公开(公告)号：US20240326090A1

公开(公告)日：2024-10-03

申请号：US18608317

申请日：2024-03-18

Applicant: Ultima Genomics, Inc.

Inventor： William SCHULKINS ,  Angela STERN ,  Florian OBERSTRASS

IPC: B05D1/00 ,  B05D1/32

CPC classification number: B05D1/60 ,  B05D1/32

Abstract: Provided herein are systems and methods for functionalizing a substrate. The method may comprise providing a substrate surface, wherein the substrate surface comprises a plurality of individually addressable locations, and exposing the substrate surface to a dose of organosilane vapor to generate a plurality of organosilane-functionalized locations on the substrate surface, wherein the plurality of organosilane-functionalized locations corresponds to at least a subset of the plurality of individually addressable locations. The dose of organosilane vapor may be provided at relatively low dose, in an example, at most about 1×1024 molecules per m2.

公开(公告)号：US12059560B2

公开(公告)日：2024-08-13

申请号：US17346003

申请日：2021-06-11

Applicant: Centre National de la Recherche Scientifique ,  UNIVERSITE GRENOBLE ALPES

Inventor： Dipankar Kalita ,  Vincent Bouchiat ,  Laetitia Marty ,  Nedjma Bendiab

IPC: A61N1/04 ,  A61L15/58 ,  A61N1/36 ,  B05D1/00 ,  C01B32/194 ,  H01L29/16 ,  H01L29/167

CPC classification number: A61N1/0496 ,  A61L15/58 ,  A61N1/0468 ,  A61N1/36046 ,  B05D1/60 ,  C01B32/194 ,  H01L29/1606 ,  H01L29/167 ,  B05D2203/30 ,  B05D2518/00 ,  C01B2204/04 ,  C01B2204/22

Abstract: The invention concerns a method of forming a medical device, the method comprising: forming a graphene film (100) over a substrate (204); depositing, by gas phase deposition, a polymer material covering a surface of the graphene film (100); and removing the substrate (204) from the graphene film (100), wherein the polymer material forms a support (102) for the graphene film (100).

公开(公告)号：US20240264336A1

公开(公告)日：2024-08-08

申请号：US18605667

申请日：2024-03-14

Applicant: APPLIED MATERIALS, INC.

Inventor： Alexander Berger ,  Cheng-Hsuan Chou ,  David Knapp

IPC: G02B1/14 ,  B05D1/00 ,  B05D7/22 ,  C23C16/04 ,  G02B3/00

CPC classification number: G02B1/14 ,  B05D1/60 ,  B05D7/22 ,  C23C16/045 ,  G02B3/00

Abstract: Described herein is a method of depositing a conformal, optically transparent coating onto a surface of one or more internal components that are enclosed within an assembled device including an optical encoder using a non-line-of-sight deposition process without altering a structure of the assembled device or impacting functionality of the assembled device. Also described is an assembled device including an optical encoder, where one or more internal components enclosed within the optical encoder and a coating deposited onto a surface of the internal components, where the coating is a conformal, optically transparent coating that is resistant to corrosion by at least one of fluorine-, chlorine-, sulfur-, hydrogen-, bromine-, or nitrogen-based acids and that does not negatively impact functionality of the internal components.

公开(公告)号：US12051571B2

公开(公告)日：2024-07-30

申请号：US17508094

申请日：2021-10-22

Applicant: Tokyo Electron Limited

Inventor： Kazuya Ichiki ,  Tatsuya Yamaguchi ,  Syuji Nozawa

IPC: C23C16/04 ,  B05D1/00 ,  C23C16/56 ,  H01J37/32 ,  H01L21/02 ,  H01L21/311 ,  H01L21/67 ,  H01L21/768 ,  H01L29/06

CPC classification number: H01J37/32724 ,  B05D1/60 ,  C23C16/045 ,  C23C16/56 ,  H01J37/32449 ,  H01J37/32467 ,  H01L21/0209 ,  H01L21/31127 ,  H01J2237/332 ,  H01L21/02118 ,  H01L21/67109 ,  H01L21/7682 ,  H01L29/0649

Abstract: A substrate processing method includes: a heating process of heating a substrate, which is placed on a stage disposed in a container and has a recess formed on one surface of the substrate, to a first temperature; a depositing process of depositing a thermally decomposable organic material on a front surface of the substrate by supplying a material gas into the container; and a removing process of removing the organic material deposited on a periphery of the recess and a back surface of the substrate, which is opposite to the one surface of the substrate, by holding the substrate at a position spaced apart from the stage and heating the substrate to a second temperature higher than the first temperature.

公开(公告)号：US20240245322A1

公开(公告)日：2024-07-25

申请号：US18442865

申请日：2024-02-15

Applicant: THE SECRETARY OF STATE FOR DEFENCE

Inventor： ROBERTO STEFANO PASQUALE KING ,  MARTIN WAYNE MILLINGTON ,  ANDREW WORSFOLD

IPC: A61B5/1172 ,  B05D1/00 ,  C01B21/00 ,  C23C14/00 ,  C23C16/448

CPC classification number: A61B5/1172 ,  B05D1/60 ,  C23C16/4485 ,  C01B21/00 ,  C23C14/00

Abstract: The invention relates to an apparatus for the visualisation of a print on an object, the apparatus comprising: a base comprising a heating element in thermal communication with a receptacle for storing an agent, a housing to provide a sealed chamber; and a port for applying a vacuum to, or releasing a vacuum from, the sealed chamber. The invention is particularly for the visualisation of a fingerprint such as a latent fingerprint. The invention also relates to a system incorporating the apparatus with a cartridge and agent, and associated methods and uses for visualising a print on an object.

公开(公告)号：US11990369B2

公开(公告)日：2024-05-21

申请号：US17407504

申请日：2021-08-20

Applicant: Applied Materials, Inc.

Inventor： Bhaskar Jyoti Bhuyan ,  Zeqing Shen ,  Susmit Singha Roy ,  Abhijit Basu Mallick

IPC: H01L21/768 ,  H01L21/02 ,  H01L21/311 ,  B05D1/00

CPC classification number: H01L21/76877 ,  H01L21/02118 ,  H01L21/31133 ,  H01L21/76834 ,  H01L21/76837 ,  B05D1/60 ,  B05D1/62

Abstract: Exemplary methods of semiconductor processing may include forming a layer of carbon-containing material on a substrate disposed within a processing region of a semiconductor processing chamber. The substrate may include an exposed region of a first dielectric material and an exposed region of a metal-containing material. The layer of carbon-containing material may be selectively formed over the exposed region of the metal-containing material. Forming the layer of carbon-containing material may include one or more cycles of providing a first molecular species that selectively couples with the metal-containing material. Forming the layer of carbon-containing material may include providing a second molecular species that selectively couples with the first molecular species. The methods may include selectively depositing a second dielectric material on the exposed region of the first dielectric material.

公开(公告)号：US11952471B2

公开(公告)日：2024-04-09

申请号：US17024857

申请日：2020-09-18

Applicant: Korea Advanced Institute of Science and Technology

Inventor： SungGap Im ,  Juyeon Kang ,  Junhwan Choi

IPC: C08J5/18 ,  B05D1/00 ,  C23C14/06

CPC classification number: C08J5/18 ,  B05D1/60 ,  C08J2333/08 ,  C23C14/06

Abstract: A polymer thin film having stretchability and dielectric properties and a method of forming the same are provided. The method includes forming the polymer thin film having stretchability and dielectric properties depending on a composition of a copolymer using an acrylate-based monomer and a vinyl group monomer.

公开(公告)号：US11951472B2

公开(公告)日：2024-04-09

申请号：US16623194

申请日：2018-06-15

Applicant: Wisconsin Alumni Research Foundation

Inventor： Chao Li ,  Jiaquan Yu ,  Theodorus Evan de Groot ,  David James Beebe

IPC: B01L3/00 ,  B05D1/00 ,  B05D5/08

CPC classification number: B01L3/502 ,  B05D1/60 ,  B05D5/08 ,  B01L2300/166

Abstract: Systems, methods, compositions of matter, and kits for undermedia repellency are disclosed. In some cases, these involve a first volume of a first liquid presented in a second volume of a second liquid above a first location of a first surface. The first liquid, second liquid, and first location can have properties sufficient to give rise to undermedia perfect liquid repellency.

公开(公告)号：US20240042482A1

公开(公告)日：2024-02-08

申请号：US18229676

申请日：2023-08-03

Applicant: eMagin Corporation

Inventor： Fridrich VAZAN ,  Ilyas I. KHAYRULLIN ,  Howard LIN ,  Fangchao ZHAO ,  Kerry TICE ,  Timothy CONSIDINE ,  Laurie SZIKLAS ,  Maxim FRAYER ,  Amalkumar P. GHOSH ,  Tim BRAUN

IPC: B05D1/00

CPC classification number: B05D1/60

Abstract: A system for deposition of evaporated material on a substrate is provided. The substrate has a central axis. The system includes an evaporation vacuum chamber, at least one nozzle assembly, and a shadow mask. The nozzle assembly has a three-point plurality of point evaporation sources disposed adjacent to the central axis of the substrate and at a distance from the substrate whereby the nozzle assembly provides for molecules of evaporated material to arrive at the substrate at an incident angle of less than or equal to 5 degrees.

公开(公告)号：US20240030062A1

公开(公告)日：2024-01-25

申请号：US18555507

申请日：2022-04-15

Applicant: Lam Research Corporation

Inventor： Dennis M. Hausmann ,  Pankaj Ghanshyam Ramnani ,  Kashish Sharma ,  Paul C. Lemaire ,  Arpan Pravin Mahorowala

IPC: H01L21/768 ,  C23C16/26 ,  B05D1/00 ,  C23C16/34 ,  C23C16/505 ,  C23C16/455 ,  H01L23/532 ,  H01L23/522 ,  H01J37/32

CPC classification number: H01L21/76834 ,  C23C16/26 ,  B05D1/60 ,  C23C16/34 ,  C23C16/505 ,  C23C16/45565 ,  H01L23/53238 ,  H01L23/53209 ,  H01L23/53266 ,  H01L23/53295 ,  H01L23/5226 ,  H01L21/76897 ,  H01L21/7685 ,  H01L21/76856 ,  H01J37/32449 ,  H01J37/32899 ,  H01J2237/332 ,  H01J37/32357 ,  H01J37/3211

Abstract: Methods and apparatuses for an integration scheme for forming a fully aligned via using selective deposition of graphene on metal surfaces and selective deposition of an inhibitor layer on exposed barrier surfaces prior to depositing dielectric material are provided.