公开(公告)号：US20240310435A1

公开(公告)日：2024-09-19

申请号：US18427124

申请日：2024-01-30

Applicant: SEMIGHT INSTRUMENTS CO., LTD

Inventor： Zhe LIAN ,  Jianjun HUANG ,  Yonghong WU ,  Shan ZHAO ,  Haiyang HU

IPC: G01R31/28

CPC classification number: G01R31/2893

Abstract: Chip moving device is provided. The chip moving device includes a base, including a mounting portion that includes an end surface and an assembly cavity extending in a horizontal direction and penetrating through the end surface, the end surface being arranged with a limiting component; an adsorption part, extending in a vertical direction and confined by the limiting component; and a clamping component, arranged in the assembly cavity and including an end extending out of the end surface of the mounting portion, the clamping component being configured to be telescopic in the horizontal direction, and provide the adsorption part with a clamping force in the horizontal direction when the clamping component is extended or contracted.

公开(公告)号：US20250012845A1

公开(公告)日：2025-01-09

申请号：US18427064

申请日：2024-01-30

Applicant: SEMIGHT INSTRUMENTS CO., LTD

Inventor： Zhe LIAN ,  Pengsong XU ,  Jianjun HUANG ,  Haiyang HU

IPC: G01R31/26

Abstract: A wafer-level semiconductor high-voltage reliability test fixture is provided. The test fixture includes: a first insulation plate, a first circuit board, and a second insulation plate. A target object is disposed between the first circuit board and the second insulation plate. A side of the first circuit board facing the target object is provided with a probe holder including probes. The first circuit board is connected to the target object through the probes such that a high-voltage electrical signal is transmitted to the target object when the high-voltage electrical signal is applied to the first circuit board. The first insulation plate and the second insulation plate isolate the high-voltage electrical signal from the outside world, and the probes also transmit test electrical signals to the target object and transmit feedback signals to the first circuit board when the test electrical signals are applied to the first circuit board.

公开(公告)号：US20240410917A1

公开(公告)日：2024-12-12

申请号：US18432932

申请日：2024-02-05

Applicant: SEMIGHT INSTRUMENTS CO., LTD

Inventor： Zhe LIAN ,  Jianjun HUANG ,  Yonghong WU ,  Shan ZHAO ,  Haiyang HU

IPC: G01R1/04 ,  G01R3/00 ,  G01R31/28

Abstract: The present disclosure includes an adaptive die test socket and a formation method. The die test socket includes an upper test socket and a lower test socket disposed directly below the upper test socket. The upper test socket is connected to a support frame; a strip-shaped through hole is formed on an upper surface of the support frame; a first protruding strip is at each of lower portions of two opposite inner walls of the strip-shaped through hole; a corresponding second protruding strip is at each of upper portions of two opposite side surfaces of the installation plate; and a side of a strip-shaped block is fixedly connected to the upper surface of the support frame, and another side of the strip-shaped block extends to directly above the second protruding strip and is connected to the second protruding strip through at least two springs.

公开(公告)号：US20250020687A1

公开(公告)日：2025-01-16

申请号：US18433754

申请日：2024-02-06

Applicant: SEMIGHT INSTRUMENTS CO., LTD

Inventor： Zhe LIAN ,  Jianjun HUANG ,  Yonghong WU ,  Shan ZHAO ,  Haiyang HU

IPC: G01R1/04 ,  G01R31/28

Abstract: The present disclosure provides an adaptive die testing apparatus and a formation method. The adaptive die testing apparatus includes a support frame capable of moving along a vertical direction; a movable panel capable of moving along a horizontal direction; an upper test socket installed on the support frame; and a lower test socket installed on the movable panel and capable of moving with the movable plate to directly below the upper test socket. A groove is formed on a lower surface of the upper test socket and/or an upper surface of the lower test socket. When the adaptive die testing apparatus is at a testing state, the lower surface of the upper test socket is in a close contact with the upper surface of the lower test socket, and a sealed chamber for placing a die to-be-tested is formed at a region of the groove.

公开(公告)号：US20240410935A1

公开(公告)日：2024-12-12

申请号：US18432968

申请日：2024-02-05

Applicant: SEMIGHT INSTRUMENTS CO., LTD

Inventor： Zhe LIAN ,  Jianjun HUANG ,  Yonghong WU ,  Shan ZHAO ,  Haiyang HU

IPC: G01R31/28 ,  G01R3/00

Abstract: The present disclosure includes a die test pressing-down apparatus and a formation method. The die test pressing-down apparatus includes a support frame capable of moving along a vertical direction; and a pressing-down block installed on the support frame. A part to-be-pressed is disposed directly below the pressing-down block. The pressing-down block is connected to the support frame through an installation plate; a strip-shaped through hole is formed at an upper surface of the support frame; a first protruding strip is at each lower portion of two opposite inner walls of the strip-shaped through hole; a corresponding second protruding strip is at each upper portion of two opposite side surfaces of the installation plate; and a side of a strip-shaped block is fixedly connected to the upper surface of the support frame, and another side of the strip-shaped block is connected to the second protruding strip through at least two springs.

公开(公告)号：US20240295600A1

公开(公告)日：2024-09-05

申请号：US18427138

申请日：2024-01-30

Applicant: SEMIGHT INSTRUMENTS CO., LTD

Inventor： Zhe LIAN ,  Jianjun HUANG ,  Yonghong WU ,  Shan ZHAO ,  Haiyang HU

IPC: G01R31/28

CPC classification number: G01R31/2874 ,  G01R31/2856 ,  G01R31/2863 ,  G01R31/2867 ,  G01R31/2868 ,  G01R31/2896

Abstract: Chip testing device and package testing machine are provided. The chip testing device includes an upper base and a lower base, the upper base being above the lower base and being pressed against the lower base, and a top of the lower base featuring a first mounting part for mounting a test chip and a second mounting part beneath the first mounting part; a first test probe, penetrating the upper base and contacts the test chip to obtain an electrical signal of the test chip; a heat sink base, at the second mounting part and contacting the test chip to transfer a received heat to the test chip; and a first temperature sensor in the heat sink base to measure an actual temperature of the test chip.