STATIC RANDOM ACCESS MEMORY AND METHOD OF CONTROLLING THE SAME
    3.
    发明申请
    STATIC RANDOM ACCESS MEMORY AND METHOD OF CONTROLLING THE SAME 审中-公开
    静态随机访问存储器及其控制方法

    公开(公告)号:US20160111143A1

    公开(公告)日:2016-04-21

    申请号:US14515253

    申请日:2014-10-15

    IPC分类号: G11C11/419

    CPC分类号: G11C11/419

    摘要: A static random access memory (SRAM) including at least a first memory cell array, a second memory cell array, a first data line connected to the first memory cell array and the second memory cell array, a primary driver circuit connected to the first data line and a supplementary driver circuit connected to the first data line, wherein the supplementary driver circuit is configured to pull a voltage level of the first data line to a first voltage level during a write operation of the SRAM.

    摘要翻译: 包括至少第一存储单元阵列,第二存储单元阵列,连接到第一存储单元阵列和第二存储单元阵列的第一数据线的静态随机存取存储器(SRAM),连接到第一数据的主驱动器电路 线路和连接到第一数据线路的辅助驱动器电路,其中辅助驱动器电路被配置为在SRAM的写入操作期间将第一数据线的电压电平拉到第一电压电平。

    STATIC RANDOM ACCESS MEMORY AND METHOD OF CONTROLLING THE SAME
    4.
    发明申请
    STATIC RANDOM ACCESS MEMORY AND METHOD OF CONTROLLING THE SAME 审中-公开
    静态随机访问存储器及其控制方法

    公开(公告)号:US20150348598A1

    公开(公告)日:2015-12-03

    申请号:US14291443

    申请日:2014-05-30

    IPC分类号: G11C5/10 G11C11/417

    CPC分类号: G11C11/417 G11C11/419

    摘要: A static random access memory (SRAM) that includes a memory cell comprising at least two p-type pass gates. The SRAM also includes a first data line connected to the memory cell, a second data line connected to the memory cell and a voltage control unit connected to the first data line, wherein the voltage control unit is configured to control the memory cell.

    摘要翻译: 一种静态随机存取存储器(SRAM),其包括包含至少两个p型通过门的存储单元。 SRAM还包括连接到存储单元的第一数据线,连接到存储单元的第二数据线和连接到第一数据线的电压控制单元,其中电压控制单元被配置为控制存储单元。

    MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20230238056A1

    公开(公告)日:2023-07-27

    申请号:US17585824

    申请日:2022-01-27

    摘要: A memory device includes a conductive segment, first and second rows of memory cells. The conductive segment receives a first reference voltage signal. The first row of memory cells is coupled to a first word line. The second row of memory cells is coupled to a second word line. The first row of memory cells includes first and second memory cells. The first memory cell is coupled to the conductive segment to receive the first reference voltage signal. The second row of memory cells includes third and fourth memory cells. The third memory cell is coupled to the conductive segment to receive the first reference voltage signal. The first and third memory cells share the conductive segment, and the third memory cell is arranged between the first and second memory cells. The second memory cell is arranged between the third and fourth memory cells.

    STATIC RANDOM ACCESS MEMORY AND METHOD OF CONTROLLING THE SAME

    公开(公告)号:US20220093172A1

    公开(公告)日:2022-03-24

    申请号:US17541240

    申请日:2021-12-02

    IPC分类号: G11C11/419

    摘要: A static random access memory (SRAM) includes a first memory cell array, a second memory cell array, a first data line coupled to the first memory cell array and the second memory cell array, a second data line coupled to the first memory cell array and the second memory cell array, a primary driver circuit coupled to at least the first data line, and a supplementary driver circuit coupled to at least the first data line. The supplementary driver circuit is configured to receive a supplementary driver circuit enable signal, sense a voltage of a first signal of the first data line, and pull the voltage of the first signal to a first voltage level during a write operation of a first memory cell in the first memory cell array in response to at least a first NOR output signal.

    FOUR CPP WIDE MEMORY CELL WITH BURIED POWER GRID, AND METHOD OF FABRICATING SAME

    公开(公告)号:US20210408011A1

    公开(公告)日:2021-12-30

    申请号:US17225627

    申请日:2021-04-08

    摘要: A memory device including: active regions; gate electrodes which are substantially aligned relative to four corresponding track lines such that the memory device has a width of four contacted poly pitch (4 CPP) and are electrically coupled to the active regions; contact-to-transistor-component structures (MD structures) which are electrically coupled to the active regions, and are interspersed among corresponding ones of the gate electrodes; via-to-gate/MD (VGD) structures which are electrically coupled to the gate electrodes and the MD structures; conductive segments which are in a first layer of metallization (M_1st layer), and are electrically coupled to the VGD structures; buried contact-to-transistor-component structures (BVD structures) which are electrically coupled to the active regions; and buried conductive segments which are in a first buried layer of metallization (BM_1st layer), and are electrically coupled to the BVD structures, and correspondingly provide a first reference voltage or a second reference voltage.