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公开(公告)号：US20220216243A1
公开(公告)日：2022-07-07
申请号：US17701961
申请日：2022-03-23
发明人： Shunpei YAMAZAKI , Yasuharu HOSAKA , Satoru IDOJIRI , Kenichi OKAZAKI , Hiroki ADACHI , Daisuke KUBOTA
IPC分类号： H01L27/12 , H01L21/683 , H01L29/66 , H01L29/786
摘要： A peeling method at low cost with high mass productivity is provided. A resin layer having a thickness greater than or equal to 0.1 μm and less than or equal to 3 μm is formed over a formation substrate using a photosensitive and thermosetting material, a transistor including an oxide semiconductor in a channel formation region is formed over the resin layer, the resin layer is irradiated with light using a linear laser device, and the transistor and the formation substrate are separated from each other. A first region and a second region which is thinner than the first region or an opening can be formed in the resin layer. In the case of forming a conductive layer functioning as an external connection terminal or the like to overlap with the second region or the opening of the resin layer, the conductive layer is exposed.
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公开(公告)号：US20200251547A1
公开(公告)日：2020-08-06
申请号：US16856139
申请日：2020-04-23
IPC分类号： H01L27/32 , H01L51/00 , H01L51/56 , H01L51/52 , H01L27/12 , H01L29/24 , H01L29/66 , H01L29/786 , B23K26/0622 , B23K26/04 , B23K26/06 , B23K26/08
摘要： A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.
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公开(公告)号：US20170334187A1
公开(公告)日：2017-11-23
申请号：US15610890
申请日：2017-06-01
发明人： Kayo KUMAKURA , Tomoya AOYAMA , Akihiro CHIDA , Kohei YOKOYAMA , Masakatsu OHNO , Satoru IDOJIRI , Hisao IKEDA , Hiroki ADACHI , Yoshiharu HIRAKATA , Shingo EGUCHI , Yasuhiro JINBO
IPC分类号： B32B43/00 , H01L21/67 , H01L51/56 , G02B6/00 , B26D1/04 , B26D1/00 , H01L27/32 , H01L27/12 , B32B38/10
CPC分类号： B32B43/006 , B26D1/04 , B26D2001/006 , B32B38/10 , B32B2457/00 , G02B6/00 , H01L21/67092 , H01L27/1248 , H01L27/3258 , H01L27/3262 , H01L51/56 , H01L2221/68327 , H01L2227/323 , H01L2251/5338 , Y10T156/1126 , Y10T156/1132 , Y10T156/1168 , Y10T156/1179 , Y10T156/1184 , Y10T156/1928 , Y10T156/1933 , Y10T156/1944 , Y10T156/1961 , Y10T156/1967 , Y10T156/1989
摘要： A processing apparatus of a stack is provided. The stack includes two substrates attached to each other with a gap provided between their end portions. The processing apparatus includes a fixing mechanism that fixes part of the stack, a plurality of adsorption jigs that fix an outer peripheral edge of one of the substrates of the stack, and a wedge-shaped jig that is inserted into a corner of the stack. The plurality of adsorption jigs include a mechanism that allows the adsorption jigs to move separately in a vertical direction and a horizontal direction. The processing apparatus further includes a sensor sensing a position of the gap between the end portion in the stack. A tip of the wedge-shaped jig moves along a chamfer formed on an end surface of the stack. The wedge-shaped jig is inserted into the gap between the end portions in the stack.
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公开(公告)号：US20170309731A1
公开(公告)日：2017-10-26
申请号：US15486545
申请日：2017-04-13
IPC分类号： H01L29/66 , H01L21/02 , H01L21/311
CPC分类号： H01L29/66969 , H01L21/02532 , H01L21/02609 , H01L21/02623 , H01L21/31116
摘要： A low-cost separation method with high mass productivity is provided. A first layer with a thickness of 0.1 μm or more and 3 μm or less can be formed by using a photosensitive and thermosetting material over the formation substrate, a resin layer comprising an opening is formed by forming an opening in the first layer by using a photolithography method, a silicon layer or an oxide layer is formed so as to overlap with the opening of the resin layer, a transistor including a metal oxide is formed over the resin layer, a conductive layer formed in the same manufacturing steps as the source or drain of the transistor is formed over the silicon layer or the oxide layer, the resin layer and one of the silicon layer and the oxide layer are irradiated with the laser light, and the transistor and the conductive layer are separated from the formation substrate.
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公开(公告)号：US20170133450A1
公开(公告)日：2017-05-11
申请号：US15416166
申请日：2017-01-26
CPC分类号： H01L27/3272 , B23K26/04 , B23K26/0617 , B23K26/0622 , B23K26/0643 , B23K26/0648 , B23K26/083 , H01L27/1225 , H01L27/1266 , H01L27/322 , H01L27/3244 , H01L27/3258 , H01L27/3262 , H01L29/24 , H01L29/66969 , H01L29/78603 , H01L29/7869 , H01L41/314 , H01L51/0024 , H01L51/0027 , H01L51/003 , H01L51/0097 , H01L51/5096 , H01L51/5246 , H01L51/5253 , H01L51/5284 , H01L51/56 , H01L2227/323 , H01L2227/326 , H01L2251/5338 , H01L2251/558 , Y02E10/549 , Y02P70/521
摘要： A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.
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6.发明申请公开(公告)号：US20170102598A1
公开(公告)日：2017-04-13
申请号：US15285096
申请日：2016-10-04
发明人： Masataka NAKADA , Masahiro KATAYAMA , Seiji YASUMOTO , Hiroki ADACHI , Masataka SATO , Koji KUSUNOKI , Yoshiharu HIRAKATA
IPC分类号： G02F1/1362 , G06F3/01 , G02F1/1335 , G06F3/041 , G02F1/1345 , G02F1/1333
CPC分类号： G02F1/136286 , G02F1/13338 , G06F3/0412 , G06F2203/04103 , H01L27/1225 , H01L27/124 , H01L27/1255
摘要： Provided is a novel display panel that is highly convenient or highly reliable, a novel input/output device that is highly convenient or highly reliable, or a method for manufacturing a novel display panel that is highly convenient or highly reliable. The present inventors conceived a structure including a first intermediate film, a first electrode including a region in contact with the first intermediate film, a pixel that includes a first display element including the first electrode and a pixel circuit electrically connected to the first display element, a signal line electrically connected to the pixel, and a terminal that includes a third conductive film electrically connected to the signal line and a second intermediate film including a region in contact with the third conductive film.
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7.发明申请DISPLAY PANEL, DATA PROCESSING DEVICE, AND METHOD FOR MANUFACTURING DISPLAY PANEL 审中-公开显示面板，数据处理装置以及制造显示面板的方法公开(公告)号：US20170040402A1
公开(公告)日：2017-02-09
申请号：US15221733
申请日：2016-07-28
IPC分类号： H01L27/32 , G02F1/1362 , G09G3/20 , G02F1/1335 , G06F3/01 , H01L27/12 , G02F1/1368
CPC分类号： H01L29/7869 , G02F1/133553 , G02F2201/44 , G09G3/2092 , G09G3/3648 , G09G5/34 , G09G2300/023 , G09G2300/046 , G09G2300/0465 , G09G2310/0205 , G09G2320/0242 , G09G2320/0626 , G09G2320/066 , G09G2320/0666 , G09G2320/103 , G09G2330/021 , G09G2340/0435 , G09G2360/144 , H01L27/1225 , H01L27/1237 , H01L27/124 , H01L27/1248 , H01L27/1255 , H01L27/1262 , H01L27/3258 , H01L27/3276 , H01L29/78648 , H01L29/78696
摘要： A novel display panel that is highly convenient or reliable is provided. A structure in invented which includes a first display element, a first conductive film, a second conductive film, a first insulating film, an intermediate film, a pixel circuit, and a second display element. The first conductive film is electrically connected to the first display element. The second conductive film includes a region overlapping with the first conductive film. The first insulating film includes a region located between the second conductive film and the first conductive film. The first conductive film is located between the second conductive film and part of the intermediate film. The pixel circuit is electrically connected to the second conductive film. The second display element is electrically connected to the pixel circuit. The first insulating film has an opening. The second conductive film is electrically connected to the first conductive film through the opening.
摘要翻译： 提供了一种非常方便或可靠的新型显示面板。 本发明的一种结构包括第一显示元件，第一导电膜，第二导电膜，第一绝缘膜，中间膜，像素电路和第二显示元件。 第一导电膜电连接到第一显示元件。 第二导电膜包括与第一导电膜重叠的区域。 第一绝缘膜包括位于第二导电膜和第一导电膜之间的区域。 第一导电膜位于第二导电膜和中间膜的一部分之间。 像素电路与第二导电膜电连接。 第二显示元件电连接到像素电路。 第一绝缘膜具有开口。 第二导电膜通过开口与第一导电膜电连接。
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公开(公告)号：US20160347047A1
公开(公告)日：2016-12-01
申请号：US15165099
申请日：2016-05-26
发明人： Saki Eguchi , Koichi TAKESHIMA , Hiroki ADACHI
IPC分类号： B32B43/00 , H01L21/683
CPC分类号： B32B43/006 , B32B37/003 , B32B37/22 , B32B38/10 , B32B2457/14 , B32B2457/20 , H01L21/67132 , H01L21/6836 , H01L2221/68318 , H01L2221/6835 , H01L2221/68363 , H01L2221/68381 , H01L2221/68386 , H01L2221/6839 , H01L2221/68395
摘要： A yield in a separation process is improved. A separation apparatus which enables easy separation in a large-area substrate is provided. The separation apparatus has a function of dividing a process member into a first member and a second member and includes a support body supply unit, a support body hold unit, a transfer mechanism, a direction changing mechanism, and a structure body. The structure body bonds a support body to a surface of the first member. When at least part of the process member is located between the direction changing mechanism and the structure body or the pressure applying mechanism, the shortest distance between the direction changing mechanism and a first plane including the surface of the first member is longer than the shortest distance between the first plane and the structure body or the pressure applying mechanism.
摘要翻译： 提高分离过程中的产率。 提供了一种能够在大面积基板中容易分离的分离装置。 分离装置具有将处理构件分割成第一构件和第二构件的功能，并且包括支撑体供给单元，支撑体保持单元，转移机构，方向改变机构和结构体。 结构体将支撑体结合到第一构件的表面。 当处理构件的至少一部分位于方向改变机构和结构体或压力施加机构之间时，方向改变机构与包括第一构件的表面的第一平面之间的最短距离比最短距离 在第一平面和结构体或压力施加机构之间。
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公开(公告)号：US20240057462A1
公开(公告)日：2024-02-15
申请号：US18258104
申请日：2021-12-15
发明人： Shingo EGUCHI , Hiroki ADACHI , Kenichi OKAZAKI , Yasumasa YAMANE , Naoto KUSUMOTO , Kensuke YOSHIZUMI , Shunpei YAMAZAKI
IPC分类号： H10K71/20 , H10K71/16 , H01L21/677 , G03F7/00
CPC分类号： H10K71/233 , H10K71/16 , H01L21/67706 , G03F7/0007
摘要： Manufacturing equipment of a display device that is capable of successively performing steps from formation of a pixel circuit up to formation of a light-emitting element is provided. The manufacturing equipment includes a manufacturing apparatus of a light-emitting device that is capable of successively performing a film formation step, a lithography step, an etching step, and a sealing step for formation of an organic EL element and a manufacturing apparatus for formation of a pixel circuit that drives the organic EL element. Formation from the pixel circuit up to the organic EL element can be performed successively, so that a display device with a high yield and high reliability can be formed.
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10.发明申请公开(公告)号：US20220406981A1
公开(公告)日：2022-12-22
申请号：US17772195
申请日：2020-11-09
发明人： Shunpei YAMAZAKI , Koji KUSUNOKI , Hiroki ADACHI
摘要： A display unit with a high definition is provided. The display unit includes a transistor, a light-emitting diode, a first conductive layer, a second conductive layer, a first insulating layer, and a second insulating layer. The transistor is electrically connected to the first conductive layer, and the first conductive layer and the first insulating layer are positioned over the transistor. The second conductive layer is positioned over the first conductive layer. The second insulating layer is positioned over the first insulating layer. The light-emitting diode includes a first electrode over the second insulating layer, a light-emitting layer over the first electrode, and a second electrode over the light-emitting layer. The second electrode is electrically connected to the second conductive layer. The height of a surface of the first conductive layer on the second conductive layer side is substantially the same as the height of a surface of the first insulating layer on the second insulating layer side. The first insulating layer and the second insulating layer are directly bonded to each other. The second conductive layer is positioned in an opening in the second insulating layer and is electrically connected to the first conductive layer.
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