Systems and methods are provided that may be implemented to produce customized integrated circuit (IC) device parts together from a common base IC device part that is customized with settings or code to build different unique IC device parts for different purposes that are processed and output together from the manufacturing process. Different individual devices of the common base part may be customized (e.g., programmed) with different settings and/or code to build respective uniquely configured parts for different purposes, e.g., such as according to different respective part orders.