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    CHIP TESTING DEVICE AND PACKAGE TESTING MACHINE
    1.
    发明公开
    CHIP TESTING DEVICE AND PACKAGE TESTING MACHINE 审中-公开

    公开(公告)号：US20240295600A1

    公开(公告)日：2024-09-05

    申请号：US18427138

    申请日：2024-01-30

    申请人： SEMIGHT INSTRUMENTS CO., LTD

    发明人： Zhe LIAN ,  Jianjun HUANG ,  Yonghong WU ,  Shan ZHAO ,  Haiyang HU

    IPC分类号： G01R31/28

    CPC分类号： G01R31/2874 ,  G01R31/2856 ,  G01R31/2863 ,  G01R31/2867 ,  G01R31/2868 ,  G01R31/2896

    摘要： Chip testing device and package testing machine are provided. The chip testing device includes an upper base and a lower base, the upper base being above the lower base and being pressed against the lower base, and a top of the lower base featuring a first mounting part for mounting a test chip and a second mounting part beneath the first mounting part; a first test probe, penetrating the upper base and contacts the test chip to obtain an electrical signal of the test chip; a heat sink base, at the second mounting part and contacting the test chip to transfer a received heat to the test chip; and a first temperature sensor in the heat sink base to measure an actual temperature of the test chip.

    MULTI-NODE TESTING SYSTEM AND METHOD
    3.
    发明申请
    MULTI-NODE TESTING SYSTEM AND METHOD 审中-公开

    公开(公告)号：US20180128873A1

    公开(公告)日：2018-05-10

    申请号：US15804262

    申请日：2017-11-06

    申请人： Xcerra Corporation

    发明人： TODOR K. PETROV ,  RICHARD LIGGIERO

    IPC分类号： G01R31/28 ,  G01R1/073

    CPC分类号： G01R31/2834 ,  G01R1/07378 ,  G01R31/2868

    摘要： An automated microtester, for simultaneously testing a plurality of devices under test, includes a processing system including a plurality of processor assemblies. A plurality of test sites are configured to releasably engage a plurality of devices under test. An instrumentation system is controllable by the processing system and is configured to provide one or more input signals to the plurality of test sites and read one or more monitored signals from the plurality of test sites.

    TEST SYSTEMS AND METHODS OF TESTING DEVICES
    4.
    发明申请
    TEST SYSTEMS AND METHODS OF TESTING DEVICES 有权

    公开(公告)号：US20170108533A1

    公开(公告)日：2017-04-20

    申请号：US14882704

    申请日：2015-10-14

    申请人： Texas Instruments Incorporated

    发明人： Dale Vincent Ohmart

    IPC分类号： G01R1/04 ,  G01R31/28

    CPC分类号： G01R1/0441 ,  G01R31/2865 ,  G01R31/2868 ,  G01R31/31905

    摘要： A test system for performing a plurality of tests on a plurality of devices includes a tester having a plurality of tester pins and at least one socket, wherein the plurality of devices are received in the at least one socket. The test system further includes a plurality of multiplexers, wherein each of the multiplexers has an input coupled to one of the plurality of tester pins and each of the multiplexers has outputs coupled to individual device pins of the devices. The tester is configurable to perform a first test on a first plurality of devices and a second test on a second plurality of devices without disconnecting the devices from the at least one socket.

    Horizontal Infrastructure Handling For Integrated Circuit Devices
    5.
    发明申请
    Horizontal Infrastructure Handling For Integrated Circuit Devices 有权
    集成电路设备的水平基础设施处理

    公开(公告)号：US20170060120A1

    公开(公告)日：2017-03-02

    申请号：US14837891

    申请日：2015-08-27

    申请人： Silicon Laboratories Inc.

    发明人： Dan Littlejohn

    IPC分类号： G05B19/418

    CPC分类号： G01R31/2868 ,  G06F11/263 ,  G06F11/2733 ,  G06F2217/14 ,  H01L22/14 ,  H01L22/20

    摘要： Systems and methods are provided that may be implemented to produce customized integrated circuit (IC) device parts together from a common base IC device part that is customized with settings or code to build different unique IC device parts for different purposes that are processed and output together from the manufacturing process. Different individual devices of the common base part may be customized (e.g., programmed) with different settings and/or code to build respective uniquely configured parts for different purposes, e.g., such as according to different respective part orders.

    摘要翻译： 提供了可以实现的系统和方法，用于从共同的基本IC器件部件一起生产定制的集成电路（IC）器件部件，该部件是用设置或代码定制的，用于为处理和输出在一起的不同目的构建不同的唯一IC器件部件 从制造过程。 可以使用不同的设置和/或代码来定制（例如，编程）公共基础部分的不同的单独设备，以针对不同的目的（例如根据不同的相应的部分顺序）来构建相应的唯一配置的部件。

    Modular prober and method for operating same
    8.
    发明授权
    Modular prober and method for operating same 有权
    模块化探测器和操作方法

    公开(公告)号：US09194885B2

    公开(公告)日：2015-11-24

    申请号：US13820098

    申请日：2011-09-02

    申请人： Stojan Kanev ,  Botho Hirschfeld ,  Axel Becker ,  Ulf Hackius

    发明人： Stojan Kanev ,  Botho Hirschfeld ,  Axel Becker ,  Ulf Hackius

    IPC分类号： G01R1/04 ,  G01R31/26 ,  G01R31/28 ,  G01R31/319

    CPC分类号： G01R1/0408 ,  G01R31/2601 ,  G01R31/2868 ,  G01R31/31907

    摘要： The invention relates to a prober for checking and testing electronic semiconductor components and methods of using the same. The prober comprises at least two checking units, each of which is equipped with a chuck, probes, and a positioning unit, and each of which is assigned to a machine control system and a process control system. The prober further comprises a loading unit for automatically loading both testing units and an additional loader for manually loading at least one of the testing units, a user interface, and a module control system for controlling the process control systems and/or the machine control systems and the loading unit. The user interface can optionally be connected to at least one of the process control systems or the module control system by means of a switching device of the prober.

    摘要翻译： 本发明涉及用于检查和测试电子半导体元件的探测器及其使用方法。 探测器包括至少两个检查单元，每个检查单元都配备有卡盘，探针和定位单元，并且每个检查单元分配给机器控制系统和过程控制系统。 探测器还包括用于自动加载两个测试单元的加载单元和用于手动加载至少一个测试单元的附加加载器，用户界面和用于控制过程控制系统和/或机器控制系统的模块控制系统 和装载单元。 用户界面可以通过探测器的切换装置可选地连接到过程控制系统或模块控制系统中的至少一个。

    System for testing semiconductor modules
    9.
    发明授权
    System for testing semiconductor modules 有权
    半导体模块测试系统

    公开(公告)号：US09134365B2

    公开(公告)日：2015-09-15

    申请号：US14024364

    申请日：2013-09-11

    申请人： Samsung Electronics Co., Ltd.

    发明人： Min-Woo Kim ,  Bae-Ki Lee ,  Young-Soo Lee ,  Hyung-Yun Lee

    IPC分类号： B07C5/08 ,  G01R31/28 ,  G01R31/26 ,  G01R31/18

    CPC分类号： G01R31/2868 ,  G01R31/18 ,  G01R31/26 ,  G01R31/2601 ,  G01R31/2806 ,  G01R31/2893

    摘要： A system for testing semiconductor modules may include a first testing unit, a second testing unit, a classifying unit and a transferring unit. The first testing unit may test functions of the semiconductor modules mounted on a main board. The second testing unit may test the semiconductor modules tested by the first testing unit using a terminal. The classifying unit may classify the semiconductor modules tested by the second testing unit into normal semiconductor modules and abnormal semiconductor modules, or pass/fail. The transferring unit may be connected in-line between the first testing unit and the second testing unit, and between the second testing unit and the classifying unit to transfer the semiconductor modules from the first testing unit to the second testing unit and the classifying unit. Thus, the semiconductor modules may be automatically transferred to the units, so that a test time may be reduced.

    摘要翻译： 用于测试半导体模块的系统可以包括第一测试单元，第二测试单元，分类单元和传送单元。 第一测试单元可以测试安装在主板上的半导体模块的功能。 第二测试单元可以使用终端来测试由第一测试单元测试的半导体模块。 分类单元可以将由第二测试单元测试的半导体模块分类为正常半导体模块和异常半导体模块，或者通过/失败。 传送单元可以在第一测试单元和第二测试单元之间以及第二测试单元与分类单元之间的串联连接，以将半导体模块从第一测试单元传送到第二测试单元和分类单元。 因此，可以将半导体模块自动转移到单元，从而可以减少测试时间。

    MODULAR PROBER AND METHOD FOR OPERATING SAME
    10.
    发明申请
    MODULAR PROBER AND METHOD FOR OPERATING SAME 有权
    模块化探测器及其操作方法

    公开(公告)号：US20140145743A1

    公开(公告)日：2014-05-29

    申请号：US13820098

    申请日：2011-09-02

    申请人： Stojan Kanev ,  Botho Hirschfeld ,  Axel Becker ,  Ulf Hackius

    发明人： Stojan Kanev ,  Botho Hirschfeld ,  Axel Becker ,  Ulf Hackius

    IPC分类号： G01R1/04 ,  G01R31/26

    CPC分类号： G01R1/0408 ,  G01R31/2601 ,  G01R31/2868 ,  G01R31/31907

    摘要： The invention relates to a prober for checking and testing electronic semiconductor components and methods of using the same. The prober comprises at least two checking units, each of which is equipped with a chuck, probes, and a positioning unit, and each of which is assigned to a machine control system and a process control system. The prober further comprises a loading unit for automatically loading both testing units and an additional loader for manually loading at least one of the testing units, a user interface, and a module control system for controlling the process control systems and/or the machine control systems and the loading unit. The user interface can optionally be connected to at least one of the process control systems or the module control system by means of a switching device of the prober.

    摘要翻译： 本发明涉及用于检查和测试电子半导体元件的探测器及其使用方法。 探测器包括至少两个检查单元，每个检查单元都配备有卡盘，探针和定位单元，并且每个检查单元分配给机器控制系统和过程控制系统。 探测器还包括用于自动加载两个测试单元的加载单元和用于手动加载至少一个测试单元的附加加载器，用户界面和用于控制过程控制系统和/或机器控制系统的模块控制系统 和装载单元。 用户界面可以通过探测器的切换装置可选地连接到过程控制系统或模块控制系统中的至少一个。