cell storing error data and a refresh control circuit including a register configured to store an error address corresponding to the at least one memory cell storing error data. The refresh control circuit is configured to control a refresh cycle of the error address.