公开(公告)号：US09543276B2

公开(公告)日：2017-01-10

申请号：US14818682

申请日：2015-08-05

申请人： Young-kun Jee ,  Tae-hong Min ,  Sun-kyoung Seo

发明人： Young-kun Jee ,  Tae-hong Min ,  Sun-kyoung Seo

IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L29/40 ,  H01L25/065 ,  H01L23/31 ,  H01L21/56

CPC分类号： H01L25/0657 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/3142 ,  H01L23/3178 ,  H01L23/481 ,  H01L2224/16145 ,  H01L2224/73204 ,  H01L2225/06513

摘要： A chip-stacked semiconductor package including a first chip having a plurality of first real bump pads and a plurality of first dummy bump pads, a second chip on the first chip, the second chip including a plurality of real bumps and a plurality of bridge dummy bumps, the plurality of real bumps electrically connected to the plurality of first real bump pads, the plurality of bridge dummy bumps connected to the plurality of first dummy bump pads, and a sealing member sealing the first chip and the second chip may be provided.

摘要翻译： 一种芯片堆叠半导体封装，包括具有多个第一实际凸块焊盘和多个第一虚拟凸块焊盘的第一芯片，第一芯片上的第二芯片，所述第二芯片包括多个实际凸块和多个桥模 可以提供电连接到多个第一真实凸块焊盘的多个真实凸块，连接到多个第一虚拟凸块焊盘的多个桥接虚拟凸起以及密封第一芯片和第二芯片的密封构件。

公开(公告)号：US20120223433A1

公开(公告)日：2012-09-06

申请号：US13409480

申请日：2012-03-01

申请人： Young-kun Jee ,  Ji-hwan Hwang ,  Kwang-chul Choi ,  Jung-hwan Kim ,  Tae-hong Min

发明人： Young-kun Jee ,  Ji-hwan Hwang ,  Kwang-chul Choi ,  Jung-hwan Kim ,  Tae-hong Min

IPC分类号： H01L23/488

CPC分类号： B23K35/262 ,  B23K35/3013 ,  B23K35/3033 ,  H01L23/3128 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05664 ,  H01L2224/05671 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16503 ,  H01L2224/81097 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01327 ,  H01L2924/15787 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00 ,  H01L2224/05552

摘要： A semiconductor package including connecting members having a controlled content ratio of gold capable of increasing durability and reliability by preventing an intermetallic compound having high brittleness from being formed. The semiconductor package includes a base substrate; a first semiconductor chip disposed on the base substrate; and a first connecting member for electrically connecting the base substrate and the first semiconductor chip, and comprising a first bonding portion that includes gold and has a first content ratio of gold that is controlled to prevent an intermetallic compound of AuSn4, (Cu, Au)Sn4, or (Ni, Au)Sn4 from being formed.

摘要翻译： 一种半导体封装，其包括通过防止形成具有高脆度的金属间化合物而具有可控含量比的能够提高耐久性和可靠性的连接构件。 半导体封装包括基底; 设置在所述基底基板上的第一半导体芯片; 以及第一连接构件，用于电连接基底基板和第一半导体芯片，并且包括第一接合部分，其包括金并且具有被控制以防止AuSn4（Cu，Au）的金属间化合物的金的第一含量比， Sn4或（Ni，Au）Sn4的形成。

公开(公告)号：US20100328482A1

公开(公告)日：2010-12-30

申请号：US12823386

申请日：2010-06-25

申请人： Soon-keun Chang ,  Rae-hong Park ,  Tae-hong Min

发明人： Soon-keun Chang ,  Rae-hong Park ,  Tae-hong Min

IPC分类号： H04N5/225 ,  G06K9/62

CPC分类号： H04N5/235 ,  G06T5/50 ,  G06T2207/20208 ,  H04N5/2355

摘要： A digital photographing apparatus capable of acquiring data about an image having a wide dynamic range and a high grayscale resolution, a method of controlling the digital photographing apparatus, and a recording medium storing a program to implement the method are provided. An embodiment includes an imaging device that acquires a reference image and additional images at different exposures and a multi-level threshold map generation unit that classifies the pixels of the images into levels according to brightness. The embodiment further includes a motion data acquiring unit that acquires motion data for each pixel based on its respective brightness level and a first weight data acquiring unit that acquires first weight data based on the motion data of each pixel. In addition, the embodiment includes a final image data acquiring unit that synthesizes the pixels of the reference image and the additional images based on first weight data.

摘要翻译： 提供一种数字摄影装置，其能够获取关于具有宽的动态范围和高灰度分辨率的图像的数据，控制数字摄影装置的方法以及存储实现该方法的程序的记录介质。 一个实施例包括获取参考图像和不同曝光下的附加图像的成像装置以及根据亮度将图像的像素分级为多级阈值图生成单元。 该实施例还包括运动数据获取单元，其基于其各自的亮度级别获取每个像素的运动数据，以及第一权重数据获取单元，其基于每个像素的运动数据获取第一权重数据。 此外，实施例包括最终图像数据获取单元，其基于第一权重数据来合成参考图像的像素和附加图像。

公开(公告)号：US20120038797A1

公开(公告)日：2012-02-16

申请号：US13034764

申请日：2011-02-25

申请人： Soon-geun Jang ,  Tae-hong Min ,  Rae-hong Park ,  Hwan-soon Sung

发明人： Soon-geun Jang ,  Tae-hong Min ,  Rae-hong Park ,  Hwan-soon Sung

IPC分类号： H04N5/217

CPC分类号： H04N5/2355 ,  G06T5/008 ,  G06T5/50 ,  G06T2207/10144

摘要： An image processing apparatus and an image processing method, the method including: providing one or more low dynamic range images having different exposure levels; classifying each of the one of more low dynamic range images as a saturation region, an under-saturation region, and a non-saturation region with respect to an intensity value; generating feature maps indicating a similarity between patterns of the non-saturation regions; generating final feature maps converting pixels included in the feature maps into moving pixels and non-moving pixels; defining moving regions and non-moving regions included in the one or more low dynamic range images; removing noise from the moving regions and the non-moving regions by using a first noise reduction filter for the moving regions and a second noise reduction filter for the non-moving regions; and generating a radiance map corresponding to the one or more low dynamic range images.

摘要翻译： 一种图像处理装置和图像处理方法，所述方法包括：提供具有不同曝光水平的一个或多个低动态范围图像; 将更低的动态范围图像中的每一个分类为饱和区域，欠饱和区域和相对于强度值的非饱和区域; 生成指示非饱和区域的图案之间的相似性的特征图; 生成将特征图中包括的像素转换为移动像素和非移动像素的最终特征图; 定义包括在所述一个或多个低动态范围图像中的移动区域和非移动区域; 通过使用用于移动区域的第一噪声降低滤波器和用于非移动区域的第二降噪滤波器来从移动区域和非移动区域去除噪声; 以及生成对应于所述一个或多个低动态范围图像的辐射图。

公开(公告)号：US08791562B2

公开(公告)日：2014-07-29

申请号：US13183645

申请日：2011-07-15

申请人： Chung-sun Lee ,  Jung-Hwan Kim ,  Yun-hyeok Im ,  Ji-hwan Hwang ,  Hyon-chol Kim ,  Kwang-chul Choi ,  Eun-kyoung Choi ,  Tae-hong Min

发明人： Chung-sun Lee ,  Jung-Hwan Kim ,  Yun-hyeok Im ,  Ji-hwan Hwang ,  Hyon-chol Kim ,  Kwang-chul Choi ,  Eun-kyoung Choi ,  Tae-hong Min

IPC分类号： H01L23/58 ,  H01L25/065 ,  H01L25/10 ,  H01L23/00

CPC分类号： H01L25/0657 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05552

摘要： A stack package usable in a three-dimensional (3D) system-in-package (SIP) includes a first semiconductor chip, a second semiconductor chip, and a supporter. The first semiconductor chip includes a through silicon via (TSV), and the second semiconductor chip is stacked on the first semiconductor chip and is electrically connected to the first semiconductor chip through the TSV of the first semiconductor chip. The supporter is attached onto the first semiconductor chip so as to be spaced apart from an edge of the second semiconductor chip.

摘要翻译： 可用于三维（3D）系统级封装（SIP））的堆叠封装包括第一半导体芯片，第二半导体芯片和支持器。 第一半导体芯片包括贯通硅通孔（TSV），第二半导体芯片堆叠在第一半导体芯片上，并通过第一半导体芯片的TSV与第一半导体芯片电连接。 支撑件附接到第一半导体芯片上，以便与第二半导体芯片的边缘间隔开。

公开(公告)号：US20120018871A1

公开(公告)日：2012-01-26

申请号：US13183645

申请日：2011-07-15

申请人： Chung-sun LEE ,  Jung-Hwan Kim ,  Yun-Hyeok Im ,  Ji-Hwan Hwang ,  Hyon-chol Kim ,  Kwang-chul Choi ,  Eun-Kyong Choi ,  Tae-hong Min

发明人： Chung-sun LEE ,  Jung-Hwan Kim ,  Yun-Hyeok Im ,  Ji-Hwan Hwang ,  Hyon-chol Kim ,  Kwang-chul Choi ,  Eun-Kyong Choi ,  Tae-hong Min

IPC分类号： H01L23/58

CPC分类号： H01L25/0657 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05552

摘要： A stack package usable in a three-dimensional (3D) system-in-package (SIP) includes a first semiconductor chip, a second semiconductor chip, and a supporter. The first semiconductor chip includes a through silicon via (TSV), and the second semiconductor chip is stacked on the first semiconductor chip and is electrically connected to the first semiconductor chip through the TSV of the first semiconductor chip. The supporter is attached onto the first semiconductor chip so as to be spaced apart from an edge of the second semiconductor chip.

摘要翻译： 可用于三维（3D）系统级封装（SIP））的堆叠封装包括第一半导体芯片，第二半导体芯片和支持器。 第一半导体芯片包括贯通硅通孔（TSV），第二半导体芯片堆叠在第一半导体芯片上，并通过第一半导体芯片的TSV与第一半导体芯片电连接。 支撑件附接到第一半导体芯片上，以便与第二半导体芯片的边缘间隔开。

公开(公告)号：US08854489B2

公开(公告)日：2014-10-07

申请号：US13034764

申请日：2011-02-25

申请人： Soon-geun Jang ,  Tae-hong Min ,  Rae-hong Park ,  Hwan-soon Sung

发明人： Soon-geun Jang ,  Tae-hong Min ,  Rae-hong Park ,  Hwan-soon Sung

IPC分类号： H04N5/228 ,  H04N5/235 ,  G06T5/50 ,  G06T5/00

CPC分类号： H04N5/2355 ,  G06T5/008 ,  G06T5/50 ,  G06T2207/10144

摘要： An image processing apparatus and an image processing method, the method including: providing one or more low dynamic range images having different exposure levels; classifying each of the one of more low dynamic range images as a saturation region, an under-saturation region, and a non-saturation region with respect to an intensity value; generating feature maps indicating a similarity between patterns of the non-saturation regions; generating final feature maps converting pixels included in the feature maps into moving pixels and non-moving pixels; defining moving regions and non-moving regions included in the one or more low dynamic range images; removing noise from the moving regions and the non-moving regions by using a first noise reduction filter for the moving regions and a second noise reduction filter for the non-moving regions; and generating a radiance map corresponding to the one or more low dynamic range images.

摘要翻译： 一种图像处理装置和图像处理方法，所述方法包括：提供具有不同曝光水平的一个或多个低动态范围图像; 将更低的动态范围图像中的每一个分类为饱和区域，欠饱和区域和相对于强度值的非饱和区域; 生成指示非饱和区域的图案之间的相似性的特征图; 生成将特征图中包括的像素转换为移动像素和非移动像素的最终特征图; 定义包括在所述一个或多个低动态范围图像中的移动区域和非移动区域; 通过使用用于移动区域的第一噪声降低滤波器和用于非移动区域的第二降噪滤波器来从移动区域和非移动区域去除噪声; 以及生成对应于所述一个或多个低动态范围图像的辐射图。

公开(公告)号：US08373767B2

公开(公告)日：2013-02-12

申请号：US12823386

申请日：2010-06-25

申请人： Soon-keun Chang ,  Rae-hong Park ,  Tae-hong Min

发明人： Soon-keun Chang ,  Rae-hong Park ,  Tae-hong Min

IPC分类号： H04N5/228 ,  H04N5/235

CPC分类号： H04N5/235 ,  G06T5/50 ,  G06T2207/20208 ,  H04N5/2355

摘要： A digital photographing apparatus capable of acquiring data about an image having a wide dynamic range and a high grayscale resolution, a method of controlling the digital photographing apparatus, and a recording medium storing a program to implement the method are provided. An embodiment includes an imaging device that acquires a reference image and additional images at different exposures and a multi-level threshold map generation unit that classifies the pixels of the images into levels according to brightness. The embodiment further includes a motion data acquiring unit that acquires motion data for each pixel based on its respective brightness level and a first weight data acquiring unit that acquires first weight data based on the motion data of each pixel. In addition, the embodiment includes a final image data acquiring unit that synthesizes the pixels of the reference image and the additional images based on first weight data.

摘要翻译： 提供一种数字摄影装置，其能够获取关于具有宽的动态范围和高灰度分辨率的图像的数据，控制数字摄影装置的方法以及存储实现该方法的程序的记录介质。 一个实施例包括获取参考图像和不同曝光下的附加图像的成像装置以及根据亮度将图像的像素分级为多级阈值图生成单元。 该实施例还包括运动数据获取单元，其基于其各自的亮度级别获取每个像素的运动数据，以及第一权重数据获取单元，其基于每个像素的运动数据获取第一权重数据。 此外，实施例包括最终图像数据获取单元，其基于第一权重数据来合成参考图像的像素和附加图像。