公开(公告)号：US20080311703A1

公开(公告)日：2008-12-18

申请号：US12194001

申请日：2008-08-19

Applicant: Fujio Ito ,  Hiromichi Suzuki ,  Toshio Sasaki

Inventor： Fujio Ito ,  Hiromichi Suzuki ,  Toshio Sasaki

IPC: H01L21/82

CPC classification number: H01L23/49541 ,  H01L21/4842 ,  H01L23/49558 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A plurality of inner leads, a plurality of outer leads formed in one with each of the inner lead, a bar lead of the square ring shape arranged inside a plurality of inner leads, a corner part lead which has been arranged between the inner leads of the end portion of the inner lead groups which adjoin among four inner lead groups corresponding to each side of the bar lead, and was connected with the bar lead, and a tape member joined to the tip part of each inner lead, a bar lead, and a corner part lead are included. Since the corner part lead is formed as an object for reinforcement of a frame body between adjoining inner lead groups, the rigidity of the lead frame can be increased.

Abstract translation: 多个内部引线，多个外部引线，每个外部引线与内部引线中的每一个形成一个，方形环形状的引脚布置在多个内部引线内;角部引线，其设置在内部引线之间 所述内引线组的与所述棒引线的每一侧相对应的四个内引线组中相邻的所述内引线组的端部与所述引线连接，以及与所述内引线的前端接合的带部件， 并包括角落部分铅。 由于角部引线形成为在相邻的内引线组之间加强框架体的对象，所以可以提高引线框架的刚性。

公开(公告)号：US20060186528A1

公开(公告)日：2006-08-24

申请号：US10516417

申请日：2003-05-16

Applicant: Toshio Sasaki ,  Fujio Ito ,  Hiromichi Suzuki

Inventor： Toshio Sasaki ,  Fujio Ito ,  Hiromichi Suzuki

IPC: H01L23/48 ,  H01L23/52

CPC classification number: H01L24/06 ,  H01L23/49513 ,  H01L23/49531 ,  H01L23/49541 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/48257 ,  H01L2224/48599 ,  H01L2224/48639 ,  H01L2224/4911 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/49431 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/85439 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10162 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012

Abstract: The present invention can supply power for each circuit section by separating and connecting bus-bar (21d) for each circuit section inside the semiconductor chip (22), and, in addition, can increase the number of pads (22a) for power supply or can use the lead (21a) conventionally used for power supply for signals by further making the best of the characteristics that enable the connection to bus-bar (21d) irrespective of the inner lead (21b) pitch, by making the pitch of the pad (22a) smaller than the pitch of the inner lead (21b), or by forming the pad (22a) in a zigzag arrangement.

Abstract translation: 本发明可以通过对半导体芯片（22）内部的每个电路部分的汇流条（21d）进行分离和连接来为每个电路部分供电，并且还可以增加用于功率的焊盘（22a）的数量 提供或可以使用通常用于信号电源的引线（21a），通过进一步充分利用能够连接到母线（21d）而不考虑内部引线（21b）间距的特性，通过制造 衬垫（22a）的间距小于内引线（21b）的间距，或通过以锯齿形布置形成焊盘（22a）。

公开(公告)号：US07413930B2

公开(公告)日：2008-08-19

申请号：US10569577

申请日：2003-08-29

Applicant: Fujio Ito ,  Hiromichi Suzuki ,  Toshio Sasaki

Inventor： Fujio Ito ,  Hiromichi Suzuki ,  Toshio Sasaki

IPC: H01L21/82

CPC classification number: H01L23/49541 ,  H01L21/4842 ,  H01L23/49558 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A plurality of inner leads, a plurality of outer leads formed in one with each of the inner lead, a bar lead of the square ring shape arranged inside a plurality of inner leads, a corner part lead which has been arranged between the inner leads of the end portion of the inner lead groups which adjoin among four inner lead groups corresponding to each side of the bar lead, and was connected with the bar lead, and a tape member joined to the tip part of each inner lead, a bar lead, and a corner part lead are included. Since the corner part lead is formed as an object for reinforcement of a frame body between adjoining inner lead groups, the rigidity of the lead frame can be increased.

Abstract translation: 多个内部引线，多个外部引线，每个外部引线与内部引线中的每一个形成一个，方形环形状的引脚布置在多个内部引线内;角部引线，其设置在内部引线之间 所述内引线组的与所述棒引线的每一侧相对应的四个内引线组中相邻的所述内引线组的端部与所述引线连接，以及与所述内引线的前端接合的带部件， 并包括角落部分铅。 由于角部引线形成为在相邻的内引线组之间加强框架体的对象，所以可以提高引线框架的刚性。

公开(公告)号：US20070004092A1

公开(公告)日：2007-01-04

申请号：US10569735

申请日：2003-08-29

Applicant: Hiromichi Suzuki ,  Fujio Ito ,  Toshio Sasaki

Inventor： Hiromichi Suzuki ,  Fujio Ito ,  Toshio Sasaki

IPC: H01L21/00

CPC classification number: H01L24/83 ,  H01L21/565 ,  H01L23/4334 ,  H01L23/49558 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: This manufacturing method of a semiconductor device prepares a lead frame to which a heat spreader, and the tip parts of a plurality of inner leads were joined via a thermoplastic insulating binding material, arranges a lead frame on a heat stage, and joins the semiconductor chip to the heat spreader via the thermoplastic binding material which was heated and softened after having arranged the semiconductor chip on the heat spreader. Die bonding can be performed without scattering inner leads by joining the semiconductor chip and the thermoplastic binding material, suppressing the tip parts of the inner leads to the heat stage side. Improvement in the assembling property of a semiconductor device can be aimed at.

Abstract translation: 这种半导体装置的制造方法准备一个引线框架，散热器和多个内部引线的末端部分通过热塑性绝缘粘合材料接合，将引线框架布置在热台上，并连接半导体芯片 通过在将散热器上布置半导体芯片之后被加热和软化的热塑性粘合材料到散热器。 可以通过接合半导体芯片和热塑性粘合材料而不会使内部引线散射，从而将内部引线的顶端部分抑制到加热台侧来进行晶片接合。 可以针对半导体器件的组装性能的改进。

公开(公告)号：US20070001271A1

公开(公告)日：2007-01-04

申请号：US10569577

申请日：2003-08-29

Applicant: Fujio Ito ,  Hiromichi Suzuki ,  Toshio Sasaki

Inventor： Fujio Ito ,  Hiromichi Suzuki ,  Toshio Sasaki

IPC: H01L23/495

CPC classification number: H01L23/49541 ,  H01L21/4842 ,  H01L23/49558 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A plurality of inner leads, a plurality of outer leads formed in one with each of the inner lead, a bar lead of the square ring shape arranged inside a plurality of inner leads, a corner part lead which has been arranged between the inner leads of the end portion of the inner lead groups which adjoin among four inner lead groups corresponding to each side of the bar lead, and was connected with the bar lead, and a tape member joined to the tip part of each inner lead, a bar lead, and a corner part lead are included. Since the corner part lead is formed as an object for reinforcement of a frame body between adjoining inner lead groups, the rigidity of the lead frame can be increased.

Abstract translation: 多个内部引线，多个外部引线，每个外部引线与内部引线中的每一个形成一个，方形环形状的引脚布置在多个内部引线内;角部引线，其设置在内部引线之间 所述内引线组的与所述棒引线的每一侧相对应的四个内引线组中相邻的所述内引线组的端部与所述引线连接，以及与所述内引线的前端接合的带部件， 并包括角落部分铅。 由于角部引线形成为在相邻的内引线组之间加强框架体的对象，所以可以提高引线框架的刚性。

公开(公告)号：US20050263863A1

公开(公告)日：2005-12-01

申请号：US11140394

申请日：2005-05-31

Applicant: Toshio Sasaki ,  Fujio Ito ,  Hiromichi Suzuki

Inventor： Toshio Sasaki ,  Fujio Ito ,  Hiromichi Suzuki

IPC: H01L25/00 ,  H01L21/44 ,  H01L23/48 ,  H01L23/495 ,  H01L23/50 ,  H01L23/60 ,  H01L23/64

CPC classification number: H01L23/4951 ,  H01L23/49506 ,  H01L23/49541 ,  H01L23/49589 ,  H01L23/60 ,  H01L23/642 ,  H01L23/645 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48195 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/4911 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/4943 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Miniaturization in a semiconductor device which has a chip part is attained. A QFP having the chip part includes a semiconductor chip, a plurality of inner leads arranged around the semiconductor chip, a sheet member which connects with the end part of the inner lead via insulating adhesive and which connects with the semiconductor chip via adhesive, a plurality of outer leads which are respectively integral with an inner lead, a plurality of wires which connect the pads of the semiconductor chip and a plurality of inner leads, respectively, and a bar lead arranged along the periphery of a plurality of inner leads in the domain between the semiconductor chip and the plurality of inner leads. In the domain between the semiconductor chip and a plurality of inner leads, the chip part which constitutes a surface mounting part is mounted on the bar lead, while being arranged beneath the wire.

Abstract translation: 实现了具有芯片部分的半导体器件的小型化。 具有芯片部分的QFP包括半导体芯片，布置在半导体芯片周围的多个内部引线，通过绝缘粘合剂与内部引线的端部连接并且经由粘合剂与半导体芯片连接的片状部件，多个 分别与内引线一体形成的外引线，分别连接半导体芯片的焊盘和多个内引线的多根引线以及沿着多个内引线的周边排列的条引线 在半导体芯片和多个内部引线之间。 在半导体芯片和多个内部引线之间的区域中，构成表面安装部分的芯片部分安装在条形引线上，同时布置在引线下方。

公开(公告)号：US07482699B2

公开(公告)日：2009-01-27

申请号：US10516417

申请日：2003-05-16

Applicant: Toshio Sasaki ,  Fujio Ito ,  Hiromichi Suzuki

Inventor： Toshio Sasaki ,  Fujio Ito ,  Hiromichi Suzuki

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L24/06 ,  H01L23/49513 ,  H01L23/49531 ,  H01L23/49541 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/48257 ,  H01L2224/48599 ,  H01L2224/48639 ,  H01L2224/4911 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/49431 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/85439 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10162 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012

Abstract: The present invention can supply power for each circuit section by separating and connecting bus-bar (21d) for each circuit section inside the semiconductor chip (22), and, in addition, can increase the number of pads (22a) for power supply or can use the lead (21a) conventionally used for power supply for signals by further making the best of the characteristics that enable the connection to bus-bar (21d) irrespective of the inner lead (21b) pitch, by making the pitch of the pad (22a) smaller than the pitch of the inner lead (21b), or by forming the pad (22a) in a zigzag arrangement.

Abstract translation: 本发明可以通过对半导体芯片（22）内部的每个电路部分的汇流条（21d）进行分离和连接来为每个电路部分提供电力，并且还可以增加用于供电的焊盘（22a）的数量， 可以通过进一步优化通过使衬垫间距与内引线（21b）间距无关地与母线（21d）连接的特性，来使用通常用于信号供电的引线（21a） （22a）小于内引线（21b）的间距，或者通过以锯齿形布置形成焊盘（22a）。

公开(公告)号：US07339259B2

公开(公告)日：2008-03-04

申请号：US11712456

申请日：2007-03-01

Applicant: Fujio Ito ,  Hiromichi Suzuki

Inventor： Fujio Ito ,  Hiromichi Suzuki

IPC: H01L23/495 ,  H01L23/48

CPC classification number: H01L23/4951 ,  H01L21/565 ,  H01L23/16 ,  H01L23/49506 ,  H01L23/49548 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/16145 ,  H01L2224/274 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: A semiconductor device has an improved mounting reliability and has external terminals formed by exposing portions of leads from a back surface of a resin sealing member. End portions on one side of the leads are fixed to a back surface of a semiconductor chip, and portions of the leads positioned outside the semiconductor chip are connected with electrodes formed on the semiconductor chip through wires.

Abstract translation: 半导体器件具有改进的安装可靠性，并且具有通过从树脂密封构件的后表面暴露引线部分而形成的外部端子。 引线一侧的端部固定在半导体芯片的背面，位于半导体芯片外部的引线部分通过导线与形成在半导体芯片上的电极连接。

公开(公告)号：US07199469B2

公开(公告)日：2007-04-03

申请号：US09964484

申请日：2001-09-28

Applicant: Toru Ishida ,  Tetsuharu Urawa ,  Fujio Ito ,  Tomoo Matsuzawa ,  Kazunari Suzuki ,  Akihiko Kameoka ,  Hiromichi Suzuki ,  Takuji Ide

Inventor： Toru Ishida ,  Tetsuharu Urawa ,  Fujio Ito ,  Tomoo Matsuzawa ,  Kazunari Suzuki ,  Akihiko Kameoka ,  Hiromichi Suzuki ,  Takuji Ide

IPC: H01L23/48 ,  H01L23/495 ,  H01L23/50 ,  H01L25/18 ,  H01L25/065

CPC classification number: H01L24/06 ,  H01L23/49575 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/32145 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48599 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/4945 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2225/06555 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/48227 ,  H01L2924/00012

Abstract: The cost of a semiconductor device is to be reduced. An electrical connection between a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip is made through an inner lead portion of a lead disposed at a position around the first semiconductor chip and two bonding wires.

Abstract translation: 降低半导体器件的成本。 通过布置在第一半导体芯片周围的引线的引线的内部引线部分和两个接合线来制造堆叠在第一半导体芯片上的第一半导体芯片和第二半导体芯片之间的电连接。

公开(公告)号：US20050189629A1

公开(公告)日：2005-09-01

申请号：US11066174

申请日：2005-02-28

Applicant: Fujio Ito ,  Hiromichi Suzuki ,  Tokuji Toida

Inventor： Fujio Ito ,  Hiromichi Suzuki ,  Tokuji Toida

IPC: B65D77/30 ,  B65D81/26 ,  B65D85/86 ,  B65D85/90 ,  H01L21/00 ,  H01L21/48 ,  H01L21/673 ,  H01L23/00 ,  H01L23/495

CPC classification number: H01L23/49503 ,  H01L21/6735 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01021 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method for manufacturing a semiconductor device includes the steps of providing a semiconductor device of a surface mounted type in which the main surface of a chip mounting portion connected to a semiconductor chip is formed so as to be smaller than the main surface of the semiconductor chip, accommodating the semiconductor device into a non-moistureproof, e.g., flammable, packing, and shipping the packed semiconductor device. The non-moistureproof packing may have a moisture permeability of T T≧1 g/m2/24 hr. The method may also include providing a second semiconductor device of a surface-mounted type in which the main surface of a chip mounting portion connected to a semiconductor chip is formed so as to be larger than the main surface of the semiconductor chip, moistureproof-packing the second semiconductor device, and shipping and packed second semiconductor device.

Abstract translation: 一种制造半导体器件的方法包括以下步骤：提供一种表面安装型半导体器件，其中连接到半导体芯片的芯片安装部分的主表面形成为小于半导体芯片的主表面 ，将半导体器件容纳在非防潮的（例如，易燃，包装）中，并运输封装的半导体器件。 非防潮包装可具有T T> = 1g / m 2 / 24hr的透湿性。 该方法还可以包括提供表面安装型的第二半导体器件，其中连接到半导体芯片的芯片安装部分的主表面形成为大于半导体芯片的主表面，防潮包装 第二半导体器件，以及运输和封装的第二半导体器件。