公开(公告)号：US20050189629A1

公开(公告)日：2005-09-01

申请号：US11066174

申请日：2005-02-28

申请人： Fujio Ito ,  Hiromichi Suzuki ,  Tokuji Toida

发明人： Fujio Ito ,  Hiromichi Suzuki ,  Tokuji Toida

IPC分类号： B65D77/30 ,  B65D81/26 ,  B65D85/86 ,  B65D85/90 ,  H01L21/00 ,  H01L21/48 ,  H01L21/673 ,  H01L23/00 ,  H01L23/495

CPC分类号： H01L23/49503 ,  H01L21/6735 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01021 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for manufacturing a semiconductor device includes the steps of providing a semiconductor device of a surface mounted type in which the main surface of a chip mounting portion connected to a semiconductor chip is formed so as to be smaller than the main surface of the semiconductor chip, accommodating the semiconductor device into a non-moistureproof, e.g., flammable, packing, and shipping the packed semiconductor device. The non-moistureproof packing may have a moisture permeability of T T≧1 g/m2/24 hr. The method may also include providing a second semiconductor device of a surface-mounted type in which the main surface of a chip mounting portion connected to a semiconductor chip is formed so as to be larger than the main surface of the semiconductor chip, moistureproof-packing the second semiconductor device, and shipping and packed second semiconductor device.

摘要翻译： 一种制造半导体器件的方法包括以下步骤：提供一种表面安装型半导体器件，其中连接到半导体芯片的芯片安装部分的主表面形成为小于半导体芯片的主表面 ，将半导体器件容纳在非防潮的（例如，易燃，包装）中，并运输封装的半导体器件。 非防潮包装可具有T T> = 1g / m 2 / 24hr的透湿性。 该方法还可以包括提供表面安装型的第二半导体器件，其中连接到半导体芯片的芯片安装部分的主表面形成为大于半导体芯片的主表面，防潮包装 第二半导体器件，以及运输和封装的第二半导体器件。

公开(公告)号：US06396142B1

公开(公告)日：2002-05-28

申请号：US09369402

申请日：1999-08-06

申请人： Fujio Ito ,  Hiroaki Tanaka ,  Hiromichi Suzuki ,  Tokuji Toida ,  Takafumi Konno ,  Kunihiro Tsubosaki ,  Shigeki Tanaka ,  Kazunari Suzuki ,  Akihiko Kameoka

发明人： Fujio Ito ,  Hiroaki Tanaka ,  Hiromichi Suzuki ,  Tokuji Toida ,  Takafumi Konno ,  Kunihiro Tsubosaki ,  Shigeki Tanaka ,  Kazunari Suzuki ,  Akihiko Kameoka

IPC分类号： H01L2348

CPC分类号： H01L24/32 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32055 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/49431 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/85385 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/85399 ,  H01L2224/05599

摘要： In a semiconductor device having a heat radiation plate, the tips of inner leads connected to a semiconductor chip have a lead width w and a lead thickness t, the width being less than the thickness. The inner leads are secured to the heat radiation plate. Fastening the inner leads to the heat radiation plate supports the latter and eliminates the need for suspending leads. A lead pitch p, the lead width w and lead thickness t of the inner lead tips connected to the semiconductor chip have the relations of w

公开(公告)号：US07261207B2

公开(公告)日：2007-08-28

申请号：US10770581

申请日：2004-02-04

申请人： Hiromichi Suzuki ,  Wahei Kitamura ,  Tokuji Toida ,  Toshimasa Shirai

发明人： Hiromichi Suzuki ,  Wahei Kitamura ,  Tokuji Toida ,  Toshimasa Shirai

IPC分类号： B65D85/48

CPC分类号： H01L21/67294 ,  G05B19/128 ,  G05B2219/31095 ,  Y02P90/10 ,  Y10S414/14 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/53091 ,  Y10T29/53174 ,  Y10T29/53178

摘要： A method for carrying a semiconductor device includes: (a) providing semiconductor devices each having a main surface, a back surface, and a plurality of external terminals; (b) providing a tray having a front surface, a rear surface, an electronic tag imbedded in the tray, first concaved portions formed on the front surface, second concaved portions formed on the rear surface, the electronic tag constituted by a non-contact recognition type chip having a memory circuit in which recognizable information is stored, a depth of the first concaved portion is deeper than a depth of the second concaved portion; (c) housing the semiconductor devices into the first concaved portions respectively in such a manner that the back surface of the semiconductor device being oppose to a bottom of the first concaved portion; and (d) carrying the tray with the semiconductor devices.

摘要翻译： 一种用于承载半导体器件的方法包括：（a）提供各自具有主表面，背表面和多个外部端子的半导体器件; （b）提供具有前表面，后表面，嵌入在托盘中的电子标签的托盘，形成在前表面上的第一凹部，形成在后表面上的第二凹部，由非接触形成的电子标签 识别型芯片，其具有存储可识别信息的存储电路，所述第一凹部的深度比所述第二凹部的深度深; （c）分别将半导体器件分别容纳在第一凹部中，使得半导体器件的背面相对于第一凹部的底部; 和（d）用半导体器件托盘。

公开(公告)号：US06803258B2

公开(公告)日：2004-10-12

申请号：US10152727

申请日：2002-05-23

申请人： Fujio Ito ,  Hiroaki Tanaka ,  Hiromichi Suzuki ,  Tokuji Toida ,  Takafumi Konno ,  Kunihiro Tsubosaki ,  Shigeki Tanaka ,  Kazunari Suzuki ,  Akihiko Kameoka

发明人： Fujio Ito ,  Hiroaki Tanaka ,  Hiromichi Suzuki ,  Tokuji Toida ,  Takafumi Konno ,  Kunihiro Tsubosaki ,  Shigeki Tanaka ,  Kazunari Suzuki ,  Akihiko Kameoka

IPC分类号： H01L2150

CPC分类号： H01L24/32 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32055 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/49431 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/85385 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/85399 ,  H01L2224/05599

摘要： In a semiconductor device having a heat radiation plate, the tips of inner leads connected to a semiconductor chip have a lead width w and a lead thickness t, the width being less than the thickness. The inner leads are secured to the heat radiation plate. Fastening the inner leads to the heat radiation plate supports the latter and eliminates the need for suspending leads. A lead pitch p, the lead width w and lead thickness t of the inner lead tips connected to the semiconductor chip have the relations of w

摘要翻译： 在具有散热板的半导体器件中，连接到半导体芯片的内部引线的尖端具有引线宽度w和引线厚度t，宽度小于厚度。 内引线固定在散热板上。 将内部引线固定到散热板上，支撑后者，并且不需要悬挂引线。 引线间距p，连接到半导体芯片的内引线头的引线宽度w和引线厚度t具有w

公开(公告)号：US06673655B2

公开(公告)日：2004-01-06

申请号：US10152726

申请日：2002-05-23

申请人： Fujio Ito ,  Hiroaki Tanaka ,  Hiromichi Suzuki ,  Tokuji Toida ,  Takafumi Konno ,  Kunihiro Tsubosaki ,  Shigeki Tanaka ,  Kazunari Suzuki ,  Akihiko Kameoka

发明人： Fujio Ito ,  Hiroaki Tanaka ,  Hiromichi Suzuki ,  Tokuji Toida ,  Takafumi Konno ,  Kunihiro Tsubosaki ,  Shigeki Tanaka ,  Kazunari Suzuki ,  Akihiko Kameoka

IPC分类号： H01L2348

CPC分类号： H01L24/32 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32055 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/49431 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/85385 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/85399 ,  H01L2224/05599

摘要： In a semiconductor device having a heat radiation plate, the tips of inner leads connected to a semiconductor chip have a lead width w and a lead thickness t, the width being less than the thickness. The inner leads are secured to the heat radiation plate. Fastening the inner leads to the heat radiation plate supports the latter and eliminates the need for suspending leads. A lead pitch p, the lead width w and lead thickness t of the inner lead tips connected to the semiconductor chip have the relations of w

摘要翻译： 在具有散热板的半导体器件中，连接到半导体芯片的内部引线的尖端具有引线宽度w和引线厚度t，宽度小于厚度。 内引线固定在散热板上。 将内部引线固定到散热板上，支撑后者，并且不需要悬挂引线。 引线间距p，连接到半导体芯片的内引线头的引线宽度w和引线厚度t具有w

公开(公告)号：US20070235371A1

公开(公告)日：2007-10-11

申请号：US11808335

申请日：2007-06-08

申请人： Hiromichi Suzuki ,  Wahei Kitamura ,  Tokuji Toida ,  Toshimasa Shirai

发明人： Hiromichi Suzuki ,  Wahei Kitamura ,  Tokuji Toida ,  Toshimasa Shirai

IPC分类号： H01L21/67

CPC分类号： H01L21/67294 ,  G05B19/128 ,  G05B2219/31095 ,  Y02P90/10 ,  Y10S414/14 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/53091 ,  Y10T29/53174 ,  Y10T29/53178

摘要： A method for carrying a semiconductor device includes: (a) providing semiconductor devices each having a main surface, a back surface, and a plurality of external terminals; (b) providing a tray having a front surface, a rear surface, an electronic tag imbedded in the tray, first concaved portions formed on the front surface, second concaved portions formed on the rear surface, the electronic tag constituted by a non-contact recognition type chip having a memory circuit in which recognizable information is stored, a depth of the first concaved portion is deeper than a depth of the second concaved portion; (c) housing the semiconductor devices into the first concaved portions respectively in such a manner that the back surface of the semiconductor device being oppose to a bottom of the first concaved portion; and (d) carrying the tray with the semiconductor devices.

公开(公告)号：US20050189627A1

公开(公告)日：2005-09-01

申请号：US11065108

申请日：2005-02-25

申请人： Fujio Ito ,  Hiromichi Suzuki ,  Takashi Miwa ,  Tokuji Toida

发明人： Fujio Ito ,  Hiromichi Suzuki ,  Takashi Miwa ,  Tokuji Toida

IPC分类号： H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L23/12 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50 ,  H05K1/18 ,  H05K3/34

CPC分类号： H01L23/3107 ,  H01L21/4825 ,  H01L21/565 ,  H01L23/49541 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/3426 ,  H05K3/3442 ,  H05K2201/09709 ,  H05K2201/10689 ,  H05K2201/10931 ,  H05K2201/10984 ,  Y02P70/613 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A surface mounting method for mounting semiconductor devices suppresses solder peeling defects which tried to occur during mounting. The method used for mounting semiconductor devices includes a process for preparing the semiconductor devices by obtaining multiple terminals by exposing a section of each of multiple leads protruding from a rear side of the plastic casing, and forming a layer of solder by solidifying a molten solder material; a process for supplying a solder paste material to multiple electrodes on a printed circuit board; and a process for melting the solder paste of the multiple electrodes and connecting each of the multiple terminals with the multiple electrodes.

摘要翻译： 用于安装半导体器件的表面安装方法抑制了在安装期间发生的焊料剥离缺陷。 用于安装半导体器件的方法包括通过从塑料外壳的后侧突出的多个引线的一部分暴露出多个端子来制备半导体器件的工艺，以及通过使熔融焊料材料固化形成一层焊料 ; 用于将焊膏材料供应到印刷电路板上的多个电极的工艺; 以及用于熔化多个电极的焊膏并将多个端子中的每一个与多个电极连接的工艺。