公开(公告)号：US20080237646A1

公开(公告)日：2008-10-02

申请号：US12156042

申请日：2008-05-29

Applicant: Shinya Tokunaga ,  Shigeki Furuya ,  Yuuji Hinatsu

Inventor： Shinya Tokunaga ,  Shigeki Furuya ,  Yuuji Hinatsu

IPC: H01L27/088

CPC classification number: G06F17/5077 ,  G06F17/5068 ,  H01L27/0207 ,  H01L27/118 ,  H01L27/11807 ,  Y10S257/905 ,  Y10S257/909

Abstract: A semiconductor integrated circuit device has a plurality of CMOS-type base cells arranged on a semiconductor substrate and m wiring layers, and gate array type logic cells are composed of the base cells and the wiring layers. Wiring within and between the logic cells is constituted by using only upper n (n

公开(公告)号：US07394156B2

公开(公告)日：2008-07-01

申请号：US11043250

申请日：2005-01-25

Applicant: Shinya Tokunaga ,  Shigeki Furuya ,  Yuuji Hinatsu

Inventor： Shinya Tokunaga ,  Shigeki Furuya ,  Yuuji Hinatsu

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L27/10 ,  H01L29/73 ,  H01L29/74

CPC classification number: G06F17/5077 ,  G06F17/5068 ,  H01L27/0207 ,  H01L27/118 ,  H01L27/11807 ,  Y10S257/905 ,  Y10S257/909

Abstract: A semiconductor integrated circuit device has a plurality of CMOS-type base cells arranged on a semiconductor substrate and m wiring layers, and gate array type logic cells are composed of the base cells and the wiring layers. Wiring within and between the logic cells is constituted by using only upper n (n

Abstract translation: 半导体集成电路器件具有布置在半导体衬底和m个布线层上的多个CMOS型基电池，门阵列型逻辑单元由基电池和布线层构成。 通过仅使用n（n

公开(公告)号：US07170115B2

公开(公告)日：2007-01-30

申请号：US09972117

申请日：2001-10-05

Applicant: Shinya Tokunaga ,  Shigeki Furuya ,  Yuuji Hinatsu

Inventor： Shinya Tokunaga ,  Shigeki Furuya ,  Yuuji Hinatsu

IPC: H01L27/10 ,  H01L29/739 ,  H01L29/73 ,  H01L29/74 ,  H01L23/48

CPC classification number: G06F17/5077 ,  G06F17/5068 ,  H01L27/0207 ,  H01L27/118 ,  H01L27/11807 ,  Y10S257/905 ,  Y10S257/909

Abstract: A semiconductor integrated circuit device has a plurality of CMOS-type base cells arranged on a semiconductor substrate and m wiring layers, and gate array type logic cells are composed of the base cells and the wiring layers. Wiring within and between the logic cells is constituted by using only upper n (n

Abstract translation: 半导体集成电路器件具有布置在半导体衬底和m个布线层上的多个CMOS型基电池，门阵列型逻辑单元由基电池和布线层构成。 通过仅使用n（n

公开(公告)号：US20050127406A1

公开(公告)日：2005-06-16

申请号：US11043250

申请日：2005-01-25

Applicant: Shinya Tokunaga ,  Shigeki Furuya ,  Yuuji Hinatsu

Inventor： Shinya Tokunaga ,  Shigeki Furuya ,  Yuuji Hinatsu

IPC: G06F17/50 ,  H01L27/02 ,  H01L27/10 ,  H01L27/118 ,  H01L29/73

CPC classification number: G06F17/5077 ,  G06F17/5068 ,  H01L27/0207 ,  H01L27/118 ,  H01L27/11807 ,  Y10S257/905 ,  Y10S257/909

Abstract: A semiconductor integrated circuit device has a plurality of CMOS-type base cells arranged on a semiconductor substrate and m wiring layers, and gate array type logic cells are composed of the base cells and the wiring layers. Wiring within and between the logic cells is constituted by using only upper n (n

Abstract translation: 半导体集成电路器件具有布置在半导体衬底和m个布线层上的多个CMOS型基电池，门阵列型逻辑单元由基电池和布线层构成。 通过仅使用n（n

公开(公告)号：US07565637B2

公开(公告)日：2009-07-21

申请号：US11592168

申请日：2006-11-03

Applicant: Koichi Seko ,  Shinya Tokunaga

Inventor： Koichi Seko ,  Shinya Tokunaga

IPC: G06F17/50

CPC classification number: G06F17/5068 ,  H01L23/66 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2224/05599

Abstract: A package design method for a semiconductor device of designing a package including a package substrate provided with a wiring pattern, a chip mounted on the package substrate, and a sealing resin which covers the package substrate and the chip, and the wiring pattern including an external connection terminal and an internal connection terminal connected to the chip, the method comprising: setting an acceptable noise value of the package; designing a package layout on the basis of information on connection between the package substrate and the chip; and performing an optimization on package layout data so that an amount of noises remains within a range which is set beforehand, on the basis of the package layout data obtained in the designing process of the package layout.

Abstract translation: 一种用于设计包括具有布线图案的封装基板，安装在封装基板上的芯片和覆盖封装基板和芯片的密封树脂的封装的半导体器件的封装设计方法，以及包括外部 连接端子和连接到芯片的内部连接端子，所述方法包括：设置所述封装的可接受的噪声值; 在封装基板与芯片之间的连接信息的基础上设计封装布局; 并且基于在包装布局的设计过程中获得的包装布局数据，对包装布局数据执行优化，使得噪声量保持在预先设定的范围内。

公开(公告)号：US07370882B2

公开(公告)日：2008-05-13

申请号：US10484496

申请日：2002-07-22

Applicant: Shinya Tokunaga ,  Mitsuyoshi Ohno

Inventor： Shinya Tokunaga ,  Mitsuyoshi Ohno

IPC: B60R21/16

CPC classification number: B60R21/261 ,  B60R21/213 ,  B60R21/232 ,  B60R21/26

Abstract: An air bag system is provided in which an air bag stored in a folded state in a vehicle is adapted to be inflated by a gas supplied from an inflator through a diffuser so as to protect an occupant of the vehicle. In the air bag system, the diffuser is disposed on one side of the inflator such that the diffuser and the inflator are substantially aligned with each other, and the diffuser includes a gas feed portion that is exposed to a gas inlet formed in a generally middle portion of the air bag as viewed in a longitudinal direction thereof.

Abstract translation: 提供了一种气囊系统，其中以车辆的折叠状态存储的气囊适于由通过扩散器从充气机供给的气体充气，以保护车辆乘员。 在气囊系统中，扩散器设置在充气机的一侧，使得扩散器和充气机基本上彼此对准，并且扩散器包括气体供给部分，该气体供给部分暴露于形成在大致中间 气囊的长度方向的一部分。

公开(公告)号：US20050156323A1

公开(公告)日：2005-07-21

申请号：US11022967

申请日：2004-12-28

Applicant: Shinya Tokunaga

Inventor： Shinya Tokunaga

IPC: H01L23/12 ,  H01L21/60 ,  H01L21/607 ,  H01L23/13 ,  H01L23/58 ,  H01L25/00 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18

CPC classification number: H01L23/13 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06575 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/15159 ,  H01L2924/15165 ,  H01L2924/15174 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: In case that a size of an upper layer semiconductor chip is larger than a lower layer semiconductor chip, a semiconductor chip is packed without damaging it. In a semiconductor apparatus in which a second semiconductor chip 103 is laminated on a first semiconductor chip 102, and accommodated in one package, at least one side among four sides which configure an outer edge of the second semiconductor chip 103 is configured in such a manner that it is larger than four sides which configure an outer edge of the first semiconductor chip 102, and thereby, a protruding portion which is protruded from the outer edge of the first semiconductor chip 102 is provided, and a convex supporting part 110 is provided on a surface of a circuit substrate 101 on which the first semiconductor chip 102 and the second semiconductor chip 103 are laminated, and the protruding portion is configured in such a manner that it can be supported by the convex supporting part 110.

Abstract translation: 在上层半导体芯片的尺寸大于下层半导体芯片的情况下，不会损坏半导体芯片。 在第二半导体芯片103层压在第一半导体芯片102上并且容纳在一个封装中的半导体装置中，构成第二半导体芯片103的外边缘的四个边中的至少一个侧面被配置为 其大于构成第一半导体芯片102的外边缘的四个边，并且由此设置从第一半导体芯片102的外边缘突出的突出部分，并且凸起支撑部分110设置在 其上层叠有第一半导体芯片102和第二半导体芯片103的电路基板101的表面，并且突出部构造成能够由凸形支撑部110支撑。

公开(公告)号：US06768236B2

公开(公告)日：2004-07-27

申请号：US10604977

申请日：2003-08-29

Applicant: Shinya Tokunaga ,  Kaoru Uenosono

Inventor： Shinya Tokunaga ,  Kaoru Uenosono

IPC: H02K708

CPC classification number: F16C33/107 ,  F16C17/026 ,  F16C17/045 ,  F16C17/107 ,  F16C2370/12 ,  H02K5/1675

Abstract: Spindle motor utilizing a dynamic-pressure bearing device having a full-fill structure and capable of discharging air bubbles from the lubricating oil after it is charged into the bearing device, as well as air bubbles appearing in the oil due to cavitation in handling. Thrust and radial bearing sections are configured within bearing clearances in between the rotor, the shaft, and a shaft-encompassing hollow bearing member. A communicating passage enabling the oil to redistribute itself within the bearing clearances is formed in the bearing member. At least one ray-like groove that reaches from the radially inward edge of dynamic-pressure-generating grooves in the thrust bearing section to the rim of the shaft-encompassing hollow is furnished in the bearing member. When the motor rotates the air bubbles are stirred and minced by the ray-like groove, and migrate toward release at the single oil-air interface.

Abstract translation: 主轴电动机利用具有全填充结构的动压轴承装置，并且能够在润滑油装载到轴承装置中之后从润滑油中排出气泡，以及由于处理中的空化而出现在油中的气泡。 推力轴承和径向轴承部分配置在转子，轴和包含轴的中空轴承部件之间的轴承间隙内。 在轴承构件中形成有使油能够在轴承间隙内重新分布的连通通道。 至少一个从止推轴承部分的动压产生槽的径向向内的边缘到包围轴的中空部分的轮缘的至少一个射线状槽被设置在轴承部件中。 当电动机旋转时，气泡被射线状槽搅拌并切碎，并在单一油 - 空气界面处向释放状态迁移。

公开(公告)号：US07831949B2

公开(公告)日：2010-11-09

申请号：US11819573

申请日：2007-06-28

Applicant: Shinya Tokunaga ,  Mitsumi Ito ,  Nobufusa Iwanishi ,  Koichi Seko ,  Hiroaki Suzuki ,  Hiroyuki Tanaka ,  Yuichi Nishimura ,  Kazuhiko Fujimoto

Inventor： Shinya Tokunaga ,  Mitsumi Ito ,  Nobufusa Iwanishi ,  Koichi Seko ,  Hiroaki Suzuki ,  Hiroyuki Tanaka ,  Yuichi Nishimura ,  Kazuhiko Fujimoto

IPC: G06F17/50

CPC classification number: G06F17/5068 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/49112 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: To provide a method of designing a semiconductor integrated circuit with a high workability also in an increase in a scale of an LSI and an enhancement in an integration and designing a semiconductor integrated circuit system in which an unnecessary radiation is reduced and which is excellent in a heat characteristic, a reverse design flow to that in the conventional art is implemented, and a mounting substrate such as a printed-circuit board is first designed and a package substrate for mounting an LSI is designed based on a result of the design of the mounting substrate, and a layout design of the LSI to be mounted on the package substrate is then carried out.

Abstract translation: 为了提供一种设计具有高可加工性的半导体集成电路的方法，同时也增加了LSI的规模，并提高了集成度，并设计了一种半导体集成电路系统，其中不必要的辐射被减少，并且在 热特性，实现了与传统技术相反的设计流程，并且首先设计诸如印刷电路板的安装基板，并且基于安装的设计结果设计用于安装LSI的封装基板 然后执行基板和要安装在封装基板上的LSI的布局设计。

公开(公告)号：US07380989B2

公开(公告)日：2008-06-03

申请号：US10908113

申请日：2005-04-28

Applicant: Itsuo Murata ,  Harushige Osawa ,  Ming Feng ,  Shinya Tokunaga

Inventor： Itsuo Murata ,  Harushige Osawa ,  Ming Feng ,  Shinya Tokunaga

IPC: F16C33/02 ,  F16C33/06

CPC classification number: G11B19/2018 ,  F16C17/107 ,  F16C33/103 ,  F16C33/107 ,  F16C2370/12 ,  H02K7/085

Abstract: In a radial minute gap between a substantially columnar shaft and an inner peripheral face of a substantially cylindrical sleeve, oil is retained and a radial dynamic pressure bearing is formed. A plurality of recessed portions are arranged in a circumferential direction on at least one of an outer peripheral face of the shaft and the inner peripheral face of the sleeve and a first hill portion is provided to an axial end portion of each the recessed portion. Thus, it is possible to achieve a dynamic pressure bearing with which sufficient radial shaft support can be obtained in spite of a short axial length.

Abstract translation: 在基本上圆柱形的轴和基本圆柱形套筒的内周面之间的径向微小间隙中，保持油并形成径向动压轴承。 在轴的外周面和套筒的内周面中的至少一个上沿圆周方向布置有多个凹部，并且在每个凹部的轴向端部设置有第一山丘部。 因此，可以获得尽可能短的轴向长度可获得足够的径向轴支撑的动压轴承。