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公开(公告)号：US20240335958A1
公开(公告)日：2024-10-10
申请号：US18433771
申请日：2024-02-06
发明人： Shan ZHAO , Zhe LIAN , Yonghong WU , Jianjun HUANG
CPC分类号： B25J15/0616 , H01L21/67144
摘要： The present disclosure provides an automatic die pick-and-place apparatus and a formation method. The apparatus includes a main body; a suction nozzle rod installed on the main body; a clamping strip disposed above the main body, where a front end of the clamping strip extends outward from the main body; and a guiding assembly disposed on a front end surface of the main body and on two sides of the suction nozzle rod. The first spring is vertically disposed and connected between the clamping strip and a lower portion of the main body; an installation groove is formed on the front end surface of the main body; a magnetic block is inserted in the installation groove; a magnetic installation block is sleeved on the suction nozzle rod and attracted to be connected to the magnetic block; and a limiting block is installed on a front portion of the main body.
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公开(公告)号：US20240310433A1
公开(公告)日：2024-09-19
申请号：US18427076
申请日：2024-01-30
发明人： Zhe LIAN , Pengsong XU , Shan ZHAO , Xiaoming GUO , Jianjun HUANG
CPC分类号： G01R31/2875 , G01R1/06722 , G01R31/2863
摘要： A probe mounting structure and a wafer-level reliability test system are provided. The probe mounting structure includes a probe mounting plate. The probe mounting plate is provided with mounting holes penetrating through a thickness direction of the probe mounting plate. A volume of each mounting hole is smaller than a preset value and is used to install a corresponding probe. Two ends of each probe are respectively connected to a corresponding first pad on a circuit board and a corresponding die of a wafer under test. Two sides of the probe mounting plate are in contact with the test circuit board and the wafer under test respectively, such that each of the mounting holes forms a sealed chamber. The mounting holes are filled with high-pressure gas to ensure that the wafer under test does not spark during high-voltage testing.
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公开(公告)号：US20240310435A1
公开(公告)日：2024-09-19
申请号：US18427124
申请日：2024-01-30
发明人： Zhe LIAN , Jianjun HUANG , Yonghong WU , Shan ZHAO , Haiyang HU
IPC分类号： G01R31/28
CPC分类号： G01R31/2893
摘要： Chip moving device is provided. The chip moving device includes a base, including a mounting portion that includes an end surface and an assembly cavity extending in a horizontal direction and penetrating through the end surface, the end surface being arranged with a limiting component; an adsorption part, extending in a vertical direction and confined by the limiting component; and a clamping component, arranged in the assembly cavity and including an end extending out of the end surface of the mounting portion, the clamping component being configured to be telescopic in the horizontal direction, and provide the adsorption part with a clamping force in the horizontal direction when the clamping component is extended or contracted.
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公开(公告)号：US20240295600A1
公开(公告)日：2024-09-05
申请号：US18427138
申请日：2024-01-30
发明人： Zhe LIAN , Jianjun HUANG , Yonghong WU , Shan ZHAO , Haiyang HU
IPC分类号： G01R31/28
CPC分类号： G01R31/2874 , G01R31/2856 , G01R31/2863 , G01R31/2867 , G01R31/2868 , G01R31/2896
摘要： Chip testing device and package testing machine are provided. The chip testing device includes an upper base and a lower base, the upper base being above the lower base and being pressed against the lower base, and a top of the lower base featuring a first mounting part for mounting a test chip and a second mounting part beneath the first mounting part; a first test probe, penetrating the upper base and contacts the test chip to obtain an electrical signal of the test chip; a heat sink base, at the second mounting part and contacting the test chip to transfer a received heat to the test chip; and a first temperature sensor in the heat sink base to measure an actual temperature of the test chip.
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