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54 条记录 (耗时 0.016 秒)

    Semiconductor wafer with improved crack protection
    2.
    发明授权
    Semiconductor wafer with improved crack protection 有权
    半导体晶圆具有改进的裂纹保护

    公开(公告)号：US07741196B2

    公开(公告)日：2010-06-22

    申请号：US11668453

    申请日：2007-01-29

    申请人： Heng Keong Yip ,  Wai Yew Lo ,  Lan Chu Tan

    发明人： Heng Keong Yip ,  Wai Yew Lo ,  Lan Chu Tan

    IPC分类号： H01L21/30

    CPC分类号： H01L21/3043 ,  H01L21/02118 ,  H01L21/312 ,  H01L21/78 ,  H01L23/562 ,  H01L23/585 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A method of manufacturing a semiconductor wafer for dicing includes providing a semiconductor wafer including a substrate and a plurality of upper layers on the substrate that form a formation of die areas. The formation is arranged so that adjacent die areas are separated by a path for a dicing tool. Within each path, a pair of spaced apart lines is fabricated. Each line defines a dicing edge of a respective path and has at least one trench extending between a top surface of the wafer and the substrate. Each trench is filled with a stress absorbing material for reducing die tool induced stress on the die areas during dicing.

    摘要翻译： 制造用于切割的半导体晶片的方法包括在基板上提供包括基板和多个上层的半导体晶片，形成管芯区域的形成。 该结构布置成使得相邻的模具区域被用于切割工具的路径分开。 在每个路径中，制造一对间隔开的线。 每条线限定相应路径的切割边缘，并且具有在晶片的顶表面和基底之间延伸的至少一个沟槽。 每个沟槽填充有应力吸收材料，用于在切割期间减少模具区域上的模具工具引起的应力。

    Pressure sensor and method of assembling same
    7.
    发明授权
    Pressure sensor and method of assembling same 有权
    压力传感器及其组装方法

    公开(公告)号：US08378435B2

    公开(公告)日：2013-02-19

    申请号：US12960571

    申请日：2010-12-06

    申请人： Wai Yew Lo ,  Lan Chu Tan

    发明人： Wai Yew Lo ,  Lan Chu Tan

    IPC分类号： H01L29/82 ,  H01L21/00

    CPC分类号： H01L24/97 ,  G01L19/0069 ,  G01L19/147 ,  H01L24/73 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00

    摘要： A method of packaging a pressure sensing die includes providing a lead frame with lead fingers and attaching the pressure sensing die to the lead fingers such that bond pads of the die are electrically coupled to the lead fingers and a void is formed between the die and the lead fingers. A gel material is dispensed via an underside of the lead frame into the void such that the gel material substantially fills the void. The gel material is then cured and the die and the lead frame are encapsulated with a mold compound. The finished package does not include a metal lid.

    摘要翻译： 一种包装压力传感管芯的方法包括提供具有引线指状物的引线框架并将压力感测裸片连接到引线指，使得管芯的接合焊盘电连接到引线指，并且在管芯和管芯之间形成空隙 铅笔指 凝胶材料通过引线框架的下侧分配到空隙中，使得凝胶材料基本上填充空隙。 然后将凝胶材料固化，并将模具和引线框架用模具化合物包封。 成品包装不包括金属盖。

    SEMICONDUCTOR WAFER WITH IMPROVED CRACK PROTECTION
    8.
    发明申请
    SEMICONDUCTOR WAFER WITH IMPROVED CRACK PROTECTION 有权
    具有改进的裂纹保护的半导体波形

    公开(公告)号：US20080179710A1

    公开(公告)日：2008-07-31

    申请号：US11668453

    申请日：2007-01-29

    申请人： Heng Keong Yip ,  Wai Yew Lo ,  Lan Chu Tan

    发明人： Heng Keong Yip ,  Wai Yew Lo ,  Lan Chu Tan

    IPC分类号： H01L23/544 ,  H01L21/76

    CPC分类号： H01L21/3043 ,  H01L21/02118 ,  H01L21/312 ,  H01L21/78 ,  H01L23/562 ,  H01L23/585 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A method of manufacturing a semiconductor wafer for dicing includes providing a semiconductor wafer including a substrate and a plurality of upper layers on the substrate that form a formation of die areas. The formation is arranged so that adjacent die areas are separated by a path for a dicing tool within each path, a pair of spaced apart lines is fabricated. Each line defines a dicing edge of a respective path and has at least one trench extending between a top surface of the wafer and the substrate. Each trench is filled with a stress absorbing material for reducing die tool induced stress on the die areas during dicing.

    摘要翻译： 制造用于切割的半导体晶片的方法包括在基板上提供包括基板和多个上层的半导体晶片，形成管芯区域的形成。 该组合被布置成使得相邻的模具区域被用于每个路径内的切割工具的路径分开，制造一对间隔开的线。 每条线限定相应路径的切割边缘，并且具有在晶片的顶表面和基底之间延伸的至少一个沟槽。 每个沟槽填充有应力吸收材料，用于在切割期间减少模具区域上的模具工具引起的应力。

    PRESSURE SENSOR AND METHOD OF PACKAGING SAME
    10.
    发明申请
    PRESSURE SENSOR AND METHOD OF PACKAGING SAME 有权
    压力传感器及其包装方法

    公开(公告)号：US20120168884A1

    公开(公告)日：2012-07-05

    申请号：US13293119

    申请日：2011-11-10

    申请人： Jinzhong Yao ,  Wai Yew Lo ,  Lan Chu Tan ,  Xuesong Xu

    发明人： Jinzhong Yao ,  Wai Yew Lo ,  Lan Chu Tan ,  Xuesong Xu

    IPC分类号： H01L29/84 ,  H01L21/50

    CPC分类号： H01L41/25 ,  G01L19/0069 ,  G01L19/147 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

    摘要： A method of packaging a pressure sensor die includes providing a lead frame having a die pad and lead fingers that surround the die pad. A tape is attached to a first side of the lead frame. A pressure sensor die is attached to the die pad on a second side of the lead frame and bond pads of the die are connected to the lead fingers. An encapsulant is dispensed onto the second side of the lead frame and covers the lead fingers and the electrical connections thereto. A gel is dispensed onto a top surface of the die and covers the die bond pads and the electrical connections thereto. A lid is attached to the lead frame and covers the die and the gel, and sides of the lid penetrate the encapsulant.

    摘要翻译： 包装压力传感器管芯的方法包括提供引线框架，其具有围绕管芯焊盘的管芯焊盘和引线指。 带子附接到引线框架的第一侧。 压力传感器芯片在引线框架的第二侧附接到芯片焊盘，并且芯片的焊盘被连接到引线指。 将密封剂分配到引线框架的第二侧上并且覆盖引线指及其电连接。 将凝胶分配到模具的顶表面上并覆盖芯片接合焊盘及其电连接。 盖子连接到引线框架并覆盖模具和凝胶，并且盖的侧面穿透密封剂。