Vertical TFT with tunnel barrier
    1.
    发明授权
    Vertical TFT with tunnel barrier 有权
    带隧道屏障的垂直TFT

    公开(公告)号:US09230985B1

    公开(公告)日:2016-01-05

    申请号:US14515054

    申请日:2014-10-15

    Applicant: SanDisk 3D LLC

    Abstract: A vertically oriented thin film transistor (TFT) having a tunnel barrier is disclosed. The tunnel barrier may be formed from a dielectric such as silicon oxide or hafnium oxide. The vertically oriented TFT selection device with tunnel barrier may serve as a selection device in a 3D memory array. The vertically oriented TFT may be used to connect/disconnect a global bit line to/from a vertical bit line in a 3D memory array. The vertically oriented TFT may be used to connect/disconnect a source line to/from a channel of a vertical NAND string in a 3D memory array. A vertical TFT with tunnel barrier has a high breakdown voltage, low leakage current, and high on current. The tunnel barrier can be at the top junction or bottom junction of the TFT.

    Abstract translation: 公开了一种具有隧道势垒的垂直取向薄膜晶体管(TFT)。 隧道势垒可以由诸如氧化硅或氧化铪的电介质形成。 具有隧道势垒的垂直取向的TFT选择装置可以用作3D存储器阵列中的选择装置。 可以使用垂直取向的TFT来连接/断开与3D存储器阵列中的垂直位线的全局位线。 垂直取向的TFT可以用于将源极线连接到/离开3D存储器阵列中的垂直NAND串的通道。 具有隧道势垒的垂直TFT具有高击穿电压,低漏电流和高导通电流。 隧道势垒可以在TFT的顶部结或底部结。

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