公开(公告)号：US20240410917A1

公开(公告)日：2024-12-12

申请号：US18432932

申请日：2024-02-05

Applicant: SEMIGHT INSTRUMENTS CO., LTD

Inventor： Zhe LIAN ,  Jianjun HUANG ,  Yonghong WU ,  Shan ZHAO ,  Haiyang HU

IPC: G01R1/04 ,  G01R3/00 ,  G01R31/28

Abstract: The present disclosure includes an adaptive die test socket and a formation method. The die test socket includes an upper test socket and a lower test socket disposed directly below the upper test socket. The upper test socket is connected to a support frame; a strip-shaped through hole is formed on an upper surface of the support frame; a first protruding strip is at each of lower portions of two opposite inner walls of the strip-shaped through hole; a corresponding second protruding strip is at each of upper portions of two opposite side surfaces of the installation plate; and a side of a strip-shaped block is fixedly connected to the upper surface of the support frame, and another side of the strip-shaped block extends to directly above the second protruding strip and is connected to the second protruding strip through at least two springs.

公开(公告)号：US20240335958A1

公开(公告)日：2024-10-10

申请号：US18433771

申请日：2024-02-06

Applicant: SEMIGHT INSTRUMENTS CO., LTD

Inventor： Shan ZHAO ,  Zhe LIAN ,  Yonghong WU ,  Jianjun HUANG

IPC: B25J15/06 ,  H01L21/67

CPC classification number: B25J15/0616 ,  H01L21/67144

Abstract: The present disclosure provides an automatic die pick-and-place apparatus and a formation method. The apparatus includes a main body; a suction nozzle rod installed on the main body; a clamping strip disposed above the main body, where a front end of the clamping strip extends outward from the main body; and a guiding assembly disposed on a front end surface of the main body and on two sides of the suction nozzle rod. The first spring is vertically disposed and connected between the clamping strip and a lower portion of the main body; an installation groove is formed on the front end surface of the main body; a magnetic block is inserted in the installation groove; a magnetic installation block is sleeved on the suction nozzle rod and attracted to be connected to the magnetic block; and a limiting block is installed on a front portion of the main body.

公开(公告)号：US12235316B2

公开(公告)日：2025-02-25

申请号：US18427124

申请日：2024-01-30

Applicant: SEMIGHT INSTRUMENTS CO., LTD

Inventor： Zhe Lian ,  Jianjun Huang ,  Yonghong Wu ,  Shan Zhao ,  Haiyang Hu

IPC: G01R31/28

Abstract: Chip moving device is provided. The chip moving device includes a base, including a mounting portion that includes an end surface and an assembly cavity extending in a horizontal direction and penetrating through the end surface, the end surface being arranged with a limiting component; an adsorption part, extending in a vertical direction and confined by the limiting component; and a clamping component, arranged in the assembly cavity and including an end extending out of the end surface of the mounting portion, the clamping component being configured to be telescopic in the horizontal direction, and provide the adsorption part with a clamping force in the horizontal direction when the clamping component is extended or contracted.

公开(公告)号：US12216139B2

公开(公告)日：2025-02-04

申请号：US18432932

申请日：2024-02-05

Applicant: SEMIGHT INSTRUMENTS CO., LTD

Inventor： Zhe Lian ,  Jianjun Huang ,  Yonghong Wu ,  Shan Zhao ,  Haiyang Hu

IPC: G01R1/04 ,  G01R1/02 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/26 ,  G01R31/28

Abstract: The present disclosure includes an adaptive die test socket and a formation method. The die test socket includes an upper test socket and a lower test socket disposed directly below the upper test socket. The upper test socket is connected to a support frame; a strip-shaped through hole is formed on an upper surface of the support frame; a first protruding strip is at each of lower portions of two opposite inner walls of the strip-shaped through hole; a corresponding second protruding strip is at each of upper portions of two opposite side surfaces of the installation plate; and a side of a strip-shaped block is fixedly connected to the upper surface of the support frame, and another side of the strip-shaped block extends to directly above the second protruding strip and is connected to the second protruding strip through at least two springs.

公开(公告)号：US20240310435A1

公开(公告)日：2024-09-19

申请号：US18427124

申请日：2024-01-30

Applicant: SEMIGHT INSTRUMENTS CO., LTD

Inventor： Zhe LIAN ,  Jianjun HUANG ,  Yonghong WU ,  Shan ZHAO ,  Haiyang HU

IPC: G01R31/28

CPC classification number: G01R31/2893

Abstract: Chip moving device is provided. The chip moving device includes a base, including a mounting portion that includes an end surface and an assembly cavity extending in a horizontal direction and penetrating through the end surface, the end surface being arranged with a limiting component; an adsorption part, extending in a vertical direction and confined by the limiting component; and a clamping component, arranged in the assembly cavity and including an end extending out of the end surface of the mounting portion, the clamping component being configured to be telescopic in the horizontal direction, and provide the adsorption part with a clamping force in the horizontal direction when the clamping component is extended or contracted.

公开(公告)号：US20250051104A1

公开(公告)日：2025-02-13

申请号：US18433016

申请日：2024-02-05

Applicant: SEMIGHT INSTRUMENTS CO., LTD

Inventor： Renwei TANG ,  Zhe LIAN ,  Yonghong WU ,  Shan ZHAO

IPC: B65G47/84 ,  G01R31/26 ,  H01L21/67 ,  H01L21/683

Abstract: The present disclosure includes a die inspection sorting system and a formation method. The die inspection sorting system includes a turntable and a plurality of die picking assemblies installed at an equal interval along a circumferential direction at an edge of the turntable. The die picking assembly includes a vertical support frame, a base installed on a front side of the vertical support frame, a suction rod installed vertically on a side of the base away from the vertical support frame, and a clamping strip. The limiting groove is disposed on a front end surface of the base; an installation groove is disposed on the front end surface of the base; a movable block is inserted in the installation groove; and a spring in a compressed state is connected between a rear end of the movable block and a bottom surface of the installation groove.

公开(公告)号：US12216156B2

公开(公告)日：2025-02-04

申请号：US18432968

申请日：2024-02-05

Applicant: SEMIGHT INSTRUMENTS CO., LTD

Inventor： Zhe Lian ,  Jianjun Huang ,  Yonghong Wu ,  Shan Zhao ,  Haiyang Hu

IPC: G01R1/02 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/26 ,  G01R31/28

Abstract: The present disclosure includes a die test pressing-down apparatus and a formation method. The die test pressing-down apparatus includes a support frame capable of moving along a vertical direction; and a pressing-down block installed on the support frame. A part to-be-pressed is disposed directly below the pressing-down block. The pressing-down block is connected to the support frame through an installation plate; a strip-shaped through hole is formed at an upper surface of the support frame; a first protruding strip is at each lower portion of two opposite inner walls of the strip-shaped through hole; a corresponding second protruding strip is at each upper portion of two opposite side surfaces of the installation plate; and a side of a strip-shaped block is fixedly connected to the upper surface of the support frame, and another side of the strip-shaped block is connected to the second protruding strip through at least two springs.

公开(公告)号：US20250012845A1

公开(公告)日：2025-01-09

申请号：US18427064

申请日：2024-01-30

Applicant: SEMIGHT INSTRUMENTS CO., LTD

Inventor： Zhe LIAN ,  Pengsong XU ,  Jianjun HUANG ,  Haiyang HU

IPC: G01R31/26

Abstract: A wafer-level semiconductor high-voltage reliability test fixture is provided. The test fixture includes: a first insulation plate, a first circuit board, and a second insulation plate. A target object is disposed between the first circuit board and the second insulation plate. A side of the first circuit board facing the target object is provided with a probe holder including probes. The first circuit board is connected to the target object through the probes such that a high-voltage electrical signal is transmitted to the target object when the high-voltage electrical signal is applied to the first circuit board. The first insulation plate and the second insulation plate isolate the high-voltage electrical signal from the outside world, and the probes also transmit test electrical signals to the target object and transmit feedback signals to the first circuit board when the test electrical signals are applied to the first circuit board.

公开(公告)号：US20240310433A1

公开(公告)日：2024-09-19

申请号：US18427076

申请日：2024-01-30

Applicant: SEMIGHT INSTRUMENTS CO., LTD

Inventor： Zhe LIAN ,  Pengsong XU ,  Shan ZHAO ,  Xiaoming GUO ,  Jianjun HUANG

IPC: G01R31/28 ,  G01R1/067

CPC classification number: G01R31/2875 ,  G01R1/06722 ,  G01R31/2863

Abstract: A probe mounting structure and a wafer-level reliability test system are provided. The probe mounting structure includes a probe mounting plate. The probe mounting plate is provided with mounting holes penetrating through a thickness direction of the probe mounting plate. A volume of each mounting hole is smaller than a preset value and is used to install a corresponding probe. Two ends of each probe are respectively connected to a corresponding first pad on a circuit board and a corresponding die of a wafer under test. Two sides of the probe mounting plate are in contact with the test circuit board and the wafer under test respectively, such that each of the mounting holes forms a sealed chamber. The mounting holes are filled with high-pressure gas to ensure that the wafer under test does not spark during high-voltage testing.

公开(公告)号：US12237184B1

公开(公告)日：2025-02-25

申请号：US18427094

申请日：2024-01-30

Applicant: SEMIGHT INSTRUMENTS CO., LTD

Inventor： Zhe Lian ,  Bin Zhou ,  Xiaoming Guo ,  Pengsong Xu

IPC: G01R31/28 ,  H01L21/67 ,  H01L21/687

Abstract: A heating structure and a wafer test device are provided. The heating structure includes: a heating base, provided with a heating element inside the heating base; a mounting component, disposed above the heat base and including a plurality of mounting stations arranged at intervals; and a plurality of insulating thermo-conductive blocks. Each of the plurality of insulating thermo-conductive blocks is disposed at one corresponding mounting station of the plurality of mounting stations and protrudes from the mounting component for contacting a clamp of the wafer test device.